PPT-Emerging fine-pitch bump bonding techniques

Sami Vaehaenen CERN PHESE LCDWG4 Vertex detector technology meeting 3September2010 1 Outline Introduction Solder bump evolution Elements amp trends Flip chip bonding Introduction. BASE DIAMETER D is the diameter of the base cylinder from which the involute portion of a tooth profile is generated BACKLASH B is the amount by which the width of a tooth space exceeds the thickness of the engaging tooth on the pitch circles As ac CSE 781. Roger Crawfis. Bump Mapping. Many textures are the result of small perturbations in the surface geometry. Modeling these changes would result in an explosion in the number of geometric primitives.. and . Electronegativity. Presented by . Leticia Bonita Prince. Newcastle University 4. th. Year . MChem. Student. Aims of Today. Increase your understanding of bonding and electronegativity. Increase your spatial skills and awareness using software designed by the CCDC. Introduction to Chemical Bonding. Introduction to Chemical Bonding. Objectives:. Define . chemical bond.. Explain why most atoms form chemical bonds.. Describe ionic and covalent bonding.. Explain why most chemical bonding is neither purely covalent nor purely ionic.. IB Topics 4 & 14. Text:. Ch 8 (all except sections 4,5 & 8). Ch 9.1 & 9.5. Ch 10.1-10.7. My Name is Bond. Chemical Bond. PART 5: Giant Covalent Structures, Metallic Bonding & Physical Properties. Metals. Look at the Periodic Table…. 75% of elements are metals!. Metals. They can vary a lot…. General Properties of Metals. Dense. Malleable. Ductile. Good conductors of heat and electricity. Shiny Lustre. What types of things bond together?. Think-pair-share with your neighbor all of the things that bond together.. Share with entire class. What would happen if the bonds didn’t hold or were weak?. Bonding. . and Structure. IB Chemistry. Topic 4. . Bond - A force that holds . atoms . together and . makes . them . function as a . unit.. 4.1 Ionic Bonding. An . ion. is a charged particle. Ions form from atoms or from groups of atoms by . 4.4.1: Describe the metallic bond as the electrostatic attraction between a lattice of positive ions and delocalized ions. . 4.4.2. : Explain the electrical conductivity and malleability of metals. . Some listeners even assign pitch differently depending upon whether the sound was presented to the right or left ear . Pitch characterize how high or low is sound. Pitch is mainly (but not only) determent by the fundamental frequency. IoT. Platforms. Kwang-Seong. Choi. , . Haksun. Lee, Hyun-. Cheol. . Bae. , and Yong-Sung . Eom. 2014. 10. 16.. IT Materials and Components Lab.. Kwang-Seong. Choi, Slide . E. Santin. , P. . Valerio, I. . Kremastiotis. & . R. . . Ballabriga. . Sune. CLICdp. Vertex . Meeting. CERN, February 12. th. 2016. Motivation. 2. Define. the bump pads layout for the C3PD chip (based on the CLICpix2 bump pads). . application to the diagnosis of Alzheimer's disease. . from EEG. Justin Dauwels. LIDS, MIT. LMI, Harvard Medical School. Amari Research Unit, Brain Science Institute, RIKEN. June . 9. , . 2008. RIKEN Brain Science Institute. Zoonoses. . Emerging Zoonoses. . According to the WHO emerging . zoonoses. is "a . zoonosis. that is . newly recognized . or . newly evolved. , or that has occurred previously but shows an increase in incidence or expansion in geographical, host or vector range”.