PPT-Addressing the System-on-a-Chip Interconnect Woes

Through CommunicationBased Design Veronica Eyo Sharvari Joshi System on chip Overview Transition from Ad hoc System On Chip design to Platform based design Partitioning the communication design into layers using the network on chip approach. 9 10 11 12 13 12481632 Performance normalized to 1MB LLC size MB 04 06 08 10 0 64 128 192 256 Percore Performance normalized to 1 core Number of cores 64 128 192 256 0 64 128 192 256 Chip Performance normalized to 1 core Number of cores brPage 4br br Jouppi Marco Fiorentino Al Davis Nathan Binkert Raymond G Beausoleil Jung Ho Ahn University of Wisconsin Madison HewlettPackard Laboratories University of Utah Abstract We expect that manycore microprocessors will push per formance per chip fro Natalie . Enright. . Jerger. Introduction. How to connect individual devices into a group of communicating devices?. A device can be:. Component within a chip. Component within a computer. Computer. Interconnect and Clocks. Chapter Outline. Trends and bounds. An OSI approach to interconnect optimization. Physical layer. Data link and MAC. Network. Application. Clock distribution. ITRS Projections. 6 Woes of Isaiah 5. We have heard before of the idea that history repeats itself. We certainly see time periods when it seems as though the world is overrun with wickedness. We think back to the wickedness in the days of Noah (Gen. 6:5-6). Design and Implementation of system software.. System Software: a variety of programs supporting the operation of a computer.. Typical system programs: OS, Complier, Assembler (Linker, Loader, Macro Processors), Text Editor, Debugger, …, . Proposal. Bob Ross, . Teraspeed. Labs. bob@teraspeedlabs.com. EPEPS 2015 IBIS Summit. San Jose, CA, October 28. , 2015. Draft Presented September 2, 2015 at the Interconnect Working Group. Copyright 2015 . 23. . (NKJV). 20.  . Woe to those who call evil good, and good evil;
Who put darkness for light, and light for darkness;
Who put bitter for sweet, and sweet for bitter!. 21.  . Woe to . those who are. Networking . Perspective:. Congestion and Scalability in . Many. -Core . Interconnects. George Nychis. ✝. , Chris . Fallin. ✝. , . Thomas . Moscibroda. ★. , . Onur. . Mutlu. ✝, . Srinivasan. 6 Woes of Isaiah 5. We have heard before of the idea that history repeats itself. We certainly see time periods when it seems as though the world is overrun with wickedness. We think back to the wickedness in the days of Noah (Gen. 6:5-6). Networking . Perspective:. Congestion and Scalability in . Many. -Core . Interconnects. George Nychis. ✝. , Chris . Fallin. ✝. , . Thomas . Moscibroda. ★. , . Onur. . Mutlu. ✝, . Srinivasan. Master’s . Project Defense. Sachin. . Chandran. Dept. of ECE, Auburn University. Project Advisor: . Dr.. . Vishwani. D. . Agrawal. Committee Members: . Dr.. . Victor P. Nelson, Dr. . Adit. Singh. hadrontherapy. applications – BG/PV group . L. Ratti. Università degli Studi di Pavia and INFN Pavia. INFN Bologna, . J. une 14. th. 2012. 2. (What might be the) Purpose of the experiment. Take advantage of the expertise and knowledge gained in the design of silicon pixel detectors for HEP (low noise electronics, fast readout architectures and DAQ) and in the use of advanced technologies (monolithic sensors, nanometer CMOS, vertical integration, quadruple well, active edge planar and 3D sensors) to develop high performance instrumentation for applications to photon science and . Matthew FarrensWETI Cross-Cutting Tools2Began by looking at optical for off-chip communicationLogical place to startBecame intrigued by on-chip possibilities for opticalMulticoreswill require high ban