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Emerging fine-pitch bump bonding techniques Emerging fine-pitch bump bonding techniques

Emerging fine-pitch bump bonding techniques - PowerPoint Presentation

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Uploaded On 2018-11-05

Emerging fine-pitch bump bonding techniques - PPT Presentation

Sami Vaehaenen CERN PHESE LCDWG4 Vertex detector technology meeting 3September2010 1 Outline Introduction Solder bump evolution Elements amp trends Flip chip bonding Introduction ID: 716420

wafer chip bonding flip chip wafer flip bonding bump solder µm technology pitch fine assembly wafers chips pillar pixel

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