PPT-WP6 interconnect technology part

Slides prepared by Sami Vaehaenen Presented by M Campbell WP6 3D packaging part Manpower Sami Vaehaenen CERN Fellow 100 Timo Tick ACEOLE PhD Student 100 Michael Campbell CERN Staff 20. 9 10 11 12 13 12481632 Performance normalized to 1MB LLC size MB 04 06 08 10 0 64 128 192 256 Percore Performance normalized to 1 core Number of cores 64 128 192 256 0 64 128 192 256 Chip Performance normalized to 1 core Number of cores brPage 4br br Interconnect and Clocks. Chapter Outline. Trends and bounds. An OSI approach to interconnect optimization. Physical layer. Data link and MAC. Network. Application. Clock distribution. ITRS Projections. Proposal. Bob Ross, . Teraspeed. Labs. bob@teraspeedlabs.com. EPEPS 2015 IBIS Summit. San Jose, CA, October 28. , 2015. Draft Presented September 2, 2015 at the Interconnect Working Group. Copyright 2015 . 5. th. April 2011. 0640959, . Woohyung. . Jeon. Table of contents. 1. Introduction. 2. Revolutionary I/O technology. 3. More advantages. 4. Architecture. 5. How will it benefit you?. 2. 1. Introduction. Platform. Interconnect Billing. Vendor . Management . Enables the operator to define all types of vendors including terminators. Contact Management. Contract . Management.  . Modules. Interconnect Billing. DESIGN. - PROF. RAKESH K. JHA. . CORPORATE . INSTITUTE OF SCIENCE & TECHNOLOGY , BHOPAL. DEPARTMENT OF ELECTRONICS & COMMUNICATIONS . Chips are mostly made of wires called . interconnect.. Wires are as important as transistors. . . DIVYA CHALLA. INTRODUCTION. INTERCONNECTS . connect the electronic circuits on a chip for proper functionality of the IC.. Interconnects can be . Local. . (connections within transistors) or . AXI4-Stream Interconnect v1.1www.xilinx.com PG035 November 18, 2015 Table of ContentsChapter1:OverviewFeature Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements. Chen Zhao, Frank Yang. NetApp, Inc.. Storage Interconnect Requirements. Multi-destination RMA operation with reliable unconnected transport. 2. www.openfabrics.org. Storage Interconnect Requirements. An Open-Source Predictive Process Design Kit for 15nm . FinFET. Technology . Kirti. . Bhanushali. , . . W. . Rhett Davis (NCSU. ). International Symposium on Physical Design. April 1. , 2015. NC STATE . Exploring Complex Interconnect Topologies . for the Global Metal Layer. Oleg . Petelin. and Vaughn Betz. FPL 2016. Motivation – The Metal Stack. Poor wire RC scaling .  more complex metal stack. Seyi. . Ayorinde. Pooja. Paul . Chaudhury. FPGA. 2. Field Programmable Gate Array. Reconfigurable Circuit. Configurable Logic Blocks (CLBs). Calhoun et al.: Flexible Circuits and Architectures for Ultralow Power. Mike Koratzinos. 19 March 2009. The first page. . In this talk I will deal only with the splices of the main circuits (RB, RQD, RQF) since they are the most important as far as stored energy is concerned (other circuits: same principles apply). Exploring Complex Interconnect Topologies . for the Global Metal Layer. Oleg . Petelin. and Vaughn Betz. FPL 2016. Motivation – The Metal Stack. Poor wire RC scaling .  more complex metal stack.