Executive changes Spokesperson Peter Krizan gt Tom Browder IB Chair Eunil Won gt Zdenek Dolezal Aihara san will remain as EB chair Masa Yamauchi Yoshihide Sakai Belle II Project Manager ID: 935319
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Slide1
B2GM Summary
1
Blacksburg, VA, July 4-7
Executive changes
Spokesperson: Peter
Krizan
-> Tom Browder
IB Chair:
Eunil
Won -> Zdenek Dolezal
Aihara
-san will remain as EB
chair
Masa
Yamauchi
Yoshihide
Sakai (Belle II Project Manager)
SVD
detector co-leaders (T.
Tsuboyama
, M.
Friedl
)(K. Hara, C.
Irmler
)
Computing/software
position will be modified:
“
Computing” T. Hara
,
“Software”, T.
Kuhr
New
physics co-coordinator (
Bostian
Golob
->(
P.
Urquijo
, K.
Trabelsi
)
Slide2New Belle II Members
2
Slide3Statistics
3
Slide4DEPFET Production
4
Sensor production started in July 2012
2 batches with 13 and 18 wafers
Batch 1: FOL finished,
Metal layers waiting for EMCM
Batch 2: started Feb. 2013, 18 wafers
Batch was split in 9 + 9 wafers processing fine (ahead by 21 days)
Batch 3: tailing (~ 7 steps behind)
Slide5Batch 1
faster than planned (300d/360d, can be done in 220 days) Wait for EMCM test before start of metal layer processing: 8.7.2013
Batch 2/3
another 100/120 days for FOL, will be finished well before end of 2013
Expect the first sensors to be ready in July 2014, as scheduled!
PXD9
Production
5
Calender
Days
Production steps
Split
Slide6EMCM
6
Electrical dummy: Metal layers only, to be complemented with ASICs
tests electrical functionality of the module
routing
cross talk, voltage drops, RC-delays
processing issues (shorts, interruptions)
Absolutely mandatory to test EMCM before metal processing is started.
1
st
batch of EMCMs failed because of a processing error 2
nd batch (wafers for process development) => 3 good EMCMsThey are now at IZM, Berlin for ASIC bonding.
New batch with EMCMs in production (8 x 7 ready soon)
Plan is to achieve ‘production go’ by end of September
Despite the setbacks the EMCM productions turned out to be extremely useful in order to improve our design and technology
We still have enough contingency in to meet our schedule
(first sensors ready in July 2014)
Slide7TC report (Ushiroda
-san)
7
Slide8TC Report: RVC
8
Slide9TC report: Background
9
Slide10Conclusions
10
PXD: Attendance low, finished our session in < 3h
lack of discussion on RVC and Assembly/Installation
=> need to be well prepared for BPAC
(VXD hat ~ 8h session!)
Background becomes acceptable but not enough safety margin Factor 2 is suggested
Do we have to increase the gold layer in the beam pipe ?
Belle II: change in management
collaboration still growing TOP on the critical path