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S.Vereschagin ,  Yu.Zanevsky S.Vereschagin ,  Yu.Zanevsky

S.Vereschagin , Yu.Zanevsky - PowerPoint Presentation

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S.Vereschagin , Yu.Zanevsky - PPT Presentation

FLevchanovskiy SChernenko GCheremukhina SZaporozhets AAveryanov RampD FOR TPC MPDNICA READOUT ELECTRONICS Varna 2013 Laboratory of High Energy Physics JINR Dubna ID: 810305

fee fec switch tpc fec fee tpc switch amp readout group mpd hlt channels data pci jinr trigger prototype

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Slide1

S.Vereschagin, Yu.Zanevsky, F.LevchanovskiyS.Chernenko, G.Cheremukhina, S.Zaporozhets,A.Averyanov

R&D FOR TPC MPD/NICA READOUT ELECTRONICS

Varna, 2013

Laboratory of High Energy Physics, JINR,

Dubna

, Russia

Slide2

CONTENS1Introduction (general characteristics of TPC/MPD, & readout electronics requirements)FEE prototype (FEC-64) Main option FEE (FEC-128 & RCU)Conclusions

Slide3

General view of the MPD detector2

Slide4

TPC/MPD3

12 Readout

chambers

HV-electrode

~28 KV

Field cage

beam

beam

~110000

readout

channels

E

Slide5

Main parameters of the TPC4Size: 3.4m(length) x 2.8m (diameter);

Drift gas: 90% Ar+10% Methane CH4 or 90%Ar+10% CO2;Drift velocity: 5.5 cm/us(Ar

+ CH4), 2.3 cm/us (Ar + CO2); Length of drift volume: 1.7 m;

Data readout:

2x12 sectors (MWPC, cathode pad readout

);

Maximal

event rate 5

kHz;

Total

number of

pads

~ 110000

;

Slide6

Simulation results5

Central collision on TPC/MPD @ 9GeV

Slide7

Main parameters of the FEE TPC6Total number of channels ~ 110000

Data stream from whole TPC – 5 GB/sLow power consumption – less then 100 mW/ch

Fast optical transfer interfaceBased on ASIC and FPGA

Slide8

Front-End Electronics prototype7

FEC-64 channels

PASA chip 16 channels ASIC(

low noise amplification

of the signal

)

ALTRO chip

16

channels ASIC

(

digitization and signal processing)

FPGA - board control

Signal to noise ratio,

S/N - 30

NOISE

<

1000

e- (С=10-20

pF)

Dynamic Range - 1000 Zero suppression Buffer (4 / 8 events) FTDI USB2.0 (prototype only)

Slide9

Processing in PASA & ALTRO8

-

FWHM – 190ns

- Baseline restoration after 1

m

s:

~ 5 % in amplifier / shaper

~ 0.1% in dig. chip

PASA

ALTRO

- Baseline corrections

- Tail cancellation

FWHM ~ 190ns

Slide10

FEE TESTING9

FEE on the TPC prototype

Pulse after amplification

Slide11

FEC-64 testing software 10

Slide12

Block diagram of FEE base11

RCU

Switch 1

FEC 1

FEC 8

FEC 1

FEC 8

Switch 8

Pad Plane ~4500

ch.

128

ch.

DAQ PC

Slow

control

Group 1

Group 8

Trigger

Slide13

FEE of RoC general diagram12

RCU

FEC

group

FEC

group

FEC

group

FEC

group

FEC

group

DAQ PC

Ethernet

Slow

Control

system

Switch

Trigger System

Switch

Switch

Switch

Switch

5 Gb/s

HLT TPC

Optical interface

Slide14

TPC/MPD READOUT OUTLINE13Support high data throughput & maximum parallelization;HLT

(TPC), online reconstruction & events compression;Use GPU NVIDIA for computing trigger decision;Like ALICE, ATLAS & CBM experiments;

Slide15

DATA READOUT14

PC 1

PC 24

HLT

HLT TPC

Event builder

From other detectors

Permanent Data Storage

Online reconstruction

HLT

decision to MPD central trigger processor

Slide16

Maximum parallelization15

ROC 1TPC

FEE

HLT - TPC

GPU BOARD

PCI-E 8 Gb/s and more

MB-PC

ROC 24

TPC

FEE

FEE

PCI-E 1x

PCI-E 1x

PCI-E 1x

Slide17

Conclusions:16Prototype card has been designed 6 prototype cards has been produced & tasted

Testing software was developed (LabView & C++)Base FEE concept was developed

FEE design toward final version ongoing

Slide18

I would like to express our gratitude for the help to17 Victor

Chepurnov (JINR)

Stepan

Razin

(

JINR)

Alexander

Moskovsky

(JINR)

Luciano

Musa (CERN)

Slide19

Thank you for your attention!

Slide20

Final version of FEE

Slide21

Basic version of FEC

Slide22

Switch node

Slide23

Readout Control Unit

Slide24

Choice of FPGA technologySRAM, where the programmable switch is controlled by an SRAM memory cell.Flash (or EPROM/EEPROM), where the switch is a floating gate transistor that can be turned off by injecting charge onto the floating gate.Antifuse, where an electrically programmable switch forms a low resistance path between two metal layers.

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