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Corporate Presentation A leading Reverse Logistics & - PowerPoint Presentation

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Corporate Presentation A leading Reverse Logistics & - PPT Presentation

TOTAL Solution Provider in THE Asia Pacific Mission Consistently adding value to customer by providing innovative timely and reliable Reverse Logistics Solutions Vision Global Leader in Reverse Logistics ID: 930892

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Slide1

Corporate Presentation

Slide2

A leading Reverse Logistics &

TOTAL Solution Provider

in THE Asia Pacific

Slide3

Mission

“Consistently adding value to customer byproviding innovative, timely and reliable Reverse Logistics Solutions.”Vision“Global Leader in Reverse Logistics”

Slide4

Founded

Man

PowerCore BusinessRepair , Refurbishment and Assembly : ISO 9001:2015 , ISO 14001:2015

US$ 30 Million

Company Profile

Turn Over

Certificates

Slide5

Manpower Break up R Logic India Backend Operations - Total700 +

Manpower

CountManagement8Managers15Engineers60Leaders & Technicians225

Support & Office Staff

80

Operators

320

Slide6

R-Logic Group Service Offerings

Front End Customer

Services

Service Center

Onsite Repair

Back End Repair

Service

Return to Bench (L4 repairs)

RMA / Warranty Management Services

Failure Analysis

Parts, Buffer & Scrap

Management

Parts Sourcing

Inventory mgmt.

Parts Screening

Parts Fulfillment

Administrative & Logistics Support

Data reporting

Payment Administration & Collection

Out Of Warranty quotation

Logistics support

End-to-End Reverse Logistic Solutions

Slide7

Hyderabad

Chennai

Sydney

Bangkok

KL

Singapore

JB

Shanghai

Repair Hub

Partners

First Level Centre

Indonesia

New Delhi

Mumbai

KL

JB

KPR

MSI

ASIA Pacific Coverage

Samsung Front

End, Cochin

Samsung

Front end,

Hyderabad

Front End Service Center

Bangalore

Slide8

Consumer

Brands

IT

Customers

ODM

R-Logic OEM/ODM Partners

Firewall Repairs for Flex

Israle

will be shortly supported.

Slide9

1999 R-Logic Singapore founded

2003

R-Logic ShanghaiIncorporated ISO Certified 2004R-Logic IndiaIncorporated

2006

coverage to

Australia and

Thailand

2007 coverage to

Japan

2008

R-Logic Malaysia Incorporated

Power

Supply

Tape Back Up

Hub and

Switches

LCD Display

Notebook

Printer

Memory

1999 2003

2004

2006 2007 2008

Rlogic Group Milestones

Slide10

Rlogic India Milestones

2009 HP (ODM) authorized

R-Logic (I) as LCD/Hinged up repair partner2009R-Logic (I) Dell RMSD, Mem & MB audit approved 2009Printonix and Samsung (SDC) authorized LCD repair partner2010 Sony authorized R-Logic (I

) as LCD repair partner

2011 LNT authorized

R-Logic (

I

) as LCD repair partner

2012 Breview authorized

R-Logic (

I

) as LCD repair partner

2013 BOE , Toshiba &

Samsung (SIEL) authorized LCD repair partner

Formed

global alliance

RMSD & MB

2009 2010

2011

2012 2013

Slide11

Rlogic India Milestones

2014

DELTA authorized R-Logic (I) as PSU repair partner, 2015 CISCO , K Tronics, LGE,authorized R-Logic (I) as LCD repair partner 2016 Rlogic India- Delhi operations Established, Dell E & T

2017

Benq

,

Ltech

, ECS,INTEL,VU Technologies

2014 2015

2016

2017 2018

2014

Sony authorized

R-Logic (

I

) as ASC for Walk in & onsite service centre

2014

Samsung authorized

R-Logic (

I

) as Flag Ship centre

2018 Delta Solar inverter, EMQOS Sensor ,Future Business Group, TSC

Slide12

Power

Supplies

Tablets &

Tough books

LCD / LED Panels for Note Book, TV’s . Computer Monitors, Smart phones.

