PPT-Nanometer InP Electron Devices for VLSI and THz Application

Author : tawny-fly | Published Date : 2016-04-07

2014 Device Research Conference June 2224 Santa Barbara CA MJW Rodwell UCSB S Lee CY Huang D Elias V Chobpattanna J Rode HW Chiang P Choudhary R Maurer AC Gossard

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Nanometer InP Electron Devices for VLSI and THz Application: Transcript


2014 Device Research Conference June 2224 Santa Barbara CA MJW Rodwell UCSB S Lee CY Huang D Elias V Chobpattanna J Rode HW Chiang P Choudhary R Maurer AC Gossard . V Kamakoti Department of Computer Science and Engineering Indian Institute of Technology Madras Chennai 600 036 India Email kamacsiitmernetin CAD for VLSI DESIGN I CAD for VLSI Design I Course Starts Here All The Best CAD for VLSI DESIGN I Evo 493 Nanometer Thick Microplaty Hematite in Indi an Iron Ores: Its Implication on Washing Manoj K. Mohanta, Rajendra K. Rath, Shobhana Dey and Kalyan K. Bhattacharyya Mineral Processing Division, © 2011 Project Lead The Way, Inc.. Science of Technology . Nanotechnology. Nanotechnology deals with materials and machines on an incredibly tiny scale, less than one billionth of a meter.. How Nanotechnology Works. Chad . Auginash. April 20, 2015. Abstract. High electron mobility transistor(HEMT) is a transistor that operates at higher frequencies, typically in the microwave range. They are used in applications that require high frequency, such as cell phones, RF applications, and some power applications. HEMTs are transistors that utilize the 2-dimensional electron gas(2DEG) created by a junction between two materials with different band gaps called a heterojunction. The two most commonly used materials to create the heterojunction are a highly doped n-type donor material, typically . Tufts University. Instructor: Joel . Grodstein. joel.grodstein@tufts.edu. Lecture 6: Discrete voltage and frequency switching. DVFS. What we’ll cover. DVFS: why we care. What is DVFS. Effects on clocking. Tufts University. Instructor: Joel . Grodstein. joel.grodstein@tufts.edu. Lecture 7: Dark silicon. Resources. The future of microprocessors. , . Shekhar. . Borkar. 2011. “The past 20 years were the ‘great old days’; the next 20 years will hopefully be the ‘pretty good new days’ ”. EE 194: Advanced VLSI Spring 2018 Tufts University Instructor: Joel Grodstein joel.grodstein@tufts.edu Verification What is verification? The design process (highly simplified) Talk to your customer EE 194 Advanced VLSI Spring 2018 Tufts University Instructor: Joel Grodstein joel.grodstein@tufts.edu Lecture 8: Biological computing Computers are made of… Transistors. Lots of them! How many transistors on an Nvidia Volta? . Beamline. @ IRIDE. E. . Chiadroni. . (LNF-INFN). S. Lupi (Sapienza, Università di Roma and INFN). Giornate di Studio su IRIDE. 14-15 March 2013. Laboratori Nazionali di Frascati INFN. Preliminary. Learning . Goal. Nanometer. -sized. things are very . small. . Students . can . understand relative sizes of different . small . things. How Scientists can interact with small . things. . Understand . rodwell@ece.ucsb.edu . 805-893-3244. Plenary, 2014 . German Microwave Conference, 10-12 March, Aachen. Mark Rodwell . University of California, Santa Barbara. Coauthors:. J. Rode, H.W. Chiang, T. Reed, S. Daneshgar, V. Jain, E. Lobisser, . 5. th. Annual X-ray FEL Collaboration Meeting, SLAC. Adrian . Cavalieri. Feb 5. th. , 2013. X-ray Pulse Characterization by THz Streaking. . Overlap. . streaking. . and. X-. ray. . pulses. on single-. Mark Rodwell, UCSB. Plenary, Asia-Pacific Microwave Conference, December 6, 2015, Nanjing, China. J. . Rode*, P. . Choudhary, B. Thibeault, W. Mitchell, . J. . Buckwalter, . U. . Madhow, A.C. . Gossard : . SASE FEL at . PITZ with 3D PIC code WARP. Background. Simulation results with Warp. Conclusion. Xiangkun. . LI. DESY-TEMF winter . meeting. DESY. , . Hamburg, 28.11.2019. B. ackground. A . proof-of-principle experiment on .

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