RF Expansion Connections TPS Voltage Regulator BMP Pressure Sensor RF Expansion Connections - PDF document

UserManual SPMU290–April2013 BOOSTXL-SENSHUBSensorHubBoosterPack TheSensorHubBoosterPack(BOOSTXL-SENSHUB)isalow-costextensionboardfortheTiva™C SeriesTM4CLaunchPadEK-TM4C123GXLevaluationplatformforARM®Cortex™-M4F-based microcontrollers(MCUs).Thisextensionboard,orBoosterPack,isspecificallydesignedtoexpandthe functionalityoftheTivaTM4CLaunchPad.Thisuser’smanualprovidesanoverviewoftheSensorHub BoosterPacksoftwareandhardware Figure1showsaphotooftheBOOST-XL-SENSHUB. Figure1.BOOSTXL-SENSHUBBoosterPackExtensionBoard Contents 1BoardOverview.............................................................................................................2 2HardwareDescription......................................................................................................3 3SoftwareDevelopment.....................................................................................................5 4References,PCBLayout,andBillofMaterials.........................................................................6 Tiva,CodeComposerStudioaretrademarksofTexasInstruments. TivaWare,StellarisareregisteredtrademarksofTexasInstruments. Cortex,KeilaretrademarksofARMLimited. ARM,RealViewareregisteredtrademarksofARMLimited. Microsoft,WindowsareregisteredtrademarksofMicrosoftCorp. Allothertrademarksarethepropertyoftheirrespectiveowners. 1 SPMU290–April2013 BOOSTXL-SENSHUBSensorHubBoosterPack SubmitDocumentationFeedback Copyright©2013,TexasInstrumentsIncorporated BoardOverviewwww.ti.com 1BoardOverview TheSensorHubBoosterPackisanextensionboardfortheTIMCULaunchPadevaluationmoduleeco- system.ItwasdesignedspecificallytoextendthefunctionalityoftheTivaTM4C1233LaunchPad(EK- TM4C123GXL).TheSensorHubenablescustomerstocreateandmodelinnovativeprototypesolutions thatleveragetheprocessingandfloating-pointcapabilitiesoftheTM4C123GH6PMMCUcoupledwith motionandenvironmentalsensors.TheSensorHubBoosterPackplugsintotheBoosterPackXLheaders locatedonthetopoftheLaunchPad.TheBoosterPackalsofeaturesaTI-standardextensionmodule (EM)connectortofurtherextendcustomerapplicationsthroughavarietyofwirelessextensionmodules. ThisboardandtheavailablesoftwarealsohighlighttheuseofthenewTivaWare®SensorLibsensor driverlibrary,aneasy-to-use,extendablefoundationofsensorcommunicationsoftware. NOTE:TheSensorHubBoosterPackisfullycompatiblewithboththeTiva™CSeriesLaunchPad (EK-TM4C123GXL)andtheStellaris®LM4F120LaunchPad(EK-LM4F120XL). 1.1KitFeatures TheBOOSTXL-SENSHUBBoosterPackoffersthefollowingfeatures: •TMP006infraredobjecttemperaturesensor •9-axisInvenSenseMPU9150motionsensor: –3-axisacceleration –3-axisgyroscope –3-axismagnetometer •BoschBMP180pressuresensor •IntersilISL29023ambientandinfraredlightsensor •SensirionSHT21humiditysensor •Twouserpushbuttons •OneuserLED •OnepowerLED •EMconnectorforadditionalwirelessexpansion 1.2UsingtheSensorHubBoosterPack FollowtheserecommendedstepstoquicklyconfigureyourSensorHubforproperoperation. Step1.ReviewtheBOOSTXL-SENSHUBBoosterPackGettingStartedGuide(literaturenumber