Mother Boards ( Desk Top and Note Book)

Storage Units ( TBU’s, HD & ODD)

Routers & Switches

Memory

Line printers

Products

Slide13

Clean Room - Class 100 & 1000

Slide14

MSI Location

Shop Floor Bangalore

Slide15

NPI /

ECN

SAP B1 covers :ProcurementInventoryRcube

Centralized

OEM System

Updation

System Driven

Test Sequence

Live Broadcast

of Customer &

Technician KPI’s

Set & Monitor (Reports)

Customer KPI

Analyze

Inflow, Consumption,

Yield & Forecast

Configurable Repair Routing,

RLI Fault code mapping

with customer Fault code

Integrated System to

Capture NPI Information

& ECN Implementation

Employee

Management

Component Part

s

linking to Model

Invoice Generation

as per Customer

Business Logic

Automated Daily Shipment

alert to Customers &

Internal tracking Reports

Learning & Certification

management

Buffer stock & Issue management

IT system

R

-Logic

R

epair e

R

p System

Slide16

R-Logic Technology Services ( India) Pvt Ltd,

(EMS Division)……..A Start Up

Survey No 213, Gabbadi village,Kanakapura Road,Harohalli Hobbali,Ramanagara Dist, Karnataka -562112

Slide17

New Business Vertical – Forward Integration

Key Points and objectives on Forward Integration

EMS Low Volume and High Mix Manufacturing Dedicated EMS Proto Line Extended arm of the Hardware Design HousesQuick Turn around of proto and facilitate to meet on time to market beat the time pressure

Exclusivity for Proto / NPI Line and will run several iteration of the proto based on the need

Focus on OEM/ ODM requirement and flexibility in manufacturing exist.

Pilot Initial run and Low volume also catered based on the need.

Space available for the expansion.

After sales service support is core competence of R logic for a decade.

Slide18

New Factory – Foot Print

Slide19

New Factory – Foot Print

Slide20

Master List of Equipment’s- EMS Factory

Production Equipment Master List

Sl.no

Equipment Name

Make

Mode

Spec

1

Automatic PCB Loader

Suntek

MML-330

Pitch 10mm to 40mm

Adjustable Magazine

Adjustable pressure

2

Solder Paste Printing Machine

HIT

520LS

Auto laser tooling

Auto screen Adjustment

2D Solder paste inspection

3D solder paste check

Edge & Top clamping

3

Pick & Place

Mycronics

My300LX

192# 8mm feeder capacity

Intelligent feeder concept

Auto Conveyor adjustment

On the fly mount order optimization

Intelligent feeder concept

Tool collision Avoidance

Automatic feeder and component recognition

4

Reflow Oven

Heller

1826MK5

8+2 Zones

Inbuilt KIC Profiler

Board Drop sensor

Center

board support

Intelligent Exhaust system, Temp Gradient of 0.1 Degree C

5

AOI

TRITR7700QIntelligent programming interface3D solder joint inspectionMulti Phase lightingIntelligent auto conveyor system warp compensation

Slide21

Master List of Equipment’s- EMS Factory

6

X-Ray Inspection

Seamark

X-7600

Stage 360 °rotation, axis 7 linkage

Software setting voltage and current

Automatic detecting BGA soldering

Visual image navigation

7

Solder paste inspection

Genitec

GAM-70

All operation are easy and using windows interface.

Survey thickness solder by automatically.

All surveyed values can be recoded.

Calculate manufacture ability degree automatically(

Cp,Cpk,Cpm

)

8

Component counting machine

Japanies

YS-802

Full automatic counter, high accuracy, no error.

Optical fiber sensor for detecting empty components.

Optional bar scanner and code printer, convenient for component management.

Use patent reflector, humanized operation platform.

9

Solder paste mixer

Nstar

Nstar600

Running speed First times:1400RPM:the second times:400RPM

Time setting 0.1-9.9 second ,adjust 0.1S per times.

