PDF-Sputtering (cont.) and Other Plasma Processes

Author : lois-ondreau | Published Date : 2015-10-30

Sputtering Summary149 Create an ionic plasma by applying a high voltage to a glow tube149 Ions bombard the target material at the 149 Target atoms are ejected sputtered

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Sputtering (cont.) and Other Plasma Processes: Transcript


Sputtering Summary149 Create an ionic plasma by applying a high voltage to a glow tube149 Ions bombard the target material at the 149 Target atoms are ejected sputtered from 149 Sputter. (PVD and CVD). 1. Plan of presentation. Deposition methods. . CVD(. . Chemical . Vapor . Deposition) . . PVD ( Physical . Vapor . Deposition. ). Principles, processes on . the surface . . 2. Chapter 7-2: Instabilities II. Yosuke Mizuno. Institute of Astronomy. National . Tsing-Hua. University. Table of contents. (last week). What is the instability? (How to analyze the instability). Rayleigh-Taylor instability. J. Komppula. &. JYFL . ion source . group. University of . Jyväskylä. Department . of . Physics. Finland. Motivation. Diagnostics challenging. Experimental plasma parameters. R. i. . =. . n. e. R. . P. . Doerner. , D. . Nishijima. , T. Schwarz-. Selinger. and members of the PISCES Team. Center for Energy Research, University of California – San Diego, USA. Work performed as part of. :. . fast.  . production. Atsuhiko. Ochi. 1. , Yasuhiro Homma. 1. , Tsuyoshi Takemoto. 1. , Fumiya Yamane. 1. , . Satoru Yamauchi. 1. , Tatsuo Kawamoto. 2. , . Yousuke. . Kataoka. 2. , Tatsuya Masubuchi. Aaron M. Schinder, . Prof. Mitchell . Walker, . Prof. Julian . Rimoli. High-Power . Electric Propulsion Lab. Georgia Institute of Technology . 49th AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit . Micromegas. electrodes made with . sputter deposition. Atsuhiko. Ochi. Kobe University / MAMMA collaboration. 24/04/2013 RD51 mini week, WG6. High position resolution for one dimension. <100 . plasma temperature in the ~ 10 . eV. range where GROSS sputtering yield of tungsten drops to ~ 10 X greater than the required NET sputtering yield.. Reactor . divertor. lifetime ~10. 8. s requires net erosion rate of 10. for boron deposition on a CCD. Donna, et al.. 17May2013. Special thanks to Gregg . Westberg. (NIU) who is leading the effort at NIU. Goal: Deposit . 3. um of Boron-10 on the SiO. 2. surface of a CCD. eV. range where GROSS sputtering yield of tungsten drops to ~ 10 X greater than the required NET sputtering yield.. Reactor . divertor. lifetime ~10. 8. s requires net erosion rate of 10. -6. . ~ 100 X required net yield. 1Fujitsu Corp Secondary electrons produced by fast ion tracks in radioactive waste energy deposited in cells by ionizing radiation is channeled into freesecondary electrons with energies between 1 eV a. LIGO. Carmen S. Menoni. Electrical & Computer Engineering. Colorado State University. Collaborators: . Le Yang (Grad. Student), Mariana Fazio (post-doctoral student), Colorado State University. . V.A. . Gribkov. Institute . of Plasma Physics and Laser Microfusion, Warsaw, . Poland . Institution . of Russian Academy of Sciences “A.A. Baikov Institute of Metallurgy and Material Science”, Moscow, . of . plasma proteins. Dr. Sunita Mittal. ▪. Types of plasma proteins. ▪ . Characteristics of plasma proteins. ▪ . Functions . of plasma proteins. . Learning Objectives: . At the end of this lecture student should be able to describe.

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