PPT-ADVANCED HIGH DENSITY INTERCONNECT MATERIALS AND TECHNIQUES

DIVYA CHALLA INTRODUCTION INTERCONNECTS connect the electronic circuits on a chip for proper functionality of the IC Interconnects can be Local connections within transistors or . a Record . Power Density. Alfred . Hubler. , Department of Physics, University of Illinois at Urbana-Champaign. CNLS Seminar, . Los . Alamos National Lab, July . 30. th. , . 2013. Nano. capacitor arrays with high energy density . Proposal. Bob Ross, . Teraspeed. Labs. bob@teraspeedlabs.com. EPEPS 2015 IBIS Summit. San Jose, CA, October 28. , 2015. Draft Presented September 2, 2015 at the Interconnect Working Group. Copyright 2015 . DESIGN. - PROF. RAKESH K. JHA. . CORPORATE . INSTITUTE OF SCIENCE & TECHNOLOGY , BHOPAL. DEPARTMENT OF ELECTRONICS & COMMUNICATIONS . Chips are mostly made of wires called . interconnect.. Wires are as important as transistors. . Requirements. Chen Zhao, Frank Yang. NetApp, Inc.. Storage Interconnect Requirements. Multi-destination RMA operation with reliable unconnected transport. 2. www.openfabrics.org. Storage Interconnect Requirements. Exploring Complex Interconnect Topologies . for the Global Metal Layer. Oleg . Petelin. and Vaughn Betz. FPL 2016. Motivation – The Metal Stack. Poor wire RC scaling .  more complex metal stack. Speaker: Peipei Zhou. Student: Peipei Zhou, Hyunseok Park, Zhenman Fang, . Faculty: Jason Cong, Andre DeHon. II = 1 or not? . A new Question, II vs Energy and II > 1 . II change, what happens?. A case study of MM. Seyi. . Ayorinde. Pooja. Paul . Chaudhury. FPGA. 2. Field Programmable Gate Array. Reconfigurable Circuit. Configurable Logic Blocks (CLBs). Calhoun et al.: Flexible Circuits and Architectures for Ultralow Power. By. Dr. Raouf Mahmood . HDPE- History. In 1953, Karl Ziegler and Erhard . Holzkamp. invented high-density polyethylene (HDPE). The process included the use of catalysts and low pressure, which is the basis for the formulation of many varieties of polyethylene compounds. . Preserving the Nation’s Roadways. Kate Gasparro. Clemson University ‘14. July 25, 2012. Background. 1887 Act to Regulate Commerce. New Deal Legislation. Interstate Highway System. U.S. DOT and FHWA. I Density(D). An object’s mass compared to its volume. On Earth we can sometimes use weight for mass.. IV Density Facts. Things with . HIGH Density. : Bowling Ball Shot put. Big Marble. Things with . David Mohabir. University of Arizona. March 19. th. , 2012. Testing and diagnosis of interconnect faults in cluster-based FPGA architectures. Section 1. Motivation. Quickly identify faulty components. I Density(D). An object’s mass compared to its volume. On Earth we can sometimes use weight for mass.. IV Density Facts. Things with . HIGH Density. : Bowling Ball Shot put. Big Marble. Things with . hadrontherapy. applications – BG/PV group . L. Ratti. Università degli Studi di Pavia and INFN Pavia. INFN Bologna, . J. une 14. th. 2012. 2. (What might be the) Purpose of the experiment. Take advantage of the expertise and knowledge gained in the design of silicon pixel detectors for HEP (low noise electronics, fast readout architectures and DAQ) and in the use of advanced technologies (monolithic sensors, nanometer CMOS, vertical integration, quadruple well, active edge planar and 3D sensors) to develop high performance instrumentation for applications to photon science and . BASIC CONCEPTS OF . ADVANCED . COMPUTING TECHNIQUES. Mrs. . A. MULLAI. ASSOCIATE PROFESSOR . DEPARTMENT OF COMPUTER SCIENCE . 1. Basic concepts of Advanced Computing Techniques - Mrs. A.Mullai .