10-30 second, adjust 1.0S per times

Production Equipment Master List

Sl.no

Equipment Name

Make

Mode

Spec

Slide22

Master List of Equipment’s- EMS Factory

Production Equipment Master List

Sl.no

Equipment Name

Make

Mode

Spec

10

Dry Cabinet

Bously

AV320

Digital display for temperature and humidity.

Digital control of humidity.

Humidity Range: Available as per customer request between 1% ~ 60%RH.

The error of humidity value is 3% RH Available in Cold Rolled Steel.

ESD sage and anti corrosion coating.

Shelves adjustable on slotted columns.

11

Ultrasonic stencil cleaning

SAWA

SC5000GBS

Ultrasonic Cleaning  

12

BGA Rework Machine

SEAMARK

Bottom and Top Heater

13

Baking Oven

PSM Scientific

PSM/HAO-04

Temperature range ambient to 200

˚

C

2# Heater

2# Blower

Slide23

Master List of Equipment’s- EMS Factory

Quality Equipment Master List

Sl.No

Equipment Name

Make

Mode

Spec

1

Digital Venire Caliper 1

Mitutoyo

CD-P12"S

0~300mm

Measurement Accuracy +/-.0015"

Range 0-12 , 0-300

Display Type LCD

Resolution .0005”/0.01mm

2

Digital

Vernier

Caliper 1

Mitutoyo

CD-P12"S

0~300mm

Measurement Accuracy +/-.0015"

Range 0-12 , 0-300

Display Type LCD

Resolution .0005”/0.01mm

3

Surface Resistance Meter

Sharing Corporation

Z2032

1. Measurement Range : 10^3 to 10^11 ohms/sq, 0 – 50C

2. Measurement accuracy : Resistance 10%, Temp +2C

3. Indication : LCD backlit display

4

Digital Micrometer

INSIZE CO LTD

IP65

0-25mm

Resolution: .00005"/0.001mm. IP65 dust/waterproof. Button function: on/off, set, inch/mm, ABS/INC, data output. Data output. SR44 or LR44 battery, automatic power off.

5

Digital LCR-Q-METER-SORTER

Aplab

4912

Measurement Ranges

Test

Freqency

: 100Hz & 1KHzInductance : 0.1μH to 9999H.Capacitance : 0.3pF to 9999μF.Resistance : 0.001 ohm to 100M ohm.

Slide24

Master List of Equipment’s- EMS Factory

Quality Equipment Master List

Sl.No

Equipment Name

Make

Mode

Spec

6

Pin Gauge

Walton Trading Company

Standard Pin Gauge

0.20mm to 5.00mm

7

Digital LCR-Reader

SIBORG SYSTEMS INC.

