Yan Benhammou Tel Aviv University On behalf of the FCAL collaboration From 2016 to 2019 Production of thin silicon sensors to equip a compact luminosity calorimeter Design and production of a dedicated readout chain FLAME ID: 815132
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Slide1
Task 14.3.2 Infrastructure for very compact Tungsten based calorimetry
Yan BenhammouTel Aviv UniversityOn behalf of the FCAL collaboration
Slide2From 2016 to 2019
Production of thin silicon sensors to equip a compact luminosity calorimeterDesign and production of a dedicated readout chain : FLAME Production of a 18 layers compact calorimeter
Presented in the previous talk (Marek Idzik)
13-Feb-20
WP14 face to face meeting
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Slide3March 2020
Test beam at DESY :18 thin layers calorimeterFew FLAME planes with readout and DAQ will be installed The other layers will be readout by the usual DAQ (APV+SRS)
13-Feb-20
WP14 face to face meeting
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Slide4Outlooks on the future
Upgrade of the sensors :Increase the detection surface of the detectorsDecrease guard ring surfaceEdgeless detectors
hamamatsu
The possibility of this study is driven by budget
13-Feb-20
WP14 face to face meeting
4
Slide5Outlooks on the future
Upgrade of the electronics readout:Optimization of design of the front end boards according lumical designWork on the thickness of the FEB to fit the compactness of the lumicalInternal alignment system is needed
BUDGET DRIVEN
13-Feb-20
WP14 face to face meeting
5
Slide6Outlooks on the future : goals for AIDA-innova
Upgrade on the compact calorimeter integration Increase the quality of connection between the sensor and the readout flexible PCB Connection optimization between sensors and front end boardsConnection optimization between front end boards and FPGA based DAQ
Study on the different PCB (flexible,…), front end boards, DAQ
13-Feb-20
WP14 face to face meeting
6
Slide7Outlooks on the future : application in LUXE
LUXE (Laser Und XFEL Experiment) : electron-photon interaction using DESY facilities. LOI submitted
Thin sensors calorimeter with FLAME readout
13-Feb-20
WP14 face to face meeting
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