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IMB-CNM , Barcelona (Spain IMB-CNM , Barcelona (Spain

IMB-CNM , Barcelona (Spain - PowerPoint Presentation

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Uploaded On 2018-03-18

IMB-CNM , Barcelona (Spain - PPT Presentation

M Baselga P FernándezMartínez D Flores S Hidalgo V Greco A Merlos D Quirion RD50 project Fabrication of 200um thick p and n type pad detectors with enhanced multiplication effect ID: 656366

µm detectors multiplication cnm detectors µm cnm multiplication mask rd50 stop pitch run dopants matrix strips layer guard stripsxl ring design standard

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Slide1

IMB-CNM

, Barcelona (Spain)

M. Baselga, P. Fernández-Martínez, D. Flores, S. Hidalgo, V. Greco, A. Merlos, D. Quirion

RD50 project:

Fabrication of 200um thick p and n- type pad detectors with enhanced multi-plication effect

Giulio

PellegriniSlide2

RD50 Institutes participating:CNM-Barcelona, G. Pellegrini,

Liverpool University, Gianluigi Casse, UC Santa Cruz, Hartmut Sadrozinki 4. IFCA Santander, Ivan VilaUniversity of Glasgow, Richard Bates, INFN Florence, Mara BruzziCERN, M. MollJozef Stefan Institute , G. Kramberger, Slide3

What is new?New mask designed at CNM with many suggestions from all the groups.Thickness of the substrates: 200um.Only electron collection.

Improve surface isolation (p-stop).Different terminations.Pads with different sizes + Strips and pixel detectors.Diodes for timing applications, TOTEM, AFP and PPSDifferent test structures to measure the multiplication layer.Try heavy dopants: Ga.Slide4

RD50 LGAD New Run. Mask Design

Pad Detectors with Multiplication

Multiplication Area 8 x 8 mm 3 x 3 mmTermination:* P-Stop + N-Guard Ring * P-Stop + N-Guard Ring with JTE * JTE + P-Stop + N-Guard

Ring with JTEPixel Detectors

1 x 1 mm (6x6 Matrix)PIN Diodes (for reference)8 x 8 mm3 x 3 mm1 x 1 mm (6x6 Matrix

)

Top

& Bottom c

ircular windows in the metal layer.Slide5

Segmented

detectors

Best configurationfor diodesSimplest processSlide6

P

inLGADSlide7

RD50 LGAD New Run. Mask Design

Strip Detectors with Multiplication80

µm pitch160 µm pitchDC Strips (standard width)Spaghetti DC StripsXL DC Strips (extended implantation)PIN Strips80 µm pitch, 50 % Standard, 50 % Spaghetti160 µm pitch, 50 % Standard, 50 % SpaghettiTest StructuresSIMS LAL Group Structures

INFN Group StructuresElectrical and Technological CNM Structures

FEI4 Matrix (?)8 x 8 mm Active AreaSlide8

20 µm

32

µm32 µm

44

µm80um pitch stripsXLSlide9

100

µm

112 µm112

µm

124 µm160um pitch stripsXLSlide10

Ultra Fast Silicon DetectorsExperiments interested CMS-TOTEM-ATLAS.Time resolution required 10ps. Designed proposed by

Nicoló Cartiglia. In this mask, the UFSD detectors will be 1cm2. This is just to prove their functionality. Final detectors will be larger and may be thinner. See Nicolo´s Talk.Slim edgeClose to beam

sideSlide11

Active

GalliumSubstrate DopingActive BoronActive

GalliumSubstrate DopingActive BoronSimilar Diffusion coefficientsDifferent Solid Solubility (one order of magnitude lower in the case of Gallium)After diffusionAfter implantationHeavy Dopants: GaWhy multiplication decrease with irradiation? Try to use heavy dopants for the multiplication layer to reduce the initial acceptor removal effect.See Gregor´s talk.Slide12

Conclusion and future workNew mask design ready, we will buy it next week.Fabrication should start in July.Run due by end of October.Preliminary IV and CV will be done at CNM. Then the detectors will be diced and distributed between the participating institutes.