Via Lithography Conductor Trace Interconnection Test amp Inspection Value Added Reliability Hitachi Mechanical Drill Ultra high speed spindle air bearing high frequency motor enable drill small ID: 426154
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Slide1
Manufacturing Facilities Photo Tour
Via LithographyConductor TraceInterconnectionTest & InspectionValue AddedReliabilitySlide2
Hitachi
Mechanical DrillUltra high speed spindle (air bearing, high frequency motor) enable drill small φ interlayer connecting hole down to <0.075mm with high speed spindles 200,000 rpm High precision servo motorPositioning accuracy ± 0.004mmDrilled hole accuracy ± 0.015mmStraightness of X-axis 0.005mmStraightness of Y axis 0.005mmSquareness of XY axis 0.010mmSpindle run-out (statically) 0.010mm at 12.7mm from spindle noseAccuracy measurement instrument “3 dimensional coordinate measuring”
Description
CapabilitiesAspect RatioD/S
10 : 1MLB8 : 1
Laser Via
D/S100µm
MLB
150µm
Vias CapabilitySlide3
ESI
UV Laser DrillProduce high quality micro vias in small geometry circuit board with a pulse repetition frequency up to 70 KHz resulting in excellent via quality & sidewall taper leaving the via in prime condition for platingLaser blind via, through via & laser skivingTypical size 1-6 milPlacement accuracy ±20umRepeatability ±25umPunching & Trepanning modeSpiraling & Direct via formationLaser beam trajectoryProgrammable no. of revolutionFrom last viaLaser beam turn on & off
To next via
Mode: Punching & Trepanned
Mode: Spiraling & Direct via formation
skiving
Vias Capability
Description
Capabilities
Aspect Ratio
Normal
5 : 1
Via Fill
1 : 1
Laser Via
D/S
50µm
MLB
75µmSlide4
Large Window Process
Conformal Process
Resin Direct Process
Cu Direct Process
Form a bigger window than laser beam width by etching and then process resin surface
Form a smaller window than laser beam width by etching. Unnecessary beam will be eliminated by Cu
Form a via by exposured laser beam directly to resin
Apply a special surface treatment on Cu to have better absorptivity of laser beam, and then exposure laser beam directly to Cu to form a via
Hitachi
CO2 Laser Drill
Gaussian beam
Through or blind via, skiving on non re-in-force material such as Polymide, resin
Shape beam
Laser Skiving
High Peak power – better for copper drill
With 2 laser head for laser skiving and drilling
Positioning accuracy (XY) ±0.005mm
Drilled hole accuracy ±0.0125mm
Straightness of x axis 0.005mm per max. drill area
Straightness of Y axis 0.005mm per max. drill area
Squareness of XY axes 0.010mm per 580mm travel
Vias CapabilitySlide5
Orbotech
Laser Direct Imaging (LDI)Direct Imaging (DI) - a process using laser beam to imprint image directly on photo sensitive resist without photo toolLDI enabling technology process:-Dynamic registration & scaling < 2 sec on each printFine pitch patternImprove yield through accurate scalingExcellent side to side registrationHigh throughout up to 120 prints per hourUniform exposure even on non uniform surfaceCCD based registration for maximum flexibility
Non uniform surface
Layer to Layer Register
Fine Pitch Image
Description
Capabilities
Line
/ Space25 / 25µmRegistration
Accuracy±8µmLayer to Layer Registration
±15µmDepth Focus
75µm
Edge Roughness
±10µm
Transfer Image
Non Contact
Lithography CapabilitySlide6
Ono-Sokki
Semi Auto ExposeA process using 5kw short-ark lamp to imprint image directly on photo sensitive resist with photo tool set on the top acrylic plateSemi auto expose technology process enabling in:Dynamic registration & scaling < 4 sec on each printFine pitch pattern on the flat panel surfaceImprove yield through : auto alignment system with multi image processor with 4 CCD typesWith HEPA filter cooling systemPhototool alignment on acrylic plate for transferring imageDescriptionCapabilitiesLine / Space35 / 35µmRegistration Accuracy±50µm
Layer to Layer Registration
±50µmEdge Roughness
>75µmTransfer Image
Hard Contact
Lithography CapabilitySlide7
5Kw collimated light
Full automatic optical alignment 4 CCD cameras25um resolutionWith HEPA filter class 100Automa-Tech Automatic Double Sided Exposure
Description
Capabilities
Min Board Size
250*250mm
Max Board Size
610*500mm
Uniformity
≥83% for 610*500mm
Energy Density
