d from IEEE ECTC 2008. 27 - 30 May 2008, Florida USA.. This material - PDF document

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d from IEEE ECTC 2008. 27 - 30 May 2008, Florida USA.. This material - PPT Presentation

Multilayered Lowk for 3DStack Packaging Applications Aditya Kumar T C Chai Lee Wen Sheng Vincent Wang Xin Lin Sandy Xiaowu Zhang C S Premchandran V Kripesh John H Lau Institute of M ID: 286262

Multilayered Low-k for 3D-Stack Packaging

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