G Riddone RF structure meeting 11112009 1 Outline Clean room and storage S Lebet Accelerating structures Manufacturing flow and status PETS Manufacturing flow and status status of RF components ID: 913764
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Slide1
RF structure production status
G. Riddone, RF structure meeting, 11.11.2009
1
Slide2Outline
Clean room and storage: S. LebetAccelerating structures
Manufacturing flow and statusPETSManufacturing flow and status
status of RF components
M. Filippova, 18.11.2009
G. Riddone, RF structure meeting, 11.11.2009
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Slide3Accelerating structures
manufacturing flow
High precision diamond machining
Cleaning
(light etch)
Brazing of cooling circuits , tuning studs,…
(
AuCu
, 1020 °C)
Packaging and shipping
Diffusion bonding of couplers
(H
2
, 1045 °C)
Based on
NLC/JLC assembly procedure
Machining of couplers
Diffusion bonding of disk stack incl. couplers(H2, 1035 °C)
RF check and tuning
Baking
(vacuum,
650 °C, >10 d)
QC
G. Riddone, RF structure meeting, 11.11.2009
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Slide4Cleaning
G. Riddone, RF structure meeting, 11.11.2009
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SLAC cleaning procedure as a baseline
For degreasing
Trichloroethane
at SLAC
replaced by
Perchloroethylene
CERN proposal:
(Firm AVANTEC Performance Chemicals):- TOPKLEAN MC 20A- PROMOSOLV 71IPA
To avoid the solution entering the tuning holes
CERN proposal:
screws with O-rings Tool for holding the disks
Adopted from TD24 at 12 GHz
Slide5Diffusion bonding
G. Riddone, RF structure meeting, 11.11.2009
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1045 °C, 2 h
H
2
pure
bonding, ~
4 bar
couplers
Couplers + disks
1020
°C,
1.5
h
Slide6Baking
G. Riddone, RF structure meeting, 11.11.2009
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J. Wang
Slide7G. Riddone, RF structure meeting, 11.11.2009
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From Juwen:
- The vacuum baking has been completed for two TD18 structure.
One with SLAC flanges filled with nitrogen is installed on a
strongback
waiting for the NLCTA schedule for high power test.
- One with KEK flanges is sealed in a clean nitrogen bag and waiting for KEK cap off flanges in order to ship to KEK.
From
Toshi:
All of the cells of C10 and T24, each in two sets, are in our hand.
The periphery parts are in production and will be delivered to KEK in a month or so.
The company still suffers from the test cell cutting of CD10.The issue is the flatness. The company uses new (better!?) machine this time
so various procedures were changed and we are investigating those now.I still hope to finish those, CD10 and TD24, by the end of this year.
Slide8CERN status - assembly
G. Riddone, RF structure meeting, 11.11.2009
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11.4 GHz
Two damped accelerating structures assembled TD18 (TANK) and TD24 (TANK)
TD18- old CERN procedure
TD24 diffusion bonding, no etching – to be baked
Disks for two undamped T18 with SLAC/KEK mechanical design at CERN (
SEALED
) –
to be bonded – PRIORITY 2
Disks for
undamped T24 (SEALED) at CERN – to be bonded12 GHz Disks for two damped TD24 (TANK) at CERN for the two-beam test stand – bonded, to be baked – PRIORITY 1
Slide9Status - machining
G. Riddone, RF structure meeting, 11.11.2009
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11.4 GHz
Disks for two undamped
T24 smaller diameter
(45 mm, SEALED) end of Nov 2009 - VDLDisks for
two damped CD10
(vg 1.35) (80 mm, SEALED) end of Dec 2009 - VDL
TD24 sealed to be launched in fabrication
12 GHz
Disks for one undamped T24 (80 mm, TANK) – Kugler several problem of machining
Disks for two damped TD24 smaller diameter (45 mm, TANK) beginning of Dec 2009T24 sealed to be launched in fabrication (stand alone test)
Slide10PETS with damping material – 11.4 GHz
bars
Mini-tank
Couplers
Cooling circuits (brazed)
G. Riddone, RF structure meeting, 11.11.2009
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Slide11PETS bars
G. Riddone, RF structure meeting, 11.11.2009
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Length ~ 300 mm
Shape tolerance within specification -
± 7.5
m
m
Slide12PETS main components
BarsCouplers with flanges and cooling circuits
Tank – gasketsAccessoriesDamping material (SiC)
G. Riddone, RF structure meeting, 11.11.2009
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Slide13Manufacturing flow 1/3
Cleaning
(light etch)
Baking
(vacuum,
T?,
time?)
QC
G. Riddone, RF structure meeting, 11.11.2009
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PETS bars
Cleaning
(light etch)
1
st brazing (body), vacuum, 800 C QCPETS couplers
2nd brazing (flanges, cooling), vacuum, 800 C
RF check
Slide14Manufacturing flow 2/3
G. Riddone, RF structure meeting, 11.11.2009
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Accessories
Cleaning
(degreasing only)
QC
Tank, gaskets
Baking
(vacuum,
650 ˚C, 1-2 days)
Cleaning
(degreasing only)
QC
SiC
Cleaning
(degreasing only)
QC
Pre-fire(vacuum, 1000 C)
Slide15Manufacturing flow 3/3
G. Riddone, RF structure meeting, 11.11.2009
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Assembly of the
8 bars
Vacuum test
EB welding of the bars
Assembly of couplers-bars and mini-tank
EB welding of tank
Packaging (N2)
RF check
Shipping to SLAC
Proposed schedule
SiC on the critical path
(
B
oostec
at CERN on 20.11.2009)
Coupler preparation W49-50 Bar preparation W50
Tank preparation W50-51
Slide16Conclusions
NLC/JLC technology implemented – 1st
baking very soonNew assembly procedure also for PETSMachining of damped disks: only one qualified company!
CEA/
Saclay
is trying to qualify French companies:For machining of accelerating structures, we started the qualification test with the following companies: IXMECA, MECACHROME, SAVIMEX for the machining, THALES ELECTRON DEVICES
Velizy, BODYCOTE and COVIMAG for the bonding
Possibility to contact JP companies
In parallel quadrant technology is not abandoned: good results from KERN (DE)and DPM (SP)
G. Riddone, RF structure meeting, 11.11.2009
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Slide17EXTRA
G. Riddone, RF structure meeting, 11.11.2009
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Slide18QUADRANTS - HDS
thick qualification part according to
CLIAAS300062 -
KERN
(DE)
Achieved shape accuracy ± 2.1 µm
Roughness Ra = 86 nm – 30 nm according to ISO 97
Achieved shape accuracy ± 1.3 µm
S. Atieh
G. Riddone, RF structure meeting, 11.11.2009
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Slide19Origins translation: X 16 µm and Z -8 µm
Shape accuracy is respected ± 2.5 µm
QUADRANTS - HDS
thick qualification part according to
CLIAAS300062 –
DMP (SP)
G. Riddone, RF structure meeting, 11.11.2009
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S. Atieh