RevA 1 RevA checkgt19 pages document Modification history Rev A date 4 December 2013 Rui Creation of the document 19 pages 2 RevA checkgt19 pages document ID: 296572
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Slide1
NSW Read-out spec
Rev:A
1
Rev:A ( check-->19 pages document)Slide2
Modification history
Rev: A date: 4 December 2013
Rui : Creation of the document (19 pages
)
2
Rev:A ( check-->19 pages document)
Document under the responsibility of
Rui
De Oliveira , no modification is allowed.
Any request for modification should be sent to
Rui
De Oliveira (rui.de.oliveira@cern.ch) .
The active document and all the previous revisions are stored in TE/DEM/EM/PMT data base.
I
f you use this document for production purpose please contact
Rui
de Oliveira to know the active version.Slide3
Chapters
1/Process description
2/PCB detailed description3/Flex description4/Gluing description
5/Pillar
creation
6/files
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Rev:A ( check-->19 pages document)Slide4
Chapter1:
Process description
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5
PCB + readout strips
50um
Kapton
+ resistive strips
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6
PCB + readout strips
50um
Kapton
+ resistive strips
25um Glue
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7
PCB + readout strips
50um
Kapton
+ resistive strips
25um Glue
Isostatic
Gluing
Rev:A ( check-->19 pages document)Slide8
8
PCB + readout strips
50um
Kapton
+ resistive strips
25um solid Glue
High temp Gluing
Pillars creation
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Chapter 2:
PCB detailed description
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PCB + readout strips
PCB:
-
2250mmx
500mm ????
-single side
-0.5mm thick +/- 10%
-17um thick copper
-120um min line and space
-NI/Au or Ag plating on connector fingers
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Base material, when used, shall be flame retardant rated UL 94V-0 laminate glass
fiber
epoxy and conform to L94
according to IPC-4101/94. Copper shall be type H with pits and dent, class B. When procuring base material the
following are required: minimum TG 170°C, minimum TD(5%) 350°C, minimum T-288 35min, maximum Z-axis
thermal expansion coefficient above TG 280PPM/°C (alternatively Z-axis thermal expansion coefficient between
50-260°C of 3.5% maximum is acceptable)
Fabrication and inspection shall be according to IPC-6011 and IPC-6012, class 2
Acceptance of finished printed boards shall be in accordance with IPC-A-600, class 2Slide11
Chapter 3:
Flex description
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50um
Kapton
+ resistive strips
Flex:
-
2250mmx
550mm ?????
-single side
-50um thick +/- 1um
-silk screen printed or deposited resistor on top
-
Kapton
HN substrate
-400um min line
-100um min space
- Visual inspection IPC-A-600 Class 2
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Chapter 4:
Gluing description
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Gluing Stack up
SS main spacer 2mm mini
Pacopad
Aluminium 0.3mm
Pacothane
Flex
25um glue (
Krempel
Akaflex
CDF 25)
PCB
Pacothane
Aluminium 0.3mm
Pacopad
SS main spacer 2mm mini
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Gluing parameters
Pressure: 30kg/cm2
Ramp up temp: max 10deg/minPolymerization time and temp: 45 min @ 170deg
Ramp down temp: max 10deg/min
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Chapter 5:
Pillar creation
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Pillars:
-
300um pillars diameter
-128um +/- 2um height
-2 layers of
Pyralux
PC 1025
-Final curing min
160deg
1 Hour
-Ramp up curing : max 50
deg
/ hour
Rev:A ( check-->19 pages document)Slide18
Chapter
6:Files
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Files
Top copper strips:
XxxxXxxxKapton
area:
Xxxx
xxxx
Resistive layer:
XxxxXxxxPillar layer:
Xxxx
Xxxx
Cutting file:
Xxxx
Xxxx
Drilling file:
Xxxx
Xxxx
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