PPT-Improving 3D NAND Flash Memory Device Reliability by

Author : alexa-scheidler | Published Date : 2018-11-09

Exploiting SelfRecovery and Temperature Awareness Yixin Luo Saugata Ghose Yu Cai Erich F Haratsch Onur Mutlu HeatWatch Storage Technology Drivers 2018 2 Store

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Improving 3D NAND Flash Memory Device Reliability by: Transcript


Exploiting SelfRecovery and Temperature Awareness Yixin Luo Saugata Ghose Yu Cai Erich F Haratsch Onur Mutlu HeatWatch Storage Technology Drivers 2018 2 Store large amounts . Next-generation storage. Frank Shu. Senior Program Manager. Storage Ecosystem Technologies. Microsoft Corporation. Key Takeaways. Understand Solid State Drive . (SSD) technologies. Adopt best practices for SSD design in Windows platforms to enhance SSD performance and reliability. OutlineECC for High Reliability bpc Embedded SystemECC Requirements DensBits’ solutionUngraceful powerdownProblem definition Common solutions and DensBits’ solution Flash Memory Summit S Improving Lifetime with W rite - hotness A ware R etention M anagement Yixin Luo , Yu Cai , Saugata Ghose, Jongmoo Choi*, Onur Mutlu Carnegie Mellon University, * Dankook University WARM 1 Exec Embedded Systems . Chanik. Park, . Jaeyu. . Seo. , . Dongyoung. . Seo. , . Shinhan. Kim and . Bumsoo. Kim . Software Center, SAMSUNG Electronics, Co., Ltd. . Proceedings of the 21st International Conference on Computer . Experimental Analysis, Exploits, and Mitigation Techniques. HPCA Session 3A – Monday, 3:15 . pm. , Salon F. 128GB. NAND . Flash. 256GB. NAND Flash. NAND flash scaling: . shrink size. . of each . flash cell, . (and Security) Issues of DRAM and NAND Flash Scaling. Onur Mutlu. omutlu@gmail.com. http://users.ece.cmu.edu/~omutlu. /. HPCA Memory . R. eliability Workshop. March 13, 2016. Limits of Charge Memory. Done By: . Bashayer. Al- . Suroor. ID: 200800649. Outline:. Introduction to How Flash Memory Works. A sample list of USB . devices. USB . Interface. Flash Memory: Tunneling and Erasing. How simple is the flash memory. Chip-Off Forensic Analysis. of NAND Flash Memory Devices. Aya. . Fukami. , . Saugata. . Ghose. , . Yixin. . Luo, . Yu . Cai. , . Onur. . Mutlu. 1. Brief Summary of the Paper. Our Goal. : . Identify . Memory: Characterization. , Optimization, and . Recovery. Yixin Luo. yixinluo@cmu.edu. (joint work with Yu Cai, . Erich . F. Haratsch, Ken Mai, Onur Mutlu). 1. Presented in the best paper session at HPCA 2015. Lifetime with. W. rite-hotness . A. ware . R. etention . M. anagement . Yixin Luo. , Yu . Cai. , Saugata Ghose, . Jongmoo. Choi*, Onur Mutlu. Carnegie Mellon University, *. Dankook. University. WARM. Explain the limitations of flash memory.. Define wear leveling.. Define the term IO Transaction. Define the terms synchronous bus and asynchronous interconnect.. Explain the difference between polling and interrupts. Thesis Oral. Yixin Luo. Committee:. Onur Mutlu (Chair) . Phillip B. Gibbons. James C. Hoe. Erich F. Haratsch, Seagate. Yu Cai, SK Hynix. Presented in partial fulfilment of the requirements for the degree of Doctor of Philosophy. Jim Cooke. Director of Applications Engineering. Memory Products Group. Micron Technology, Inc.. Agenda . Mass Storage . HDD, HHD, SSD. How Flash can Benefit Drives. Hybrid, . ReadyBoost. , Robson, SSD. Lecture 5. Flash File Systems. September . 11. th. , . 2023. John . Kubiatowicz. Electrical Engineering and Computer Sciences. University of California, Berkeley. http://www.eecs.berkeley.edu/~kubitron/cs262.

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