date Change Version who 3262013 Updated with U2 fid positions 11 LG Sensor 00 20230 22720 PXL Ultimate1 and Ultimate2 sensor Diced Silicon Size 20240mm x 22730mm There is a uniform 10 um border around the sensor lithography ID: 232077
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Slide1
Sensor and ladder and dimensions
date
Change
Version
who
3/26/2013
Updated with U2 fid
positions
1.1
LGSlide2
Sensor (0,0)
(20230, 22720)
PXL
Ultimate-1 and Ultimate-2
sensor
Diced Silicon Size
20.240mm x 22.730mm
There is a uniform 10 um border around the sensor lithography
10 um
10 um
10 um
10 um
(-10, -10)
Dimensions are micronsSlide3
Dicing is on outer
edge of sealing lineSlide4
The engineering run will use ladders consisting of Ultimate-1 and Ultimate-2 sensors.The production detector will use Ultimate-2 sensors only.
Optical
fiducial
point locations for the Ultimate-1 and Ultimate-2 sensor are shown on the next pagesSlide5
Right side
Left sideSlide6
Right SideSlide7
Right
Side – Ultimate-1
This corner
X= 18165.075 µm
Y= 871.6 µmSlide8
Right
Side – Ultimate-2
This corner
X=
18189.175
µm
Y=
907.675 µmSlide9
Left SideSlide10
Left
Side – Ultimate-1
This corner
X= 4594.225 µm
Y= 920.775 µmSlide11
Left Side – Ultimate-2
This corner
X=
4366.6
µm
Y= 920.775
µmSlide12
Shift in fiducial location from Ultimate-1 to Ultimate-2
For the first
fiducial
at the left sideX= 4366.6 um (shift = - 227.625 um)
Y= 920.775 umFor the second fiducial
at the right sideX= 18189.175 um (shift = + 24.1 um)y= 907.675 um (shift = + 36.075 um)Slide13
Cable sizes and locations of sensorsSlide14
Ladder end detail
3.1 mm
Sensors are aligned to the upper edge of the cableSlide15
214.48 mm
1 mm gap
Low mass sensor section
Driver section
91.02 mm
Total length = 306.5 mm
Width = 24.43 mm Slide16
Joe Silber - Attached are measurements I made yesterday.
1) If I divide the total width of 10 butted sensors by 10x Leo's
nominal width (19.62mm) I get an average gap of 2um.
2) If I instead divide by the width I measured (19.607mm) then I getaverage gap of 16um.3) If I add up the worst cases of offset and rotation that I measured,then the maximum
tol envelope would be 54um.4) If I add up the stdevs on offset and rotation that I measured, then
the tol envelope should be 18um.Clearly I may be simply interpreting the edge of sensor incorrectly
due to my lighting conditions. If so, then the average gap is is tiny,2um, as in case (1). But if I am seeing things correctly on thesmartscope, then this batch of sensors were cut undersized by about
13um on average, and the correct gap to model would be more like16-18um, as in cases (2) and (4). Case (3) is essentially what Howardoriginally assumed (2 mil), but in reality it looks to me like itwould be incorrect for us to assume this worst-case placement on every
sensor.I think the bottom line is that if Leo can stomach about 100um maximumerror for wire bond alignment, then we should be fine splitting thedifference between the 2 um and 18 um numbers,
and calling the nominalgap 10um.Slide17
Gap detail
10 umSlide18
More background materialSlide19
CC - IPHC 8th March 2011 - ULTIMATE
ULTIMATE
Run SA35C11_1 # 12404
X (mm)
Y (mm)
Chip Size
20,240
22,730
Step Size
20,340
23,530
Scribeline
0,100
0,800
Possible Dies 48Slide20
CC - IPHC 8th March 2011 - ULTIMATE
Traceability – Chip NumberingSlide21
CC - IPHC 8th March 2011 - ULTIMATE
X (mm)
Y (mm)
Chip Size
20,240
22,730
Step Size
20,340
23,530
Scribeline
0,100
0,800
Possible Dies 48
Sawing Diagram