LCRR1-SB

Test Frequency: 100Hz, 1kHz, 10kHz Test Signal Level: 0.45 +/- 5%

Vrms

Sine Wave

Basic Accuracy: 0.5% Basic accuracy

Resistance

1% R<1Ohm 0.5%

1Ohm<R <100KOhm

1% R>100KOhm

Inductance

2% L<10UH

1%10UH<L<1mH

2% L>1mH

Capacitance

2% C<100pF

1% 100pF<C400pF

2% C>100pF

8Digital Trinocular Microscop

ALMICRO

DSZ-88

10X Eye pieces

5X-45X Zoom objectives

5MP camera with PC/Laptop Interface and image capture

Slide25

Master List of Equipment’s- EMS Factory

Quality Equipment Master List

Sl.No

Equipment Name

Make

Mode

Spec

9

Surface Plate

KENCY

NA

Stone Surface Finishes

Length and Width : 630mm*630mm

Height : 80mm

10

ESD Combo Tester

STACLEAN TECHNOLOGY INDIA PVT.LTD

CT-01

Wrist Strap Range : 0.75-10Meg Ohms

Left Food wear Range : 0.75-10Meg Ohms

Right Food wear Range : 0.75-10Meg Ohms

Accuracy : +/-10%

Slide26

EMS Line Configuration

DIP/Wave soldering Line

Wave soldering JT 450W – Q4’2020

Manual Hand Soldering or Robot Selective Soldering until Q4’2020

Offline Inspection

Equipments

3D- X ray- Seamark X7600

BGA rework Machine

3D SPI – GAM70 Table Top

Ultrasonic Stencil Cleaning

Automated PCB Loader

Solder Paste Printer

Pick and Place

Reflow

AOI

HIT 520LS

MYCRONIC LX300-15

CPH 20K, Two Head

Heller MK528-

10 Zone Reflow

TRI 7700Q- 3D AOI

MML-330

Slide27

SMT

Minimum chip comp size

01 005” Maximum component size 64 x 64 mm

Maximum board handling size

457 x 450 x 6 mm

Minimum board handling size

65 x 65 x 0.3mm

Placement accuracy

0.02 mm ( Chip), 0.04 mm (QFP)

Cpk

2.0>

Rated Speed

20000 CPH

PTH

Soldering (THC and SMD)

RoHS compliant (lead free)

Manual line.

.

INSPECTION

3D Automatic

Visual Inspection (AOI)

Maximum 510x510 mm and

Minimum 50x50 mm

TESTING

Equipments and machines

Reliability Test Outsource

In Circuit Tester ( Need Basis )

Various type of Testing and debug Instrument including

LCR, CRO’s, available.

Special Process

Conformal Coating.

Manual In house and Automatic ( Outsource )

Line Technical Capability

Slide28

PCB Size

Min:50 X 50

Max: 445 X 330Magazine size460 X 400 X 563

Transfer Direction

Left to right , Right to Left

PCB Loading time

6 Seconds (Adjustable)

No of Magazine Loading

2

Selectable Pitch

10,20,30,40 mm Pitch (Adjustable)

Power Supply

AC 220V , 50HZ

Typical Features

PLC Program Control

Tower light Display for Machine Status

Selectable Pitch Setting

High Precise for Magazine Stop Position

Flexible platform to Suit Standard magazines

Pusher position Adjustable to Centre of the magazine

Soft Touch LED Membrane Control Panel

Automatic diagnosing And fault code display

AUTOMATIC PCB LOADER-SUNTEK

Machine Spec and Salient Features

Slide29

Mesh

Min Size (mm)

550*550Max Size (mm)736 * 736

PCB

Max Size (L*W mm)

50*50

Min Size (L*W mm)

610 * 450

Thickness (mm)

0.4 to 6

Max Weight

4Kg

PCB Under Clearance

14mm

Printing

Speed

1 to 300mm/sec

Pressure

4Kg to 20 Kg

Cycle Time

8 Sec

Accuracy

Alignment Repeated

±12.5µm @6

σ

Printing Repeatability

±25µm @6

σ,

Cpk≥2

SOLDER PASTE PRINTING-HIT 520LS

Ultrasonic Generator

W 255 D 360 H 161㎜ AC Cord 1.8m

Cleaning Head

W 117 D 117 H 100㎜ Cord 2.5m

Tray

W 600 D 700 H 20 ㎜

Ultrasonic

40kHz 130W

Power

AC100, 110, 120, 220., 240V ; 50/60Hz; 180VA

Weight(Generator)

9.8kg

Weight(Head)

1.3kg

Power

AC100, 110, 120, 220., 240V ; 50/60Hz; 180VA

ULTRASONIC STENCIL CLEANING-SAWA S5200GBS

Slide30

PICK AND PLACE- MY300LX-HYDRA

Machine Make And Model

Mycronic, MY300 LXPLACEMENT SPEED AND ACCURACY – MY300LX-11/15

Rated speed (1) 16 000 CPH

(1) 16 000 CPH

IPC 9850 chip net throughput

(2, 3) 13 800 CPH

IPC 9850 chip tact time

(3) 0.250 s

IPC 9850 chip repeatability 3 (X, Y, Theta) (3, 6)

45 μ

m, 1.8°

IPC 9850 chip accuracy @ Cpk = 1.33 (X, Y, Theta) (5, 7)

