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Automatic Die Placement and Flexible I/O Assignment in 2.5D Automatic Die Placement and Flexible I/O Assignment in 2.5D

Automatic Die Placement and Flexible I/O Assignment in 2.5D - PowerPoint Presentation

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Uploaded On 2016-06-03

Automatic Die Placement and Flexible I/O Assignment in 2.5D - PPT Presentation

Daniel P Seemuth Prof Azadeh Davoodi Prof Katherine Morrow University of Wisconsin Madison Dept of Electrical and Computer Engineering Background 25D Integrated Circuits Provides potential to assemble dies from multiple vendors together on a single 25D IC ID: 346625

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