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RF structure production status - PowerPoint Presentation

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RF structure production status - PPT Presentation

G Riddone RF structure meeting 11112009 1 Outline Clean room and storage S Lebet Accelerating structures Manufacturing flow and status PETS Manufacturing flow and status status of RF components ID: 913764

structure 2009 meeting riddone 2009 structure riddone meeting tank disks couplers vacuum cleaning cern sealed td24 test baking machining

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Slide1

RF structure production status

G. Riddone, RF structure meeting, 11.11.2009

1

Slide2

Outline

Clean room and storage: S. LebetAccelerating structures

Manufacturing flow and statusPETSManufacturing flow and status

status of RF components

 M. Filippova, 18.11.2009

G. Riddone, RF structure meeting, 11.11.2009

2

Slide3

Accelerating structures

manufacturing flow

High precision diamond machining

Cleaning

(light etch)

Brazing of cooling circuits , tuning studs,…

(

AuCu

, 1020 °C)

Packaging and shipping

Diffusion bonding of couplers

(H

2

, 1045 °C)

Based on

NLC/JLC assembly procedure

Machining of couplers

Diffusion bonding of disk stack incl. couplers(H2, 1035 °C)

RF check and tuning

Baking

(vacuum,

650 °C, >10 d)

QC

G. Riddone, RF structure meeting, 11.11.2009

3

Slide4

Cleaning

G. Riddone, RF structure meeting, 11.11.2009

4

SLAC cleaning procedure as a baseline

For degreasing

Trichloroethane

 

at SLAC

replaced by

Perchloroethylene

CERN proposal:

(Firm AVANTEC Performance Chemicals):- TOPKLEAN MC 20A- PROMOSOLV 71IPA

To avoid the solution entering the tuning holes

CERN proposal:

screws with O-rings Tool for holding the disks

Adopted from TD24 at 12 GHz

Slide5

Diffusion bonding

G. Riddone, RF structure meeting, 11.11.2009

5

1045 °C, 2 h

H

2

pure

bonding, ~

4 bar

couplers

Couplers + disks

1020

°C,

1.5

h

Slide6

Baking

G. Riddone, RF structure meeting, 11.11.2009

6

J. Wang

Slide7

G. Riddone, RF structure meeting, 11.11.2009

7

From Juwen:

- The vacuum baking has been completed for two TD18 structure.

One with SLAC flanges filled with nitrogen is installed on a

strongback

waiting for the NLCTA schedule for high power test.

- One with KEK flanges is sealed in a clean nitrogen bag and waiting for KEK cap off flanges in order to ship to KEK.

From

Toshi:

All of the cells of C10 and T24, each in two sets, are in our hand.

The periphery parts are in production and will be delivered to KEK in a month or so. 

The company still suffers from the test cell cutting of CD10.The issue is the flatness. The company uses new (better!?) machine this time

so various procedures were changed and we are investigating those now.I still hope to finish those, CD10 and TD24, by the end of this year.

Slide8

CERN status - assembly

G. Riddone, RF structure meeting, 11.11.2009

8

11.4 GHz

Two damped accelerating structures assembled TD18 (TANK) and TD24 (TANK)

TD18- old CERN procedure

TD24 diffusion bonding, no etching – to be baked

Disks for two undamped T18 with SLAC/KEK mechanical design at CERN (

SEALED

) –

to be bonded – PRIORITY 2

Disks for

undamped T24 (SEALED) at CERN – to be bonded12 GHz Disks for two damped TD24 (TANK) at CERN for the two-beam test stand – bonded, to be baked – PRIORITY 1

Slide9

Status - machining

G. Riddone, RF structure meeting, 11.11.2009

9

11.4 GHz

Disks for two undamped

T24 smaller diameter

(45 mm, SEALED) end of Nov 2009 - VDLDisks for

two damped CD10

(vg 1.35) (80 mm, SEALED) end of Dec 2009 - VDL

TD24 sealed to be launched in fabrication

12 GHz

Disks for one undamped T24 (80 mm, TANK) – Kugler several problem of machining

Disks for two damped TD24 smaller diameter (45 mm, TANK) beginning of Dec 2009T24 sealed to be launched in fabrication (stand alone test)

Slide10

PETS with damping material – 11.4 GHz

bars

Mini-tank

Couplers

Cooling circuits (brazed)

G. Riddone, RF structure meeting, 11.11.2009

10

Slide11

PETS bars

G. Riddone, RF structure meeting, 11.11.2009

11

Length ~ 300 mm

Shape tolerance within specification -

± 7.5

m

m

Slide12

PETS main components

BarsCouplers with flanges and cooling circuits

Tank – gasketsAccessoriesDamping material (SiC)

G. Riddone, RF structure meeting, 11.11.2009

12

Slide13

Manufacturing flow 1/3

Cleaning

(light etch)

Baking

(vacuum,

T?,

time?)

QC

G. Riddone, RF structure meeting, 11.11.2009

13

PETS bars

Cleaning

(light etch)

1

st brazing (body), vacuum, 800 C QCPETS couplers

2nd brazing (flanges, cooling), vacuum, 800 C

RF check

Slide14

Manufacturing flow 2/3

G. Riddone, RF structure meeting, 11.11.2009

14

Accessories

Cleaning

(degreasing only)

QC

Tank, gaskets

Baking

(vacuum,

650 ˚C, 1-2 days)

Cleaning

(degreasing only)

QC

SiC

Cleaning

(degreasing only)

QC

Pre-fire(vacuum, 1000 C)

Slide15

Manufacturing flow 3/3

G. Riddone, RF structure meeting, 11.11.2009

15

Assembly of the

8 bars

Vacuum test

EB welding of the bars

Assembly of couplers-bars and mini-tank

EB welding of tank

Packaging (N2)

RF check

Shipping to SLAC

Proposed schedule

SiC on the critical path

(

B

oostec

at CERN on 20.11.2009)

Coupler preparation W49-50 Bar preparation W50

Tank preparation W50-51

Slide16

Conclusions

NLC/JLC technology implemented – 1st

baking very soonNew assembly procedure also for PETSMachining of damped disks: only one qualified company!

CEA/

Saclay

is trying to qualify French companies:For machining of accelerating structures, we started the qualification test with the following companies: IXMECA, MECACHROME, SAVIMEX for the machining, THALES ELECTRON DEVICES

Velizy, BODYCOTE and COVIMAG for the bonding

Possibility to contact JP companies

In parallel quadrant technology is not abandoned: good results from KERN (DE)and DPM (SP)

G. Riddone, RF structure meeting, 11.11.2009

16

Slide17

EXTRA

G. Riddone, RF structure meeting, 11.11.2009

17

Slide18

QUADRANTS - HDS

thick qualification part according to

CLIAAS300062 -

KERN

(DE)

Achieved shape accuracy ± 2.1 µm

Roughness Ra = 86 nm – 30 nm according to ISO 97

Achieved shape accuracy ± 1.3 µm

S. Atieh

G. Riddone, RF structure meeting, 11.11.2009

18

Slide19

Origins translation: X 16 µm and Z -8 µm

Shape accuracy is respected ± 2.5 µm

QUADRANTS - HDS

thick qualification part according to

CLIAAS300062 –

DMP (SP)

G. Riddone, RF structure meeting, 11.11.2009

19

S. Atieh