SPMU295,availablefordownloadatwww.ti.com).Thisdocumentguidesyouthrough downloading,installing,andrunningtheassociatedTivaWareexamplesthatdemonstratethe SensorHubcapabilitiesandfunctions. Step2.Examinetheadditionalexamplesthatareprovidedwiththedownloadedsoftwareto understandthecapabilitiesandlimitationsofeachon-boardsensor. Step3.CreateyourownapplicationusingtheTivaCSeriesLaunchPadandSensorHub BoosterPack.UsetheTivaWareforCSeriesSensorLibrarytoenableyourinnovativeTiva TM4CMCUapplications. Step4.Customizeandintegratethehardwaretosuitaspecificendapplication.Thisuser’smanualis animportantreferenceforunderstandingcircuitoperationandcompletinghardware modifications. 2 BOOSTXL-SENSHUBSensorHubBoosterPack SPMU290–April2013 SubmitDocumentationFeedback Copyright©2013,TexasInstrumentsIncorporated www.ti.comHardwareDescription 1.3Specifications Table1summarizesthespecificationsfortheBOOSTXL-SENSHUBBoosterPack. Table1.SensorHubBoosterPackSpecifications Parameter Value Boardsupplyvoltage 2.7Vto5.5Vnominallysupplied as3.3VfromtheBoosterPack interface Dimensions 2.0x1.5x0.625(in) 5.08x3.81x1.587(cm) RoHSstatus Compliant 2HardwareDescription TheSensorHubBoosterPackincludesfivemotionandenvironmentalsensors.ItalsoenablesRF expansionandaccesstouserLEDsandbuttons.Thehardwareisdesignedtoenableinnovative applicationsthatfusesensorinformationandTivaCSeriessoftwareprocessingthroughthefunctionality oftheTivaCSeriesLaunchPad. Figure2showsablockdiagramoftheSensorHubBoosterPack. Figure2.BOOSTXL-SENSHUBBoosterPackBlockDiagram 3 SPMU290–April2013 BOOSTXL-SENSHUBSensorHubBoosterPack SubmitDocumentationFeedback Copyright©2013,TexasInstrumentsIncorporated HardwareDescriptionwww.ti.com 2.1FunctionalDescription ThissectionprovidesafunctionaldescriptionoftheSensorHubBoosterPack. 2.1.1BoosterPackXLConnector TheBoosterPackXLconnectorattachestheBoosterPacktotheTivaTM4CLaunchPad.This BoosterPackisspecificallydesignedtomatchthepinfunctionwiththeTivaTM4CLaunchPad.BasicI2C andUARTcommunicationtothesensorsandRFexpansionconnectorsarealsoavailablewhenthe SensorHubisconnectedtoeithertheC2000orMSP430LaunchPad. Table2describestheBoosterPackXLinterfaceconnectionsandtherespectiveusesontheSensorHub BoosterPack.Italsoshowswhichpinsremainavailableforadditionalexpansionattheuser'sdiscretion. Table2.BoosterPackXLInterfaceConnections(1) Pin Function Pin Function Pin Function Pin Function J1.1 3.3VIN J2.1 Ground J3.1 J4.1 J1.2 J2.2 Interrupt J3.2 J4.2 J1.3 UARTRX J2.3 Interrupt J3.3 J4.3 RFGPIO J1.4 UARTTX J2.4 J3.4 J4.4 UARTRTS J1.5 J2.5 J3.5 USERLED J4.5 UARTCTS J1.6 Interrupt J2.6 SensorI2C J3.6 UserButton J4.6 RFShutdown J1.7 J2.7 SensorI2C J3.7 UserButton J4.7 RFReset J1.8 SSITX J2.8 SSIRX J3.8 RFGPIO J4.8 RFGPIO J1.9 RFI2C J2.9 SSISS J3.9 RFGPIO J4.9 J1.10 RFI2C J2.10 SSICLK J3.10 J4.10 (1)Shadedcellsindicateunusedpinsthatareavailableforadditionalexpansion. 2.1.2TMP006TemperatureSensor TheTMP006providesbothdirectandindirecttemperaturemeasurements.Itcontainsanon-chip temperaturesensortodirectlymeasureambienttemperatureconditions.Italsoallowscontactlessinfrared objecttemperaturemeasurement. 