PPT-INTAROS WP6

Author : karlyn-bohler | Published Date : 2017-10-31

Demonstrate the performance of the IAOS towards stakeholders Geir Ottersen IMR lead Mikael Sejr AU colead Main objective To demonstrate the economic value and

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INTAROS WP6: Transcript

Demonstrate the performance of the IAOS towards stakeholders Geir Ottersen IMR lead Mikael Sejr AU colead Main objective To demonstrate the economic value and societal benefit of the IAOS through a suite of selected applications towards industry governance . WP6: Project Management. 3r. d. Annual Review of Project CNET-ICT-258414. Beaulieu, Brussels, Belgium. 26 November, 2013. Overview. WP6 objectives and achievements in year 3. An overview of resources’ consumption. 2This paper presents Internal Position Error C (IPEC) — a new method foraccurate and reliable dead-reckoning with mobile robots. The IPEC method has beenimplemented on our recently developed M (M Shipbuilding industry in Chinese Taipei December 20 09 2 . C/WP6(2009)14 3 TABLE OF CONTENTS THE SHIPBUILDING IND USTRY IN CHINESE TAI PEI ................................ .......................... Wolk-Lewanowicz. Gerrard Fisher. P. eter Mitchell. James De Couter . WRAP. is an independent, not-for-profit company, recognised in the UK and internationally for its expertise in the circular economy, resource efficiency and product sustainability.. Observation . System. A project funded by EC - . H2020-BG-09-. 2016. Coordinator: Stein . Sandven. Nansen Environmental and Remote Sensing Center, Norway. SAON Board Meeting, ASSW. 07 April 2017. Overall objective: to . Task . T6.2 Tertiary Buildings infrastructures installations. CNet / CERTH. Overview. Selected DEMO Pilot sites at CERTH ITI Building. Equipment . Procurement / Installation Status per . space. Sensor Integration to LS and . Slides prepared by Sami Vaehaenen. Presented by M. Campbell. WP6 – 3D packaging part. Manpower. Sami Vaehaenen CERN Fellow 100%. Timo Tick ACEOLE PhD Student 100%. Michael Campbell CERN Staff 20%. Beam. -Laser . M. . Artioli. , G. . Dattoli. , F. . Nguyen. and S. Pagnutti. We. are . trying. to go. Towards. «Bonsai» FEL. Whatever. . we. . do…. oscillators. , SASE…. Get. a fast and . various activities (interconnection tests, mass tests, . assembly,…). Production . of masks, processing, thinning and dicing of . wafers presumably takes . about 2-3 months.. Pad chips. 15 mm x 30 mm.

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