PPT-Development of MEMS Course Content Using

LabView and Arduino DUE 1400470 Ivy Tech Northeast Engineering Andrew Bell Abstract simplified Describe three new MEMS courses that build on SCME MEMS material using LabView and Arduino Each of the courses will be taught and developed this summer over a 12 week period This poster will describe the overall course content teaching methodology and use of technology to teach MEMS Three teaching styles will be used CA classical approach lecture lab and quizzes with use of multimedia material DB discovery based with focus on labs and handson learning and IBL incremental with blended lecture and discovery based learning Our goal is to determine whether these courses can be taught online . Temperature 4 Figure 4 Scale Factor vs Temperature 4 brPage 6br Piezoelectric Plate Gyroscope Introduction Physical Description Figure 5 Cross Section of Gyroscope 8 Fabrication brPage 7br Functional Description Figure 6 Piezoelectric Plate with ort What are the main characteristics of Lemoptix MEMS mirrors What is the difference between Mechanical and Opti (. MEMS. ). MEMS. . Micro Electrical Mechanical Systems. Practice of making and combining miniaturized mechanical and electrical components. “. Micromachines. ” in Japan. “Microsystems Technology” in Europe. By Dave Brennan. Advisors: Dr. Shannon . Timpe. , Dr. Prasad . Shastry. Introduction . Part 1) Quick MEMS introduction. Part 2) Capacitive Sensing. Part 3) Goal. MEMS background. Microelectrical mechanical systems (USA), Microsystems Technology (Europe), Micromachines, Japan…etc. ON ROTATING SHAFT USING MEMS & . Iot. Single wireless triaxle Sensor. James Hofmeister, Douglas Goodman, and Robert Wagoner. 2016 Machine Failure Prevention Technology. March 23-26, 2016. Dayton, OH. www.controltrix.com. Accelerometers (acc) measure acceleration. Gyroscopes (gyro) measure angular velocity. Integrated MEMS may have 3 axis gyro + 3 axis acc. MEMS have low cost compared to other types of gyro /acc . Michael Kraft. Overview. The Fat Finger Problem. Manipulating Atoms. Manipulating Ions. Manipulating Larger . O. bjects. Probing Material at the . Nanoscale. Conclusions. The Fat Finger Problem. Macroscopic tools are often unsuitable for . by. Tim Stucchi . Sensera. Operations Manager. 2. MEMS?. . M. icro-. E. lectro-. M. echanical-. S. ystems. A technique of fabricating Electrical and Mechanical elements on a. chip with miniature dimensions. . Nov 11, 2009. Seismic Instrumentation Technology Symposium. B. John Merchant. Technical Staff. Sandia National Laboratories. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company,. EE 4611. Mark Anderson. 4/22/2015. Abstract:. This report introduces MEMS and general classifications of MEMS. Examples of MEMS devices, sensors, and applications will be . given. . along with a look at the past and a glimpse into the future of MEMS. . MEMs Sensors. Hand-held Devices. Automotive Industry. Aerospace Industry. Medical Applications. Types Of Sensors. Inertial Sensors. Gyroscopes. Accelerometers. Compass Sensor. Pressure Sensor. Microphone. . Nov 11, 2009. Seismic Instrumentation Technology Symposium. B. John Merchant. Technical Staff. Sandia National Laboratories. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company,. Micro/Nano Electromechanical Systems. Liaison Report. February . 2017. About SEMI Standards. Established in 1973. Experts from the microelectronic, display, photovoltaic, and related industries. Exchange ideas and develop globally-accepted technical standards. Abstract:. MEMS . technology consists of microelectronic elements, actuators, sensors, and mechanical structures built onto a substrate, which is usually silicon. They are developed using microfabrication techniques: deposition, patterning, and etching. The most common forms of production for MEMS are bulk micromachining, surface micromachining, and HAR fabrication.