25 mW/cm²
Registration Accuracy
±
8um (artwork to board)
Top & Bot frame Repeatability
±
3um
Collimated Angle
±
1.5°
Declination Angle
1°
Resolution
1.5 mil (F9020DF)
Lithography CapabilitySlide8
Conductor Etch Capability
Special process for etching, dryfilm stripping and chemical cleaning of single sided, double sided, multilayer and bareback panels after imaging process- To remove the unwanted copper and the remaining polymerized resist protect the desired copper circuit traces during etching processDescription
Cu Thickness (um)
Line / Space
(um)
Pad Plating
18
50 / 50
12
40 / 40
9
25 / 25
Panel Plating
70
100 / 125
35
50 / 75
18
50 / 50
Schmid
CuCI2 EtchingSlide9
GCE
Vertical Continuous Copper Plating Line (Reverse Via Fill Plating)Description
Capabilities
Min Board Size
305*500mm
Max Board Size
610*500mm
Uniformity
>90%
Speed Range
0.3-0.75/min, 48sec/pcs
Current Density
1.0
῀
4.0 ASD
Range of Plating
12 – 40 µm
Aspect Ratio (Pad / Panel plating)
2:1
Loaded
Degrease
Hot Rinse
Rinse
Microetch
Rinse2
Acid Dip
Carrier Input
Plating Input
Cu Plating
Plating Output
Carrier Output
Rinse
Auto Unloader
After Cu Plate, w. Rinse
Via Fill (Reverse)
Interconnection CapabilitySlide10
Copper Plating
Plated Through Holes Black Hole Process (standard)Electroless Copper Plating (BV + RF)Copper PlatingPads Plating / Selective PlatingPanels PlatingVia Fill PlatingBlack hole : Laser hole diameter up to 3 mils Plating :Plating with acid based.Throwing power 95% up to 120 %Via fill up to 85 % -100% filling
Interconnection Capability
Description
Capabilities
Panel Plating5 : 1
Pad Plating8 : 1
Copper Plating is process whereas a layer of copper is plated on panels surface and its hole permanently as to connect the two sides of double sides CCL, in this area the copper plating is categorized into:-
Panel Plating
Pads Plating
Via Fill PlatingSlide11
达震
Anisotropic Conductive PastePrintable anisotropically conductive paste that is most often used in low cost flip chip assembly or as a replacement for ACFcomposed structurally of fine conductive particles diffused in liquid thermosetting resinMounting does not involve the use of lead or flux
Description
Capabilities
ACP Print Tolerance
± 10 mils, 36T stencil
ACP Print Thickness
15 – 30 µm
ACP Print Area
300 * 400mm
Camera Resolution
640 *480 pixels
Camera Field of View
7.0 *5.0mm
Camera Lighting
LED
Interconnection Capability
ACP PrintingSlide12
Trimech Anisotropic Conductive FilmInterconnection CapabilityAnisotropic Conductive Film, “ACF” are well known as heat bondable adhesive interconnect material consisting of conducting particles and adhesive polymer resin in a film format and they have been widely used as interconnect material in electronics industry to make electrical and mechanical connections functionally from drive electronics to substrates by thermal bonding process; such as Flex On Flex (FOF), Flex On Glass (FOG), Flex On Board (FOB), Chip On Glass (COG), Camera Module on Substrate / Flex (CMOS)
Description
Capabilities
Heating Method
Constant Heat
Work area
180mm x 180mm
Hold Temperature
30°C - 300°C
Hold Period
0.1-25 sec @0.05 sec accuracy
ACF Delay to Peel
0 – 5 sec
ACF Width
1.5 – 8mm
ACF Placement Accuracy
X, Y = ±0.1mm
Bonding Force
2.0 – 48kgf
Heater Block Size
5 x 1.5mm (min) – 80 x 8mm (max)
Thermocouple Type
K Type
Description
Capabilities
Heating Method
Pulse Heat
Work area
420mm x 180mm
Visual Aids
CCD
Magnification
50x
Work Table Type
Rotary Table
Thermocouple Type
K Type
Pre-Laminate
Bonding
Interconnection between pad through ACF
Various Type of ACF Bond
Source: Sony ACFSlide13
In process control for Etching Imaging / Etching process, and blind via inspection
High frequency (160MHz) CCD, very high signal-to-noise ratioUnique customize lens include floating element to keep optimal performance for all magnification range OMNI light source, high intensity (5 bulbs, 250W) diffusive & reflective light. Uses custom-made mirror for wide 3-D coverage. Results in accurate line measurement of both vertical and horizontal lines and excellent detection of fine and shallow shorts. Hole algorithm enables inspection of panels with holes without masking the area around the holes and accurate holes measurement.Tight toleranceLoose tolerance