75 μ

m, 2.6°

IPC 9850 fine pitch repeatability 3 (X, Y, Theta) (4)

21 μ

m, 0.05°

IPC 9850 fine pitch accuracy @ Cpk = 1.33 (X, Y, Theta) (4, 5)

35 μ

m, 0.09

FEEDER CAPACITY

FEEDER CAPACITY 8 MM TAPE

192

BOARD HANDLING

Maximum board size

460 x 510 mm

Maximum board size with ML adaptor (1)

419 x 443 mm

Minimum board size

70 x 50 mm

Board thickness range

0.4–6.0 mm

Board edge clearance top and bottom 3.2 mm (0.13”)

3.2 mm (0.13”)

Top side clearance

15 mm (0.59”)

Bottom side clearance

32 mm (1.25”)

Maximum board weight

4 kg (8.8 lbs)

Board transfer height

Conforms to SMEMA standard for board transfer height.Height adjustable from 880 to 975 mm

Operation mode

Inline, manual, inline odd-board,

left-to-right¦/¦right-to-left.

VISION CAPABILITY

 

FIELD OF VIEW

MIN PITCHMIN LEAD WIDTHLeaded components80 mm (3.1”) 0.10 mm (4 mil) 0.05 mm (2 mil)Bumped components

80 mm (3.1”) 0.15 mm (6 mil) 0.08 mm (3 mil)COMPONENT RANGEHIGH PRECISION MOUNTHEAD – MIDASComponent rangeChip (from 01005), SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd shape, surface-mount connectors, through-hole components, CCGA, DPAK, Alcap, Tantalum

Component specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005) Max: 140 x 73 x 15 mm (5.51” x 2.87” x 0.59”) (1) Max: component weight: 140 g (2)HIGH SPEED MOUNTHEAD – HYDRA Z8LComponent rangeChip (from 0201), SO28, SOT223, SOJ20, PLCC32, MELF,SOD, TSOPComponent specification Min: 0.6 x 0.3 mm (0.02” x 0.01”) (0201)

Max: 8.70 x 8.70 x 5.60 mm (0.34” x 0.34” x 0.22”)ELECTRICAL VERIFIER Resistor, capacitor, unipolar capacitor, diode (forward voltage, reverse current), Zener diode (voltage drop), transistor (current gain)

Slide31

Edge Hold Conveyor System

Maximum PCB Width

22" (56 cm) Space Required Between PCB's 0.0" (0.0 cm)

Conveyor Length On-Load

18" (46 cm)

Conveyor Length Off-Load

18" (46 cm)

Heated Tunnel Length

105" (254 cm)

Process Clearance Above Mesh Belt

2.3" (5.8 cm)

Mesh Belt Pitch

0.5" (1.27 cm)

Maximum Conveyor Speed

74"/Min (188 cm/min.)

Forced Convection Zones

Top & Bottom

Top 8, Bottom 8

Heater Type

Instant response open coil

Heater Material

Nichrome

Profile Change Time

5 – 15 minutes

Temperature Control

Accuracy of Temperature Controller

±1˚C

Cross-Belt Temperature Tolerance

±2˚C

Heater Wattage Per Zone

6000 w**

Temperature Range Standard

60-350˚C

Cooling Systems

Number of Cooling Zones Standard

2

REFLOW OVEN-HELLER 1826MK5

Slide32

Items

Contents

ModelX-7600 X-RAY launching tube

Tube Type

Sealed type X-ray tube

Maximum tube voltage

130kV

Maximum tube current

0.15mA

Focal size

3 um

Magnification

Geometric magnification:150X

System magnification:1500

Detector

Image speed

35 fps

Resolution

1500*1500

Tilt angle

Stage360°rotation,Detector°Tilting,

Easily to detect the BGA soldering

Cabinet Specifications

Stage size

590mm*450mm

Dimension

L:1630mm, W :1850mm, H:1650mm

Net Weight

1400kg

Input voltage

AC 110-220V (+10%)(international general power supply)

