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Emerging fine-pitch bump bonding techniques Emerging fine-pitch bump bonding techniques

Emerging fine-pitch bump bonding techniques - PowerPoint Presentation

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Uploaded On 2016-02-25

Emerging fine-pitch bump bonding techniques - PPT Presentation

Sami Vaehaenen CERN PHESE LCDWG4 Vertex detector technology meeting 3September2010 1 Outline Introduction Solder bump evolution Elements amp trends Flip chip bonding Introduction ID: 231258

wafer chip bonding flip chip wafer flip bonding solder µm bump technology pitch fine assembly wafers chips pillar bumping

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