2.1.3InvenSenseMPU91509-AxisMotionSensor TheMPU9150isa3-axisaccelerometer,3-axisgyroscope,and3-axismagnetometerinasinglepackage. ThisdeviceistheprimarymotionsensorontheSensorHub.Itisusedbythedemonstrationsoftwareas therawmotioninputs,whicharefusedbyadirectcosinematrixintoroll,pitch,andyawmeasurements. 2.1.4IntersilISL29023AmbientandInfraredLightSensor TheISL29023providessensormeasurementsoflightconditionsacrossboththeambient(human-visible) spectrumandtheinfraredspectrum. 2.1.5SensirionSHT21HumiditySensor TheSHT21providesrelativehumiditymeasurements. 2.1.6BoschBMP180BarometricPressureSensor TheBMP180measuresbarometricpressureconditions.Itcanbeusedtoenhancethemotionsensorby determiningrelativechangesinaltitude. 2.1.7Low-PowerRFExpansionConnection TheRFexpansionconnectionprovidesawidearrayofoptionstotheendapplication. 4 BOOSTXL-SENSHUBSensorHubBoosterPack SPMU290–April2013 SubmitDocumentationFeedback Copyright©2013,TexasInstrumentsIncorporated www.ti.comSoftwareDevelopment 2.1.8TPS75118VoltageRegulator TheTPS75118regulatesthe3.3-VsupplyfromtheLaunchPaddownto1.8VfortheinputtotheRF expansionconnector. 3SoftwareDevelopment ThissectionprovidesgeneralinformationonsoftwaredevelopmentaswellasinstructionsforFlash memoryprogramming.Note:ThisinformationpresumesthattheSensorHubBoosterPackisconnectedto aTivaTM4C1233LaunchPad. 3.1SoftwareDescription TheTivaWaresoftwareprovidedwiththeTivaCSeriesLaunchPadincludesfunctionaldriversforallof theperipheraldevicessuppliedinthedesign.TheTivaWareforCSeriesPeripheralDriverLibraryisused toconfigureandoperatetheon-chipperipheralsaspartofTivaWare. TheTivaWarepackageincludesasetofexampleapplicationsthatusetheTivaWarePeripheralDriver Library.TheseapplicationsdemonstratethecapabilitiesoftheTM4C1233H6microcontroller,aswellas provideastartingpointfortheusertodevelopthefinalapplicationforuseontheTivaCSeries LaunchPadevaluationboardandtheBOOSTXL-SENSHUBBoosterPack. 3.2SourceCode Thecompletesourcecode,includingthesourcecodeinstallationinstructions,areavailableat www.ti.com/tool/boostxl-senshub.ThesourcecodeandbinaryfilesareinstalledintheTivaWareforC SeriesPeripheralDriverLibrarytree. 3.3ToolOptions Thesourcecodeinstallationincludesdirectoriesthatcontainprojectsand/ormakefilesforthefollowing toolchains: •Keil™ARMRealView®MicrocontrollerDevelopmentSystem •IAREmbeddedWorkbenchforARM •SourceryCodeBench •TexasInstruments'CodeComposerStudio™IDE Downloadevaluationversionsofthesetoolsfromwww.ti.com/tiva-c.Asaresultofcodesizerestrictions, theevaluationtoolsmaynotbuildallexampleprograms.Afulllicenseisnecessarytorebuildordebugall examples. InstructionsoninstallingandusingeachoftheevaluationtoolscanbefoundintheQuickstartguides(for example,Quickstart-Keil,Quickstart-IAR),whichareavailablefordownloadfromtheEvaluationKitsection ofourwebsiteatwww.ti.com/tiva-c. Fordetailedinformationonusingeachtool,seethedocumentationincludedwiththerespectivetoolchain installationorvisitthewebsiteoftherespectivetoolsupplier. 