PPT-New Capabilities for Exascale interconnects

ExaComm Workshop at ISC 2016 Dan Holmes Problem leads to Innovation leads to Complexity leads to Suffering Exascale Interconnect Capabilities Is MPI really assembly level Can we market its abstraction better. DDoS. 1. Based on the TVA paper from . Sigcomm. 2005. Enterprise . vs. wide-area . s. ecurity. Key differences in communication model. Enterprises: Default-off. SANE and Ethane make sense. Wide-area: Default-on. ExaScale. . Challenges and Potential Solutions. Bill Dally. Chief Scientist, . NVIDIA. Bell Professor of Engineering, Stanford University. Two Key Challenges. Programmability. Writing an efficient parallel program is hard. the . nature and . microfoundations. of (sustainable) enterprise performance. David J. . Teece. Shinyoung. Kim. Operations Management. What. are. Dynamic Capabilities?. Dynamic Capabilities. = Dynamic + Capabilities . Robust Integrated Systems Expertise & Resources, Inc.. Our Capabilities. Outside . Plant. Civil. . Works. Aerial & Underground Installation. Fiber Optic, Copper, Coax Installation. Pole Setting. Christopher Woodruff, University of Warwick and PEDL. Trade up and Compete Workshop. Istanbul, Turkey. May 11, 2015. Addressing constraints to SME growth. Most research focuses on supply-side constraints – capabilities. DESIGN. - PROF. RAKESH K. JHA. . CORPORATE . INSTITUTE OF SCIENCE & TECHNOLOGY , BHOPAL. DEPARTMENT OF ELECTRONICS & COMMUNICATIONS . Chips are mostly made of wires called . interconnect.. Wires are as important as transistors. . . DIVYA CHALLA. INTRODUCTION. INTERCONNECTS . connect the electronic circuits on a chip for proper functionality of the IC.. Interconnects can be . Local. . (connections within transistors) or . Intel Corporation. Workshop on Programming weather, climate, and earth-system models. on heterogeneous multi-core platforms. September 7, 2011. Opportunity of . Improving . WRF . Performance Through . Computing Applications. Mitchell Fields, Ph. D.. mitch.h.fields@avagotech.com. Page . 1. Evolution of high-bandwidth interconnects. Page . 2. Throughout history, optical interconnects were adopted when they overcame limitations of electrical signaling:. Chapter 3. Wiley Canada. 2. Learning objectives. By the time you have completed this topic you will b. e able to: . Appreciate the role of a firm’s resources and capabilities as a basis for formulating . Jacqueline Torres. Olivia Garcia. Carly. Pyle. Gabriella Cabello. Gabriel Flores. We shift our focus from the external environment to . the internal . environment. We look within the firm and concentrate our attention on the resources and capabilities that firms possess. . Ahmed . Sameh. and . Ananth. . Grama. NNSA/PRISM Center,. Purdue University. Path to . Exascale. Hardware Evolution. Key Challenges for Hardware. System Software. Runtime Systems. Programming Interface/ Compilation Techniques. K3130303129/RAJAmemory and a range of various architectures which can result in decreased productivity for library and application developers who need to write specialized so31ware for each system 30e Performance portability: An implementer’s Perspective. Versatility of HPE Cray Programming Environment (CPE). Platforms from HPE/Cray. Supported by CPE. 2. AMD CPUs and NVIDIA GPUs. AMD CPUs and AMD GPUs.