/
Tack Tack

Tack - PowerPoint Presentation

celsa-spraggs
celsa-spraggs . @celsa-spraggs
Follow
386 views
Uploaded On 2017-08-20

Tack - PPT Presentation

Acky Uyeda School of Information Science JAIST Ishikawa Japan Ohmic contacts on diamond semiconductor devices tueeedajaistacjp TTI2013Italy 30 th Jul2013 Collaboration ID: 580632

results term diamond dft term results dft diamond semi cohesion metal 221 ohmic energies pseudo amp pbe conductors potential size high conductor

Share:

Link:

Embed:

Download Presentation from below link

Download Presentation The PPT/PDF document "Tack" is the property of its rightful owner. Permission is granted to download and print the materials on this web site for personal, non-commercial use only, and to display it on your personal computer provided you do not modify the materials and that you retain all copyright notices contained in the materials. By downloading content from our website, you accept the terms of this agreement.


Presentation Transcript

Slide1

Tack

Acky

Uyeda

School of Information Science,JAIST, Ishikawa, Japan.

Ohmic contacts on diamond semi-conductor devices

tueeeda@jaist.ac.jp

TTI2013@Italy, 30

th

Jul.2013 Slide2

Collaboration

with Kenya/

Eldoret

Group Prof. N.W.

Makau, Prof. G.O. Amolo,

and Mr. I. MotochiSlide3

Background

New Generation

Semi-conductors

Power

semi-conductors

Diamond semi-conductor!(

c.f,, Si for processors etc.)

AC/DC conversion, High frequency signal processing, etc.

(

SiC

,

GaN

,

Diamond

; wide-gap)

Si,

GaAs

,

InP

Frequency

Power

GaN

SiC

Diamond

→High Power, High Freq.,

→Easy to chilled due

to

heat conductivitySlide4

How to fabricate

Ohmic Contact

Required Properties

Ohmic

barrier・Difficult to be peeled.

Motivation

 Except

Si

,

 

the process NOT established.

Preventing

Schottky

junction

(bring about rectification)

For new semi-conductors, ...

Try & Error such as scratching surfaces..Slide5

Which kind of metal used?

S

urface termination for dangling bonds

- Tighten the bonding between Electrode & Slab.

What is clarified

Au, Ta, Ti, ...

Diamond

metal

- Introducing carrier to make N/P semi-conductorSlide6

Project Here

By using

DFT/

QMC,

Robustness against peeling・Ohmic property

Our Conclusion so far

Ta

with

Oxygen

-termination gives

d

eepest cohesion with

Ohmic

property.

→ Surface Cohesive energies.

→ DOS between Gap.

DOS of Diamond bulkSlide7

Cohesive Energy

x =

Ti

,

V

, Ta

, and Au, Pd

Oxygen

,

Hydrogen

or

Without

Slab

Parent Surface

Diamond

metal

metal

metal

Atom

DiamondSlide8

Method

DFT study

QUANTUM ESPRESSO

(PW basis)

XC

functionals

; PBE or LDA

Pseudo Potentials;

UltraSoft

&

NormConserving

(NC)

(Trail-Needs)

Structure Optimization; by PBE (both

Ultrasoft

, NC) Slide9

DFT

PBE

・ultra-soft

pseudo potential

・variable cell relaxed

Results

Dotted lines ;

Motochi's

previous work

(predicting V as best)

→ Present results predict Ta is best.Slide10

Results

Motochi's

previous work ;

V is best

Present results ;

Ta is best

.

cutt

off energy

37

[

Ry

] →

90

[

Ry

]

k-point

4x4x1

14x14x1 Slide11

DFT

LDA

・Ultra-soft

pseudo potential

Results

From now,

sticking to Ta & V

cases.

LDA doesn't change the trend.Slide12

In-gap state

Ta

with

Oxygen

termination

Valenve

bondSlide13

DFT

Norm Conserving

pseudo potential

Results

PBE

NC-

pp

evaluation also predict Ta as best.Slide14

Results

V

; 3s

(2

) 3p(6) 3d(3)4s(2)

Ta ; 5s(2) 5p(6)

5d

(3)6s(2)

Ta without semi-core elec.

Now the evaluation using the same core-size in progress...

But we expect Ta will get more cohesive energy

NC-

pp

evaluation also predict Ta as best.

We note that..

.

Different core sizes for V and Ta for NC-PP.

N.B.) similar elec.

config

. for V and Ta.

(

≒ not changing the conclusion)Slide15

Results

"CASINO"

DMC calculations

<Ta> w/o

term'd

H-

term'd

O-

term'd

221 -3.6878(4) -3.6499(4)

-3.7898(4)

441 -3.8571(4)

-

3.6124(4)

(

in_Progress

)

<V>

221 -0.34532(3) -0.3131(2) -0.36244(6)

441 -0.3808(5) -0.3023(6)

(in_Progress

)

system size

Cohesion energies in

hartree

.

<Ta> w/o term'd H-term'd O-term'd

221 -0.48060 -0.66995 -0.61163441 -0.58996 -0.85234 -0.81761<V>

221 -0.22537 -0.28249 -0.24647441 -0.35067 -0.39617 -0.36941

DFT calculation(NC PP)Slide16

Results

"CASINO"

DMC calculations

<Ta> w/o

term'd

H-

term'd

O-

term'd

z

221 -3.6878(4) -3.6499(4)

-3.7898(4)

<V>

221 -0.34532(3)

-

0.3131(2)

-

0.36244(6)

system size

Cohesion energies in

hartree

.

<Ta> w/o term'd H-

term'd O-term'd

221 -0.48060 -0.66995 -0.61163

<V>221 -0.22537 -0.28249 -0.24647

DFT calculation(NC PP)Slide17

Results

Cohesion energies in

hartree

.

c

oh_E(hta221)= -68.09176 - ( -58.06663 + 2*(-3.18760)) = -3.64993coh_E(hta221)=

-68.16341 - ( -58.04167 + 2*(-4.82057)) = -0.48060

coh_E

(ota221

)=

-98.92987 - ( -88.76489 + 2*(

-3.18760

)) = -3.78978

coh_E

(ota221

)=

-99.12718

- ( -

88.81609 + 2*(-4.82057)) = -0.66995coh_E(xta221)= -66.82612 - ( -56.76308 + 2*(-3.18760)) = -3.68784coh_E(xta221)= -67.02145 - ( -56.76868

+ 2

*(-4.82057)) = -0.61163

Comparing DFT and QMC

QMC cohesion data

DFT cohesion data