3.4ProgrammingtheTivaTM4CLaunchPadEvaluationBoard TheTivaTM4CLaunchPadsoftwarepackageincludespre-builtbinariesforeachoftheexample applications.IfyouinstalledTivaWareforCSeriestothedefaultinstallationpathof C:\ti\TivaWare_C_Series_version�,youcanfindtheseexampleapplicationsin C:\ti\TivaWare_C_Series_version�/examples\boards\ek-tm4c123gxl.TheonboardICDIisusedwiththe LMFlashProgrammertooltoprogramapplicationsontheTivaCSeriesLaunchPad. FollowthesestepstoprogramexampleapplicationsintotheTivaCSeriesLaunchPadevaluationboard usingtheICDI: 1.InstalltheLMFlashProgrammeronaPCrunningMicrosoft®Windows®XP,Windows7,orlater WindowsOS. 2.SwitchthePOWERSELECTswitchtotherighttouseDebugmode. 5 SPMU290–April2013 BOOSTXL-SENSHUBSensorHubBoosterPack SubmitDocumentationFeedback Copyright©2013,TexasInstrumentsIncorporated References,PCBLayout,andBillofMaterialswww.ti.com 3.ConnecttheUSB-AcableplugtoanavailableportonthePCandtheMicro-BplugtotheDebugUSB portontheboard. 4.VerifythatthePOWERLEDD4ontheboardislit. 5.RuntheLMFlashProgrammerprogram. 6.IntheConfigurationtab,usetheQuickSetcontroltoselecttheTivaCSeriesLaunchPadevaluation board. 7.MovetotheProgramtabandclicktheBrowsebutton.Navigatetotheexampleapplicationsdirectory (thedefaultlocationisC:\ti\TivaWare_C_Series_version�/examples\boards\ek-tm4c123gxl-senshub\). 8.Eachexampleapplicationhasitsowndirectory.Navigatetotheexampledirectorythatyouwantto load,thennavigatetothedirectorythatcontainsthebinary(*.bin)files.Selectthedesiredbinaryfile andclickOpen. 9.SettheEraseMethodtoEraseNecessaryPages.ChecktheVerifyAfterProgrambox,andcheck theResetMCUAfterProgramoption. 10.ClicktheProgrambuttontostarttheErase,Download,andVerifyprocess.Programexecutionstarts oncetheVerifyprocessiscomplete. 4References,PCBLayout,andBillofMaterials CompleteschematicsfortheSensorHubBoosterPackareappendedtothisuser'sguide. 4.1References Inadditiontothisdocument,thefollowingreferencesareavailablefordownloadatwww.ti.com: •BOOSTXL-SENSHUBBoosterPackGettingStartedGuide(literaturenumberSPMU295) •TivaCSeriesTM4C123GH6PMMicrocontrollerDataSheet(literaturenumberSPMS376). •TivaWareforCSeriesDriverLibrary.Availablefordownloadatwww.ti.com/tool/sw-tm4c-drl. •TivaWareforCSeriesDriverLibraryUser’sManual(literaturenumberSPMU298). •TPS75118FastTransientResponse,1.5-A,Low-DropoutRegulatorDataSheet(literaturenumber SLVS241) •TMP006InfraredThermopileSensorDataSheet(literaturenumberSBOS518) •TexasInstruments’CodeComposerStudioIDEwebsite:www.ti.com/ccs Additionalsupport: •RealViewMDK(www.keil.com/arm/rvmdkkit.asp) •IAREmbeddedWorkbench(www.iar.com) •SourceryCodeBenchdevelopmenttools(www.codesourcery.com/gnu_toolchains/arm) •InvenSenseMPU9150(www.invensense.com/mems/gyro/mpu9150.html) •IntersilISL29023(www.intersil.com/en/products/optoelectronics/ambient-light-sensors/light-to-digital- sensors/ISL29023.html) •BoschBMP180(www.bosch- sensortec.com/homepage/products_3/environmental_sensors_1/bmp180_1/bmp180) •SensirionSHT21(www.sensirion.com/en/products/humidity-temperature/humidity-sensor-sht21) 6 BOOSTXL-SENSHUBSensorHubBoosterPack SPMU290–April2013 SubmitDocumentationFeedback Copyright©2013,TexasInstrumentsIncorporated www.ti.comReferences,PCBLayout,andBillofMaterials 4.2BillofMaterials(BOM) Table3showsthebillofmaterialsfortheBOOSTXL-SENSHUBBoosterPackboard. Table3.BOOSTXL-SENSHUBBillofMaterials(1)(2)(3) Item