PPT-MonolithIC 3D

Inc Patents Pending 1 THE MONOLITHIC 3DIC A DISRUPTOR TO THE SEMICONDUCTOR INDUSTRY Agenda Monolithic 3D the emerging path for the next generation technology driver The thermal challenge and solution for the fabrication of monolithic 3D IC . Operating as a unity gain follower dc gain accuracy is 0002 typical and acquisition time is as low as 6 s to 001 A bipolar input stage is used to achieve low offset voltage and wide bandwidth Input offset adjust is accom plished with a single pin an 9257520CW Large monolithic chip with uniform emitting area of 9 mm Unencapsulated die with low pro57375le protective window optimizes optical coupling in etenduelimited applications Lumen maintenance of greater than 70 after 60000 hours Variable driv com wwwvishaycom Revision 23Feb11 Monolithic Chip Inductors ILSB0805 Vishay Dale MECHANICAL SPECIFICATIONS Solderability 90 coverage after 5 s dip in 235 57520C solder following 60 s preheat at 120 57520C to 150 57520C and type R flux dip Resistance The filter building block together with an external clock and a few resistors can produce various second order functions The filter building block has 3 output pins One of the output pins can be configured to perform highpass all pass or notch funct It uses the classical statevariable analog architec ture with a summing amplifier plus two integrators This topology offers low sensitivity of filter design parameters f natural frequency and Q to external component variations along with simultaneou It is used in conjunction with LVDTs to convert transducer mechan ical position to a unipolar or bipolar dc voltage with a high degree of accuracy and repeatability All circuit functions are included on the chip With the addition of a few external p CrosshatchBrise SoleilKaleidoscopeHarmonic Harmonic in Luniform, monolithic tile installationHarmonic in Luniform, monolithic tile installation INSPIRED. INSPIRING.The Fretwork collection brings unpre . Inc. Patents Pending. 1. THE MONOLITHIC 3D-IC. A . DISRUPTOR. TO THE SEMICONDUCTOR INDUSTRY. Agenda:. The Semiconductor future is exciting. But we are reaching an inflection point. Monolithic 3D IC – the emerging path for the next generation technology driver . . Inc. Patents Pending. 1. Precision Bonders - A Game Changer for Monolithic 3D. A . DISRUPTOR. TO THE SEMICONDUCTOR INDUSTRY. Paper 11.3 IEEE . S3S. . October . 2014. Zvi. Or-Bach. , Brian . Cronquist. monolithic concept for another monolithic concept. In a world where change is the norm, this repeated cycle of "out-with-the-old-and-in-with-the-new," is likely to increase rather than reduce pandemon for MASS HOUSING. (Rapid -Monolithic -Disaster Proof Technology). . A Game changer Technology. 1. “Sample House Constructed by using RMD Technology”. 2. What is RMD TECHNOLOGY ? . The construction process in which, . 1. Monolithic 3D-IC. Re-Inventing Wafer Scale Integration. The Cubic IC System ~ 100X Advantage. 3D Brain vs. 2D IC . (1:3,000). Jack Sun, vice president of R&D and chief technology officer at TSMC, said “to solve challenges associated with power constraint, the chip industry must "get some inspiration from the amazing human brain.”. Ivan Peric. , Roberto Blanco, Felix Ehrler, Christian Krämer, . Richard Leys, Rudolf . Schimassek. , Hui Zhang, . …. on . behalf of University of Bern, Brookhaven National . Laboratory, University . 1. Monolithic 3D Integrated Circuits. Deepak C. . Sekar. , Paul Lim, Brian . Cronquist. , . Israel . Beinglass. and . Zvi. Or-Bach. MonolithIC. 3D Inc.. Presentation at TU . Munchen. , 12. th. May 2011.