X-ray leakage amount

≤1 u Sv/h

operating system

Windows 7

Total power

1.5Kw

X-RAY INSPECTION-SEAMARK X-7600

Slide33

AUTOMATIC OPTICAL INSPECTION TRI - TR 7700 Q

PCB & Conveyor System

Min. PCB Size50 x 50 mm Max PCB Size510 x 460 mm

PCB Thickness

0.6 - 5 mm

PCB Transport Height

880 - 920 mm

Max. PCB Weight

3 kg

Top Clearance

25 mm

BOT Clearance

40 mm

EDGE Clearance

3 mm

Pre-/Post-Reflow Inspection Functions

Component

Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift,Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component

Solder Joint

Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient

Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger

Scratch/ Contamination

Optical & Imaging System

Top View Camera

4 Mpix camera

Lighting

Multi-phase RGB+W LED, 3D Quad Fringe Pattern Projection

Optical Resolution

4 Mpix

3D Height Range

0 - 20 mm

Imaging Method

Stop-and-Go

Inspection Speed

Imaging Speed (cm2/sec)*

21.7(Depends on Size it varies)

Options

Barcode Scanner, Repair Station, Offline Editor, OCR, Yield Management System (YMS 4.0),YMS Lite, Support Pin

Slide34

SOLDER PASTE INSPECTION

Visual Range

2.5mm X 2mmFocusing powerx90Measurement Table

350 (W) X 265 (L) mm

Repeat Accuracy

± 0.0035 mm

Resolution

0.007mm

Inspection Method

Laser Vision

Computer Specification

IBM Compatiable Interface

Screen

15" LCD

Lens

Color CCD Camera

Light

LED Ring Light

Focus

Focusing Control System

Power Consumption

400VA

Power

110V,60HZ/220V,50HZ

Features

All operations are easy and using Windows interface in Chinese/English version

Survey the thickness of tin solder by Automatically

Survey the length and width manually, and the gap of tin soled

Calculate the measure of area, the measure of cross-section and the measure of volume Automatically

All surveyed values can be recorded to a file and be printed to a report

Provide the diagrams of thickness distribution and control diagrams of X_BAR_R

Calculate manufacture ability degree automatically(Cp,Cpk,Cpm)

It Can have separate record according to every ifferent production line

It can adjust focal distance in different thickness of PC boards

It can be called to sample periodically

Slide35

TECHINICALPARAMETER

Voltage

AC110V/220V, 50/60Hz(convertible)Capability5000 pcs /30s

Power

consumption

30W(2 Motors)

Counting

volume

99999 ~ 99999pcs

Size

L470*W300*H180mm

Net

Weight

10kg

Reel

Diameter

Suitable for SMD Reel with any diameter

Reel

Interval

Distance

2,4,8,10,12,16,24,32,44,56mm

Reel

Width

8,12,16,24,32,44,56mm

FEATURES

Full automatic counter, high accuracy, no error.No risk of damaging the tapes, special design to prevent SMD reel from dropping.Count forward and backward, double-checking ensures accuracy, built-in memory allows you to preset count quantity.

The counter use drafting LCD screen, easy operation, full English display.

Use patent reflector, humanized operation platform.

Optional bar scanner and code printer, convenient for component management.

English panel and user manual, easy operation and use-friendly interface.

Optical fiber sensor for detecting empty components.

COMPONENT COUNTING MACHINE

Slide36

Working voltage

AC220V(60HZ)40W

Running speedFirst times:1400RPM:the second times:400RPMSize

410*410*490MM(W.D.H)

Net weight/gross weight

40KG/45KG

setting time

0.1-9.9 second ,adjust 0.1S per times.

10-30 second, adjust 1.0S per times

SOLDER PASTE THAWING MACHINE

45X Microscope

Features

10X Eye pieces facility

5X ~ 45X Zoom objective

6V and 21 Watts incident spot light illuminator.

PC/Laptop USB Interface with Image capture facility.

