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Dye and Pry of BGA Solder Jointswww.cascade-eng.comReliability Enginee Dye and Pry of BGA Solder Jointswww.cascade-eng.comReliability Enginee

Dye and Pry of BGA Solder Jointswww.cascade-eng.comReliability Enginee - PDF document

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Uploaded On 2015-10-01

Dye and Pry of BGA Solder Jointswww.cascade-eng.comReliability Enginee - PPT Presentation

CPU Failure InvestigationEquipment Used x2022 Dye and Pry TechniqueConclusions Majority of failures cracks from mechanical bend overstress test observed at SolderChip interfaceSummary o ID: 146553

CPU Failure InvestigationEquipment Used •

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