RefDes Qty Value Description Manufacturer ManufacturerPartNo IC,digital,barometricpressure 1 U2 1 BMP180 Bosch BMP180 sensor C1-2,C8-9,C11, Capacitor,ceramic,NPOorC0Gor 2 8 100nF Murata GRM21BR71E104KA01L C13,C15-16 X5R,10Vorhigher,0805(4) Capacitor,ceramic,X7R,±10%, 3 C4,C6 2 100nF Murata GRM21BR71E104KA01L 10Vorhigher,0805(4) Capacitor,ceramic,X7R,±10%, 4 C5 1 10nF Murata GRM216R71H103KA01D 10Vorhigher,0805(4) Capacitor,ceramic,X7R,±10%, 5 C3 1 2.2nF Kemet C0805C222K5RACTU 50Vorhigher,0805(4) C7,C10,C12, Capacitor,tantalum,10Vorhigher, 6 4 1F AVXCorp. TAJA105M020RNJ C14 TypeA Capacitor,tantalum,10Vorhigher, 7 C17 1 47F Nichicon F931A476MAA TypeA — Y1 0 32.768kHz Clockoscillator,2.5x3.2mm Donotpopulate Donotpopulate Lightemittingdiode,1.7Vforward 8 D1 1 Red Stanley BR1112H-TR voltageorless,0805 9 D2 1 Yellow Lightemittingdiode,0805 Knightbright APT2012YC Header,female,10-pin,100-mil 10 J1-4 4 PEC10SAAN Sullins PPTC101LFBN-RC spacing,0.100inchx10 TFM-110-02- Header,SMT10x2pin,shrouded, 11 RF_PART1-2 2 Samtec TFM-110-02-SM-D-A-K-TR SM-D-A-K-TR 0.225x0.625inch IC,integrateddigitallightsensorwith 12 U4 1 ISL29023 Intersil ISL29023 interrupt IC,nine-axisMEMSmotiontracking 13 U3 1 MPU-9150 InvenSense MPU-9150 device Surfacemountresistor,1/10Wor 14 R1,R4,R9-10 4 10k\r Yageo RC0805JR-0710KL higher,0805 Surfacemountresistor,1/10Wor — R2 0 10k\r Donotpopulate Donotpopulate higher,0805 Surfacemountresistor,1/10Wor 15 R6 1 5.1\r Yageo RC0805JR-075R1L higher,0805 Surfacemountresistor,1/10Wor 16 R7 1 100\r Yageo RC0805JR-07100RL higher,0805 Surfacemountresistor,1/10Wor 17 R5,R8 2 0\r Yageo RC0805JR-070RL higher,0805 Surfacemountresistor,1/10Wor 18 R3 1 499k\r Yageo RC0805FR-07499KL higher,0805 Surfacemountresistor,1/10Wor 19 R11-12 2 3.3k\r Yageo RC0805JR-073K3L higher,0805 20 U5 1 SHT21 IC,humidityandtemperaturesensor SensirionAG SHT21 Switch,1P1T,PBmomentary, 21 S1-2 2 7914G Bourns 7914G 100mA,SM,0.19x0.18inch 22 U1 1 TMP006AIYZFT IC,infraredthermopilesensor TexasInstruments TMP006YZF TPS75118Q IC,lowdropoutvoltageregulator, 23 U6 1 TexasInstruments TPS75118QPWP PWP 1.8V,1.5A (1)TheseassembliesareESDsensitive.ESDprecautionsshallbeobserved. (2)Theseassembliesmustbecleanandfreefromfluxandallcontaminants.Useofnocleanfluxisnotacceptable. (3)TheseassembliesmustcomplywithworkmanshipstandardsIPC-A-610Class2. (4)Adielectricwithahigherthermalrangeand/orlowercapacitancevariationisalsopermitted(forexample,X7R,X9R). 7 SPMU290–April2013 BOOSTXL-SENSHUBSensorHubBoosterPack SubmitDocumentationFeedback Copyright©2013,TexasInstrumentsIncorporated EVALUATIONBOARD/KIT/MODULE(EVM)ADDITIONALTERMS TexasInstruments(TI)providestheenclosedEvaluationBoard/Kit/Module(EVM)underthefollowingconditions: Theuserassumesallresponsibilityandliabilityforproperandsafehandlingofthegoods.Further,theuserindemnifiesTIfromallclaims arisingfromthehandlingoruseofthegoods. 