 5MP Camera

Slide37

Advantages

The dehumidification unit is durable

Capable of low humidity adjustment using the humidity control with alarm monitoring system.Low power consummation with inbuilt stabilizer specification.Maintain the low humidity and normal temperature.High space storage capacity.No vibration and dust free cabinet.Features

Digital display for temperature and humidity.

Digital control of humidity.

Input supply:220V ~ 240V, 50Hz.

Humidity Range: Available as per customer request between 1% ~ 60%RH.

The error of humidity value is 3% RH (assuring set of humidity of 10%RH, then actual will be with in 7%RH ~13% RH) Available in Cold Rolled Steel.

ESD sage and anti corrosion coating.

Shelves adjustable on slotted columns.

DRY CABINET

Specification

Power Supply

220V , 50HZ Single phase

Heating Load

3 KW

Max Temp

200 Deg

Min Temp

Ambient 

No of Heaters

2

No of Blowers

2

BAKING OVEN

Slide38

Rlogic

for Electronic Manufacturing Services

Slide39

EMS Services provided & typical advantage in R-Logic

Turn Key / Job work

Competitive component Sourcing ERP-SAP in Business with SFCS ( Shop floor Control System) Product Traceability 3D X RAY For Manufacturing and also stand alone service Bonded Manufacturing facility . Import and Export is Free of Duty For Domestic , Deferral Duty at the time of removal of Goods. Import is Free of Duty PCB Assemblies Through Hole.( Operational Q4 2020) Sub-Assemblies. Complete Box Build and Testing. Environment Friendly Lead free Process. Conformal Coating ( Outsource )Services Being Extended

Slide40

Customer Care

CFT team

Centralized Documentation CenterCustomer Complaints ManagementWeekly/Monthly Quality Reporting

RMA process

Process sequence control & data integrity

MQA

(Manufacturing Quality Assurance )

Quality Plan

Process Validation

Line Qualification

First Article Inspection

Test Validation & Verification

Calibration Management

SPC , ESD & MSD Control

SQM

( Supplier Quality Management )

Supplier Selection &

Qualification

Part Development & Qualification

Supplier Training & Development

Supplier Rating

IQC

( Incoming Quality Control )

Sampling Inspection

SCAR ( Supplier Corrective Actin Request )process

Monthly Incoming Material Quality Reporting

Quality Management Systems

ISO 9001-2015 Certified

ISO14001-2004 Certified

Need to extend to EMS as New Vertical.

Key Process Quality at

RLogic

Slide41

Process

Feedback

Process FeedbackRework and InspectionRework and InspectionProcess FeedbackProcess Feedback

START

Receiving material

Incoming inspection

Material Kitting

PCB & MSD component baking if required

PCB serail# label prinitng & registration

Bare PCB Loading

Solder Paste printing TOP & Stencil cleaning

PCB Inspection

Solder paste

Inspection

F

F

P

P

Component Mounting -Pick & Place

R

Manual placement (If required) / pre reflow inspection

Reflow

P

F

AOI

F

Post Reflow Inspection

P

Process

Feedback

QA

P

F

QA Stage 1

(Sampling )

X Ray Inspec

Board / 2 Hrs

Component preparation

F

P

Manual Insertion Stage 1 ~ 7

Pre Wave Inspection

Wave Soldering

P

Pre Wave Inspection

Rework and Inspection

F

QA

F

P

F

Power On Testing main Board

DebugBOX Build Assy/ Series of Assly Ops QA Stage 2(Sampling)PFP FCT Testing Product

DebugFRework the whole lot (Z)

P PRework / Touch up

F FQC Test(Sampling)Packing-1 Gift BoxPacking-2 Master PalletisationShrink wrappingShipment EndP

Process FeedbackNote:"P" is Pass, "F" is Failed, "R" is Rework," D" is Debug and "Z" is rescreening / analysing in the above SFCA flow chart.

SOP EMS Manufacturing Process Plan with Shop Floor Controlled System(SFCS)

Implementation in Phase 2 End of 2020

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Security Systems at Rlogic

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