120 degree
breakage
No breakage
Hole algorithm
Orbotech
Automatic Optical Inspection (AOI)
Description
Capabilities
Technology
25µm optic technology
Max. Inspect
area
660
* 610mm
Board
Thickness Range
25
– 700µm
Inspection Method
Full reference comparison
SIP-model
based contour comparison
Specific criteria per feature
Full multiple line width measurement
Dedicated VRS with video on the AOI
VeryFine
Test & Inspection Capability
Verifier SystemSlide14
Inspection
cosmetic defect on board with coverlay laminationDetection defects such as excess coverlay, dent, oxidation, coverlay shifted, expose copperGolden board learning without Gerber transfer required Synpower Automatic Optical Inspection
Description
Capabilities
Resolution
10um / pixel
Camera
10000 pixel / 2 set
Max Board Size
200 * 330mm
Board Thickness
0.2 ~ 3.0
Camera Lighting
Fluorescent lamp + LED
Inspection Mode
Manual single type
Expose Copper
Stiffener Shifted
Oxidation
Dent
Excess Coverlay
Test & Inspection CapabilitySlide15
ViTrox
SMT Automated X-ray and Automated Optical Inspection (AOI) DescriptionCapabilitiesCamera Type4 Mega pixel digital cameraCamera Resolution19um per pixel resolutionAdjustable Camera PixelScalable from 22um to 12umX.Y. Driver Encoder Resolution1umMax Component Height Inspection41mmMin. Edge Clearance
3.5mm
Min. Component
01005Functionality
Post-reflow Inspection
Coverage: Missing offset, skewed, polarity, billboard, tombstone, lifted/bent leads, excess/insufficient solder, bridging, wrong part and traceability
Pre-reflow Inspection
Coverage: Missing offset, skewed, polarity, billboard, wrong part inspection, extra part inspection and traceability
Inspection Speed
Post-reflow:
6.5in˄2/sec (42.0cm ˄2/sec)
Pre-reflow:
8.5in˄2/sec (55.0cm ˄2/sec)
Test & Inspection Capability
In process control
SMT
Lighting system: Multiple color, multiple angle, multiple segment LED lighting head with auto calibrationSlide16
Fixtureless, with 8 active electrical probes
Non undesirable dents marks on the padContinuously threshold adjustable from 1 ohm applicable to all traceAutomatic alignment using 4 camera and electromagnetically controlled4 camera (640 *480 pixel), optical scanning of top & bottom side resolution from 12µm / pixelRepeatable accuracy ± 10µmATG Luther & Maelzer Flying Probe TesterSpring mounted on test head instead of on test probe. Spring force adjustable from 5g to 15 g and is set to 6g and equipped with soft landing feature on so that it will not cause any undesirable dent marks on the pad.Test & Inspection CapabilityDescriptionCapabilities
Smallest Pad Size
2 mil
Smallest Pitch Size
4 mil
Continuity Test
1
Ω
~
10k
Ω
Isolation Test
5M
~
10M
Ω
Max. board Size
650mm * 520mm
Max. Test Area
610mm * 460mm
Board Thickness
0.1mm
~
10mm
No of Test Head
8
No of CCD
4Slide17
Surpass
Flying Probe TesterFixture design with multi row of board testDescription
Capabilities
Smallest Pad Size
2 mil
Smallest Pitch Size
4 mil
Continuity Test
2
Ω
~
8k
Ω
Isolation Test
10k
~
25M
Ω
Max. Board Size
650mm * 520mm
Max. Test Area
610mm * 500mm
Board Thickness
0.3mm
~
6mm
No of Test Head
4
No of CCD
4
Test & Inspection CapabilitySlide18
Test & Inspection Capability
EMS CheckSumTo test most single or double-sided SMT / through hole circuit assemblies. It can perform effective power-down testing for most analog or digital assembliesDual level probing and optional power-up functional test capability is ideally suited for lower frequency analog assemblies with some digital contentAble test the entire assembly and individual component without power applyUsing sophisticated measurement techniques such as DC or complex-impedance measurement in conjunction with multi point guardingTo find majority of faults such as short, opens and wrong or incorrectly installed componentComponent TypeFunctional Test DescriptionInputOutputAdvance Test OptionResistorMeasure ResistanceCurrent
Resistance value
Capacitor
Measure Capacitance
Voltage
Capacitance value
Inductor
Measure Resistance
Current
Resistance value
Transistor
Switching test
Voltage
Resistance value
LED
Use sensor to sense LED light
Light
Voltage value
LED analyser – wavelength, intensity and chromaticity test
Vibrator
Power on Vibrator and measure current. Use sensor to sense vibrator.