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SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER ûûImportantNoticeforUsersofthisProductinJapanüü ThisdevelopmentkitisNOTcertifiedasConfirmingtoTechnicalRegulationsofRadioLawofJapan IfyouusethisproductinJapan,youarerequiredbyRadioLawofJapantofollowtheinstructionsbelowwithrespecttothisproduct: 1.Usethisproductinashieldedroomoranyothertestfacilityasdefinedinthenotification#173issuedbyMinistryofInternalAffairsand CommunicationsonMarch28,2006,basedonSub-section1.1ofArticle6oftheMinistry’sRuleforEnforcementofRadioLawof Japan, 2.UsethisproductonlyafteryouobtainedthelicenseofTestRadioStationasprovidedinRadioLawofJapanwithrespecttothis product,or 3.UseofthisproductonlyafteryouobtainedtheTechnicalRegulationsConformityCertificationasprovidedinRadioLawofJapanwith respecttothisproduct.Also,pleasedonottransferthisproduct,unlessyougivethesamenoticeabovetothetransferee.Pleasenote thatifyoucouldnotfollowtheinstructionsabove,youwillbesubjecttopenaltiesofRadioLawofJapan. TexasInstrumentsJapanLimited (address)24-1,Nishi-Shinjuku6chome,Shinjuku-ku,Tokyo,Japan http://www.tij.co.jp û7"G·N%BFIQ?wü 9»hI\tŠ ¥R5Zâ*‰A%bø&—\Ë8u&f4I-ma�ví 9»[Œ'PQ7"G·Ni*:IRìiŠ?q?dc.QBdì!t šQ'=o.Q69Qýu&eFI'BC22T\/%maQJ7?w3ž2C8'í 1.iŠ?q?d8LZÛ\$ÖM»69ðM»1j”M»1&†N*‰H214Ÿ18139—288tP^%hI&ÙKÉM»173&†J.)dloBiŠ?q9&.3MØQ\õl¢\¼#(J7"G·'BC2í 2...l¢.ÏQ#Ü\Àu&e2&27"G·'BC2í 3.5Zâ*‰A%bø&—\Ë8u&e2&27"G·'BC2í M-ì9»[Œ'PRì ™\§Q÷7"G·N%BFIQ?w3žøu^
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@°ìLŠaqJ0M'eQK:aí ëëë ™\§uc.j‘4M'*Ã&—RìiŠ?q?dQQÿ$Ö/bøG·8on&~SŒ2¶/%n6Ku7Gè3ž2C8'í 8t9»£Š’–؁Ж¡È¾Ð¡:¹1ž!©KÍ :!;cŒ8?.N%É\8?.Nò I}îðGùí&† \8?.N ˜!$°È http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER EVALUATIONBOARD/KIT/MODULE(EVM) WARNINGS,RESTRICTIONSANDDISCLAIMERS ForFeasibilityEvaluationOnly,inLaboratory/DevelopmentEnvironments.Unlessotherwiseindicated,thisEVMisnotafinished electricalequipmentandnotintendedforconsumeruse.Itisintendedsolelyforuseforpreliminaryfeasibilityevaluationin laboratory/developmentenvironmentsbytechnicallyqualifiedelectronicsexpertswhoarefamiliarwiththedangersandapplicationrisks associatedwithhandlingelectricalmechanicalcomponents,systemsandsubsystems.Itshouldnotbeusedasallorpartofafinishedend product. YourSoleResponsibilityandRisk.Youacknowledge,representandagreethat: 1.YouhaveuniqueknowledgeconcerningFederal,Stateandlocalregulatoryrequirements(includingbutnotlimitedtoFoodandDrug Administrationregulations,ifapplicable)whichrelatetoyourproductsandwhichrelatetoyouruse(and/orthatofyouremployees, affiliates,contractorsordesignees)oftheEVMforevaluation,testingandotherpurposes. 2.Youhavefullandexclusiveresponsibilitytoassurethesafetyandcomplianceofyourproductswithallsuchlawsandotherapplicable regulatoryrequirements,andalsotoassurethesafetyofanyactivitiestobeconductedbyyouand/oryouremployees,affiliates, contractorsordesignees,usingtheEVM.Further,youareresponsibletoassurethatanyinterfaces(electronicand/ormechanical) betweentheEVMandanyhumanbodyaredesignedwithsuitableisolationandmeanstosafelylimitaccessibleleakagecurrentsto minimizetheriskofelectricalshockhazard. 3.YouwillemployreasonablesafeguardstoensurethatyouruseoftheEVMwillnotresultinanypropertydamage,injuryordeath,even iftheEVMshouldfailtoperformasdescribedorexpected. 