PPT-WP6 interconnect technology part

Slides prepared by Sami Vaehaenen Presented by M Campbell WP6 3D packaging part Manpower Sami Vaehaenen CERN Fellow 100 Timo Tick ACEOLE PhD Student 100 Michael Campbell CERN Staff 20. 9 10 11 12 13 12481632 Performance normalized to 1MB LLC size MB 04 06 08 10 0 64 128 192 256 Percore Performance normalized to 1 core Number of cores 64 128 192 256 0 64 128 192 256 Chip Performance normalized to 1 core Number of cores brPage 4br br WP6: Project Management. 3r. d. Annual Review of Project CNET-ICT-258414. Beaulieu, Brussels, Belgium. 26 November, 2013. Overview. WP6 objectives and achievements in year 3. An overview of resources’ consumption. 2This paper presents Internal Position Error C (IPEC) — a new method foraccurate and reliable dead-reckoning with mobile robots. The IPEC method has beenimplemented on our recently developed M (M Shipbuilding industry in Chinese Taipei December 20 09 2 . C/WP6(2009)14 3 TABLE OF CONTENTS THE SHIPBUILDING IND USTRY IN CHINESE TAI PEI ................................ .......................... DESIGN. - PROF. RAKESH K. JHA. . CORPORATE . INSTITUTE OF SCIENCE & TECHNOLOGY , BHOPAL. DEPARTMENT OF ELECTRONICS & COMMUNICATIONS . Chips are mostly made of wires called . interconnect.. Wires are as important as transistors. Through Communication-Based Design. Veronica . Eyo. Sharvari. Joshi. System on chip. Overview . Transition from Ad hoc System On Chip design to Platform based design. Partitioning the communication design into layers using the “network on chip” approach. Exploring Complex Interconnect Topologies . for the Global Metal Layer. Oleg . Petelin. and Vaughn Betz. FPL 2016. Motivation – The Metal Stack. Poor wire RC scaling .  more complex metal stack. Speaker: Peipei Zhou. Student: Peipei Zhou, Hyunseok Park, Zhenman Fang, . Faculty: Jason Cong, Andre DeHon. II = 1 or not? . A new Question, II vs Energy and II > 1 . II change, what happens?. A case study of MM. Seyi. . Ayorinde. Pooja. Paul . Chaudhury. FPGA. 2. Field Programmable Gate Array. Reconfigurable Circuit. Configurable Logic Blocks (CLBs). Calhoun et al.: Flexible Circuits and Architectures for Ultralow Power. Mike Koratzinos. 19 March 2009. The first page. . In this talk I will deal only with the splices of the main circuits (RB, RQD, RQF) since they are the most important as far as stored energy is concerned (other circuits: same principles apply). Demonstrate the performance of . the . IAOS towards stakeholders. Geir . Ottersen, IMR, lead Mikael Sejr, AU, co-lead. Main objective. To demonstrate the economic value and societal benefit of the IAOS through a suite of selected applications towards industry, governance, . OCPP Networked EVSE, . 3 ft. Interconnect, Wall Mount. EVO30-110-002A:. OCPP Networked EVSE, 10. ft. Interconnect, Wall Mount. . EVO30-110-003A:. OCPP Networked EVSE, 20. ft. Interconnect, Wall Mount. Beam. -Laser . M. . Artioli. , G. . Dattoli. , F. . Nguyen. and S. Pagnutti. We. are . trying. to go. Towards. «Bonsai» FEL. Whatever. . we. . do…. oscillators. , SASE…. Get. a fast and . various activities (interconnection tests, mass tests, . assembly,…). Production . of masks, processing, thinning and dicing of . wafers presumably takes . about 2-3 months.. Pad chips. 15 mm x 30 mm.