Current Vibration
Current Resistance
Receiver
Impedance measurement test. Microphone receive Receiver SPL frequencies
AC Voltage Sound pressure(Fx)
Impedance value Frequency(Fx) value
Microphone
Microphone receive Receiver SPL frequencies
Sound pressure(Fx)
Frequency(Fx) value
Measure MIC sensitivity test (db)
Dome Switch
Switching Resistance test
Mechanical press
Resistance value
Dome sensitivity test / dome tactility test (Dome switch)
Magnet Sensor
Use magnet to activate switching
Magnetic induction
Voltage value
Light Sensor
Use LED light to activate switching
Light source
Voltage value
Diode
Forward Bias test
Current
Voltage value
Zener Diode
Zener test
Current
Voltage value
Lighting, LED, Power IC Driver
As per component data sheet
Current / Voltage
As per application
Connector
Open and short testCurrentResistance valueSlide19
Test & Inspection Capability
The Jova automated tester performs electrical and image quality tests on the camera module component contains on the device flex strip assemblyConsists of 3 primary component:Pre-configuration testing workstation – automated testing software including tester and light source controlAutomated tester – test electronics and automated fixture with controllable dark and light field, and operator push button and RGB LEDRemote light source / light box with testing targetJova CMOS Image Sensor / Camera Module TesterDescriptionCapabilitiesDescriptionSensor Power
Analog, Digital & AF voltage and current
-
Relative Uniformity Illumination
Relative illumination
Relative uniformity
Both Relative Illumination and Uniformity are calculated from the same image captured from device with the uniform light source.
Blemish
Blemish (defective pixel cluster, dust & particles
The Blemish test is calculated from the same image captured at device with the uniform light
Macro Focus (MTF)
Macro MTF (Image Sharpness)
The MACRO MTF test is calculated from the image taken from device position in position with the sensor viewing a test target at 10cm from the device module
INF Focus (MTF)
INF MTF (Image sharpness)
The INF MTF test is calculated from the image taken from device at position with the sensor viewing a test target at 120cm from the device module lens. Slide20
SEHO
Auto Stiffener BonderAuto pick & place ‘with X.Y Axis’ on various material, PI, EMI, SUS & FR4, thickness range 1-10mils2 camera as Image processing for pattern matching with reflective illuminationPosition Accuracy ± 50umBonded material size at 5mm * 5mm -50mm *50mmPanel size 250mm * 250mm – 520mm * 520mmPanel thickness at 0.05mm – 1.0mmSEHO Vision Press Robot
7 Ton servo press with mold size 35mm * 35mm -150mm * 130mm, with one press head
Panel thickness at 0.05mm – 1.0mm
Pressing speed 2.0 sec / stroke
Press accuracy ±20um
With 2 camera
Description
Tolerance
ACF/ZIF finger distance tolerance (length =<25mm)
ACF/ZIF finger distance tolerance (length = >25mm)
Adhesive material (±0.10% of length)
Non Adhesive material (±0.20% of length)
a
± 0.03mm
± 0.05mm
ACF/ZIF finger distance to board edge
b
± 0.05mm
Outline
c
± 0.05mm
Coverlay edge to board edge
d
± 0.05mm
Stiffener position
e
± 0.10mm
Value Added CapabilitySlide21
WORR
Automatic Dual Station Stiffener BondingRoll material are pressed through servo pressBonding is made against on the product integrated control servo motor by x-robot & servo motor & CCD camera