4.YouwilltakecareofproperdisposalandrecyclingoftheEVM’selectroniccomponentsandpackingmaterials. CertainInstructions.ItisimportanttooperatethisEVMwithinTI’srecommendedspecificationsandenvironmentalconsiderationsperthe userguidelines.ExceedingthespecifiedEVMratings(includingbutnotlimitedtoinputandoutputvoltage,current,power,and environmentalranges)maycausepropertydamage,personalinjuryordeath.Iftherearequestionsconcerningtheseratingspleasecontact aTIfieldrepresentativepriortoconnectinginterfaceelectronicsincludinginputpowerandintendedloads.Anyloadsappliedoutsideofthe specifiedoutputrangemayresultinunintendedand/orinaccurateoperationand/orpossiblepermanentdamagetotheEVMand/or interfaceelectronics.PleaseconsulttheEVMUser'sGuidepriortoconnectinganyloadtotheEVMoutput.Ifthereisuncertaintyastothe loadspecification,pleasecontactaTIfieldrepresentative.Duringnormaloperation,somecircuitcomponentsmayhavecasetemperatures greaterthan60°Caslongastheinputandoutputaremaintainedatanormalambientoperatingtemperature.Thesecomponentsinclude butarenotlimitedtolinearregulators,switchingtransistors,passtransistors,andcurrentsenseresistorswhichcanbeidentifiedusingthe EVMschematiclocatedintheEVMUser'sGuide.Whenplacingmeasurementprobesnearthesedevicesduringnormaloperation,please beawarethatthesedevicesmaybeverywarmtothetouch.Aswithallelectronicevaluationtools,onlyqualifiedpersonnelknowledgeable inelectronicmeasurementanddiagnosticsnormallyfoundindevelopmentenvironmentsshouldusetheseEVMs. AgreementtoDefend,IndemnifyandHoldHarmless.Youagreetodefend,indemnifyandholdTI,itslicensorsandtheirrepresentatives harmlessfromandagainstanyandallclaims,damages,losses,expenses,costsandliabilities(collectively,"Claims")arisingoutoforin connectionwithanyuseoftheEVMthatisnotinaccordancewiththetermsoftheagreement.ThisobligationshallapplywhetherClaims ariseunderlawoftortorcontractoranyotherlegaltheory,andeveniftheEVMfailstoperformasdescribedorexpected. Safety-CriticalorLife-CriticalApplications.Ifyouintendtoevaluatethecomponentsforpossibleuseinsafetycriticalapplications(such aslifesupport)whereafailureoftheTIproductwouldreasonablybeexpectedtocauseseverepersonalinjuryordeath,suchasdevices whichareclassifiedasFDAClassIIIorsimilarclassification,thenyoumustspecificallynotifyTIofsuchintentandenterintoaseparate AssuranceandIndemnityAgreement. MailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265 Copyright©2013,TexasInstrumentsIncorporated IMPORTANTNOTICE TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandother changestoitssemiconductorproductsandservicesperJESD46,latestissue,andtodiscontinueanyproductorserviceperJESD48,latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas“components”)aresoldsubjecttoTI’stermsandconditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’sterms andconditionsofsaleofsemiconductorproducts.TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessary tosupportthiswarranty.Exceptwheremandatedbyapplicablelaw,testingofallparametersofeachcomponentisnotnecessarily performed. TIassumesnoliabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.TominimizetherisksassociatedwithBuyers’productsandapplications,Buyersshouldprovide adequatedesignandoperatingsafeguards. TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,or otherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIcomponentsorservicesareused.Information publishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservicesorawarrantyor endorsementthereof.Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalteration andisaccompaniedbyallassociatedwarranties,conditions,limitations,andnotices.TIisnotresponsibleorliableforsuchaltered documentation.Informationofthirdpartiesmaybesubjecttoadditionalrestrictions. ResaleofTIcomponentsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatcomponentorservice voidsallexpressandanyimpliedwarrantiesfortheassociatedTIcomponentorserviceandisanunfairanddeceptivebusinesspractice. TIisnotresponsibleorliableforanysuchstatements. Buyeracknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirements concerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandinganyapplications-relatedinformationorsupport thatmaybeprovidedbyTI.Buyerrepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresandtheirconsequences,lessenthelikelihoodoffailuresthatmightcause harmandtakeappropriateremedialactions.BuyerwillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuse ofanyTIcomponentsinsafety-criticalapplications. Insomecases,TIcomponentsmaybepromotedspecificallytofacilitatesafety-relatedapplications.Withsuchcomponents,TI’sgoalisto helpenablecustomerstodesignandcreatetheirownend-productsolutionsthatmeetapplicablefunctionalsafetystandardsand requirements.Nonetheless,suchcomponentsaresubjecttotheseterms. NoTIcomponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties haveexecutedaspecialagreementspecificallygoverningsuchuse. OnlythoseTIcomponentswhichTIhasspecificallydesignatedasmilitarygradeor“enhancedplastic”aredesignedandintendedforusein military/aerospaceapplicationsorenvironments.BuyeracknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponents whichhavenotbeensodesignatedissolelyattheBuyer'srisk,andthatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuchuse. TIhasspecificallydesignatedcertaincomponentsasmeetingISO/TS16949requirements,mainlyforautomotiveuse.Inanycaseofuseof non-designatedproducts,TIwillnotberesponsibleforanyfailuretomeetISO/TS16949. Products Applications Audio www.ti.com/audio AutomotiveandTransportation www.ti.com/automotive Amplifiers amplifier.ti.com CommunicationsandTelecom www.ti.com/communications DataConverters dataconverter.ti.com ComputersandPeripherals www.ti.com/computers DLP®Products www.dlp.com ConsumerElectronics www.ti.com/consumer-apps DSP dsp.ti.com EnergyandLighting www.ti.com/energy ClocksandTimers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security PowerMgmt power.ti.com Space,AvionicsandDefense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com VideoandImaging www.ti.com/video RFID www.ti-rfid.com OMAPApplicationsProcessors www.ti.com/omap TIE2ECommunity e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265 Copyright©2013,TexasInstrumentsIncorporated