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A 50 m x50 m   pixel:  floorplan A 50 m x50 m   pixel:  floorplan

A 50 m x50 m pixel: floorplan - PowerPoint Presentation

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Uploaded On 2018-03-20

A 50 m x50 m pixel: floorplan - PPT Presentation

status A Mekkaoui A 50 m X50 m Pixel current status VDDA VDDD GND D GNDA A 50 m X50 m Pixel Global pins VDDA VDDD GND D GNDA Analog Bias and global Control M6 shielded with M5 next slides ID: 658900

50mx50m pixel config control pixel 50mx50m control config bloc analog global interface memory digital local bias top system location

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Presentation Transcript

Slide1

A 50mx50m pixel: floorplan statusA. MekkaouiSlide2

A 50mX50m Pixel :current status

VDDA

VDDD

GND

D

GNDA

Slide3

A 50mX50m Pixel : Global pins

VDDA

VDDD

GND

D

GNDA

Analog Bias and global Control: M6 shielded with M5 (next slides)

Power: AP//M9//M8 Slide4

A 50mX50m Pixel

: local Pins

Digital Bloc starts here

Local configuration bits: M2 x8 ; M3 x1; (M1 thru M3 is possible)

Access is at the boundary of the analog cell. No pin pickup inside the analog

Discriminator output M2 (M1 thru M3 is possible).

Needs to be immediately inverted!HitEnable and HitOrEnable config bits delegated to the logic.Slide5

A 50mX50m Pixel : Floor Plan

No switching activity allowed:

Config

bloc

Analog Frontend

No switching activity allowed:

Config blocHit InterfaceSlide6

A 50mX50m Pixel : Floor Plan

Hit InterfaceSlide7

A 50mX50m Pixel : Some Metal Restriction

Dynamic global signals => M7

M5/M4 forbidden in the green areas

Metal restrictions will be finalized when the digital powering strategy is finalized (AP -> M1

vias

problems). In progressSlide8

A 50mX50m Pixel : Symbol

Local

config

(M2)

Symbol pin position reflect layout location !

Global bias & Control (M6)1 Glorious outputSlide9

A 50mX50m Pixel : Preparing to deliver a bloc that is compatible with automatic tools. We need to formally embed the required restrictions in the design for a Digital on Top methodology.

A design guidelines/requirements document is needed. This is in progress. To enrich the discussion I have uploaded a crude document (with comments form Dario and

Tomek

) to the

indico page.Slide10

Now A different topic. Easing TOP integration and preapring for a smart redaout chip

Snapshot from FEI4

Main Memory

Huge number of lines to distribute to “remote” location

Hard to distribute and shield. Suboptimal layout Not easy to be part of an automated system

A distributed memory system using common address, data and control lines is preferred. (modular, scalable, easy to simulate with analog)Every Programmable entity (Bias DAC, PLL config, Iref, …..) would be have a predesigned common bloc or sub-bloc (4bit instead of 8 bit).Slide11

Easing TOP integration and preapring for a smart redaout chip: Standardized interface .Address buss (8)

Data Bus (8)

Control bus (3)

DAC1

DAC2

PLL

XXXX

Interface + memory

DAC proper

Control

Operation on CLK edge

000

Shift R

001

Read

010

Write

011

Set

100

Reset

101

Increment

110

Decrement

111

Shift

L

clock

Example of control table

Main target are the slow configuration, but could be used to take a snapshot of dynamic signals

Will ease automatic testing and optimization

Not all blocs need to implement all the control!Slide12

Conclusion