PPT-A Low Mass On-chip Readout Scheme for Double-sided Silicon

13th February 2013 C Irmler T Bergauer A Frankenberger M Friedl I Gfall A Ishikawa C Joo DH Kah R Kameswara KH Kang E Kato G Mohanty K Negishi Y Onuki N Shimizu . Silicon IC Chip (inverted) Metal solder bumps sources detectors Optical signals chip-to-chip interconnects Optical signals on-chip interconnection Multichip Module Substrate Conventional metal in Localisation. using. MAX-SAT & Backbones. Georg Weissenbacher. Charlie . Shucheng. Zhu, . Sharad. . Malik. Princeton University. (Photo: Intel Press Kit). Where did things go wrong?. Intel Pentium FDIV Bug 1994. Localisation. using. MAX-SAT & Backbones. Georg Weissenbacher. Charlie . Shucheng. Zhu, . Sharad. . Malik. Princeton University. (Photo: Intel Press Kit). Where did things go wrong?. Intel Pentium FDIV Bug 1994. GigaTracKer. Hybrid Module Manufacturing. Fraunhofer Institute . for. . Reliability. . and. . Microintegration. Gustav-Meyer-Allee 25. 13355 Berlin. Germany. Dipl.-Ing. Thomas Fritzsch. Contact. : thomas.fritzsch@izm.fraunhofer.de. Adil Kidwai. Intel Corporation, Hillsboro. Outline. Motivation – product targets. Architecture . overview – Single-chip . WiFi. Issues and Mitigation Techniques. Multi-standard coexistence in Single-chip. : MPGD related Electronics. Tue. Oct. 14. th. 9:00 to 12:00. W. . Riegler, M. Campbell, . CERN. . 2. nd. RD51 Collaboration Meeting. Paris, Mon. Oct 13. th. to Wed. Oct. 15. th. . 2. Agenda. 09:00. IP65 dustproof transit monitor. Product Information. Model: NIOD-700P-700. Features . 70” 700cd, Double-sided outdoor dustproof digital monitor. Anti-reflection tempered, vandal proof glass. Outdoor weather proof: -30C to 50C. Introduction:-. Electronics without silicon is unbelievable, but it will come true with evolution of diamond or carbon chip. . Silicon disadvantages:- . >bulk in size. >slow operating speed. hadrontherapy. applications – BG/PV group . L. Ratti. Università degli Studi di Pavia and INFN Pavia. INFN Bologna, . J. une 14. th. 2012. 2. (What might be the) Purpose of the experiment. Take advantage of the expertise and knowledge gained in the design of silicon pixel detectors for HEP (low noise electronics, fast readout architectures and DAQ) and in the use of advanced technologies (monolithic sensors, nanometer CMOS, vertical integration, quadruple well, active edge planar and 3D sensors) to develop high performance instrumentation for applications to photon science and . Yoshiyuki . Onuki. On behalf of . BelleII. /SVD collaboration. University of Tokyo/. Kavli. IPMU. 1. 2013/9/3. 9th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Hiroshima, Japan. microelectronics group . Ecole. Polytechnique CNRS/IN2P3 , Palaiseau (France). 02 / 02 / 2014 - . HGC4ILD Workshop. 2. ROC chips for ILC prototypes. ROC chips for . technological prototypes. : to study the feasibility of large scale, . Extended AbstractMass Spectrometry 2017Knudsen cell applied to the investigation of organometallic precursors vapors-Ioana Nuta-Orleanss UniversityAbstractIntroduction In the field of microelectronics D.Braga. , . M.Prydderch. (STFC RAL). G.Hall. , . M.Pesaresi. , . M.Raymond. (IC). WIT2012 Workshop on Intelligent Trackers, Pisa 04 May 2012. 2. Outline. Module and data readout for Phase-II upgrade of CMS Outer Tracker. a. status report. Leif Jönsson. Collaboration meeting. Santander 31.5.2016. February 2014: First . fully bonded carrier board . ready.. . . Problems with the epoxy material for the protecting glob and the flatness of the surface..