Sika CorporationSikaflex 1c slApplication Instructions Construction Sika CorporationSikaflex 1CSL High Performance Self Leveling Sealant S Excellent primerless adhesion to many substrates S Passe ID: 826321
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ConstructionSika CorporationSikaflex 1c
ConstructionSika CorporationSikaflex 1c slApplication InstructionsConstructionSika CorporationSikaflex 1CSL High Performance, Self Leveling Sealant SExcellent primer-less adhesion to many substrates SPasses ASTM C920 class 25 +/- 25% movement SSelf-leveling for horizonta
l applications True-flat only, will n
l applications True-flat only, will not handle no tooling required SBubble free formulation SShore A hardness of 45-50 STack-free time of 1-2 hours SFast final cure: 3 days S10 oz & 29 oz cart, 5 gal pails SLimestoneConstructionSika CorporationSikaflex 1CSL High
Performance, Self Leveling Sealantµ
Performance, Self Leveling Sealantµ $ O O I O D W Z R U N W K D W U H T X L U H V P L Q L P X P P R Y H P H Q W D Q G K L J K H U V K R U H $ K D U G Q H V V µ 6 L G H Z D O N V D Q G G U L Y H Z D \ Vµ % D O F R Q L H V D Q G W H U U D F H V
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µ ( [ W H U L R U F R Q W U R O M R L Q W Vµ 3 O D ] D G H F N L Q Jµ 3 L W F K 3 D Q VConstructionSika CorporationSealant Installation Substrate Preparation SProper preparation will eliminate majority of installation failures Most common mode of sealant failur
e is adhesive SRemove all weak materia
e is adhesive SRemove all weak material on bonding surface of porous substrates SSurfaces must be clean, dry, and free of dew or frost SUse best practices per industry standards Porous substrate: abrasive, high pressure water (allow to dry after), grinding, wire brush No
n-porous substrate: 2 rag methodConstru
n-porous substrate: 2 rag methodConstructionSika Corporation 0 H F K D Q L F D O 0 H W K R G VSaw cut joint to provide proper width & sound joint interface.ConstructionSika Corporation 0 H F K D Q L F D O 0 H W K R G VSandblast to remove residues & provide profileConstruc
tionSika Corporation &