Configuration:- Once supplied coverlay with conveyor belt by manually, transferred by the conveyor belt, through vacuum head & positioning or rotating by servo motor, alignment via vision, before pre-bonding
WORR
Auto Coverlay Bonding
Description
Capabilities
Max Work Size
500*400mm
Tact Time
1-1.2sec
Bonding Accuracy
±100µm
Top & Bottom CCD FOV
1024*768 pixel
Table Temperature Tolerance
±10°C
Description
Capabilities
Max Work Size
500*500mm
Coverlay Size Max
250*200mm (sheet type)
Tact Time
6 sec
CCD FOV
1024*768 pixel
Bonding Accuracy
±
100µm
Table
Vacuum system & heater
Value Added CapabilitySlide22
SOLUF
Semi Auto Stiffener BondingFor flexible printed circuit metal / FR4 or rigid stiffener pre laminationHeating Temperature 170°CWorking area 290*280mm5x air cylinder for pressure platenBuilt-in fixture or offline fixture changeableSEIYU Auto Puncher with Load & Unloading SystemValue Added Capability
Description
Capabilities
Working Area
330*250mm
Thickness
0.05-1.0mm
Alignment Mode
Pinning
Press Power Force
Servo Power
Press Force
25 Ton
Mold Size
200*255mm
Press Speed
3-5secSlide23
Nordson Asymtek
Dispensing (Underfill)Underfill comprised of a fill liquid polymer, silica filled epoxy, dispensed along edges of a flip chipSurface tension forces draw the material under the dieAuto dispensing system eliminate process variation Software managed temperature, fluid and air pressure provide closed-loop control that eliminates the needs for operator adjustmentTight temperature control using software manage jet / needle heatersNon contact jettingDescriptionCapabilities
X-Y Placement Accuracy
±0.05mm
X.Y Z Repeatability
±0.05mm
X.Y Velocity
1 m/s peak
Camera Resolution
640*480 pixels
Camera Field of View
7.0*5.0mm
Camera Lighting
LED
Encapsulation CapabilitySlide24
Xeilli
Automated Inkjet Legend PrintingLegend Printing CapabilityDescriptionCapabilitiesMax. Board Size
610*762mm
Board Thickness
0.1
῀
5.5mm
Max. Thickness
10mm
No of Nozzles
1024
Min. Line Width
75µm
Min. Character
500µm*400µm
Accuracy
±35µm
Depth of Focus
1.5mm
Registration
CCD camera, 3 points registration
Printing Mode
True A-A or A-B side
Throughput/hour
32 sides (1440x720mm)
To
print legend for identification and labelling according to customer demandsSlide25
Reliability Test Capability
Test ItemTest Conditions1) Dynamic Sliding/SliderSpeed : 25, 30, 60 (Customer define)Stroke : 25, 30, 35mm Radius : 0.9, 1.0, 1.5, 2.0mmTemp : 25deg C to -10deg CCycles : Test to failure (Customer define)
2) Dynamic Hinge/Flip
Radius : 3mm
Speed : 120, 250, 350 rpm
Temp : 25deg C
3) Static/Folding
Diameter : 1.5 to 15mm
Speed :
60X / min
Angle : 0 ~ 180 deg
Temp : 25deg C
4) Thermal Shock (AIR)
Max temp : +125C for 30mins (High)
Min temp : -40C for 30mins (Low)
Duration : 10 ~ 1000 cycles
5) Thermal Shock (LIQUID)
Max temp : +125C for 5mins (High)
Min temp : -55C for 5mins (Low)
Duration : 100 ~ 300 cycles
6) Humidity Chamber
Temp : 85deg C
Humidity 95%RH
Duration : 240 hrs
7) Shear Force
Min spec : 0.8kgf
Temp : 25deg C
8) Peel Strength
Speed : 0.8mm/sec
Temp : 25deg C
IPC TM 650 2.4.9
9) Solder Float
IPC TM 650 2.6.8
Method A (260 deg C)
Method B (288 deg C)
Duration : 10 sec
*Pre-condition : 1hr /155
deg
C
10)
Solderability
Test
Inert gas chamber <100ppm O2
Solderability
of SMD from 02001
Temp : 30 – 400
deg
C
11) Hi-pot Tester
Power source : 220 VAC
Frequency : 50 Hz
Current range 0
῀
20mA
6
5
4
8
7
1
2
3
9
10
11