Japan TC Chapter Liaison Report March 30 2017 Ver 01 2 Outline Leadership Current Structure of PIampC Japan TC Chapter Meeting Information Document Review Summary Approved SNARFs Ballots ID: 574445
Download Presentation The PPT/PDF document "Physical Interfaces & Carriers" is the property of its rightful owner. Permission is granted to download and print the materials on this web site for personal, non-commercial use only, and to display it on your personal computer provided you do not modify the materials and that you retain all copyright notices contained in the materials. By downloading content from our website, you accept the terms of this agreement.
Slide1
Physical Interfaces & CarriersJapan TC Chapter Liaison Report
March 30, 2017
Ver. 0.1Slide2
2Outline
Leadership
Current Structure of PI&C Japan TC Chapter
Meeting Information
Document Review Summary
Approved SNARFs
Ballots
to be reviewed
Task Force
Updates
Other topicSlide3
3Leadership
Committee Co-chairs
Tsuyoshi
Nagashima
(
Miraial
)
Kenji Yamagata (DAIFUKU)
Tsutomu Okabe (TDK)
Step
down as a co-chair at the
last
PIC Japan TC Chapter meeting in December 2016.
Noriyoshi
Toyoda (Hirata Corporation)
Newly appointed by JRSC at the JRSC meeting on August 26, 2016.
Technical Architect
Shoji Komatsu (Acteon NEXT)Slide4
4
Current Structure of Japan TC Chapter
JA Shipping Box TF
Tsuyoshi
Nagashima
(
Mirial
)
Shoji Komatsu (
Acteon NEXT)
Physical Interfaces & Carriers
Japan TC Chapter
Tsuyoshi
Nagashima
(
Miraial
)Kenji Yamagata (Daifuku)Noriyoshi Toyoda (Hirata Corporation)
International 450mm Shipping Box TFTom Quinn (Intel)Shoji Komatsu (Acteon NEXT)
Technical ArchitectShoji Komatsu / Acteon NEXT
Fiducial Mark Interoperability TF
I&C Committee: M. Matsuda (Hitachi Kokusai Electric)PI&C Committee: S. Mashiro (Tokyo Electron)Silicon Wafer Committee: T. Nakai (SUMCO)Packaging Committee: S. Masuchi (DISCO)Traceability Committee: H. Tsunobuchi (KEYENCE)
Under Silicon Wafer Japan TC Chapter
Global PIC Maintenance TF
Larry
Hartsough (U.A. Associates)Shoji Komatsu (Acteon NEXT)
International 450 mm PI&C TFMelvin Jung (Intel)Shoji Komatsu (Acteon NEXT)
International Reticle SMIF Podand Lord Port Interoperability TFJan Rothe (GLOBALFOUNDRIES)
International Activities
TF under PIC Japan TC Chapter was discharged
Newly appointed
Tsutomu Okabe (TDK)
stepped down
from co-chair.Slide5
5Meeting Information
Last meeting
Japan Winter
2016 Meetings in conjunction with SEMICON Japan 2016
Wednesday, December 14, 2016
14:00-17:00
@Tokyo Big Sight Conference Tower, Tokyo
Next meeting
Japan Spring 2017 MeetingsWednesday, April 19, 2017 13:30-17:00@SEMI Japan office, TokyoSlide6
6
Document Review Summary at Japan Winter 2016
Meetings
in conjunction with SEMICON Japan 2016
NoneSlide7
7Approved
SNARF at Japan Winter 2016 Meetings in conjunction with SEMICON Japan 2016
Doc #
Description
TF
6130
Reapproval
of SEMI
E84-1109,
“
SPECIFICATION FOR ENHANCED CARRIER
HANDOFF PARALLEL
I/O
INTERFACE”
Global PIC Maintenance TF Slide8
8Ballots to be reviewed at Japan
Spring 2017 Meetings
8
Cycle
1
- 2017
Doc #
Description
TF
6130
Reapproval
of SEMI E84-1109,
“SPECIFICATION FOR ENHANCED CARRIER HANDOFF PARALLEL I/O INTERFACE”
Global PIC Maintenance TF Slide9
9ｑ
Task Force Updates [1/3]
Fiducial Mark Interoperability TF
Last TF meeting was held on November 18, 2015
T7 issues
#5890
Delete all position specifications from SEMI T7 because position specifications are also described on SEMI M1 and other related Silicon Standard.
The ballot passed with
editorial changes at the
Traceability Japan TC Chapter meeting on Dec. 18, 2015
and published as T7-0516. Disbandment of this TFTF leaders decided to propose disbanding this TF to each technical committee
If this proposal is agreed by all Japan TC Chapters of Assembly & Packaging, I&C, PIC, Silicon Wafers and Traceability,
then the TF will be discharged. Silicon Wafers Japan TC Chapter and Assembly & Packaging Japan TC Chapter agreed in March 2017 respectively.To be proposed at the next Japan TC Chapter meeting of PIC, I&C and Traceability TCs respectively. Backend alignment issues with introducing fiducial mark wafer is left. Would be discussed in Assembly & Packaging Japan TC Chapter after its disbandment.Slide10
10Task Force Updates [
2/3]
Global PIC Standards Maintenance Task Force (JA Side)
#6130,
Reapproval
of SEMI
E84-1109, “SPECIFICATION FOR ENHANCED CARRIER HANDOFF PARALLEL I/O INTERFACE”
SNARF was approved at the PIC Japan TC Chapter meeting on December 14, 2016
Ballot was submitted for Cycle
1-2017Rejects and comments to be reviewed at the TF meeting during NA Standards Spring 2017 Meetings Ballot results to be
reviewed at the PIC Japan TC Chapter meeting on April 19, 2017. Slide11
11Task Force Updates [
3/3]
International 450 mm Physical Interfaces & Carriers Task Force (JA Side)
#
5974: New Auxiliary Information: “450mm PIC INTEROPERABILITY”
SNARF
was approved
at the Japan TC Chapter meeting on December 16 in conjunction with
2015
The publication for this AUX was approved by the PIC Japan TC Chapter at the TC Chapter meeting on December 14, 2016 and would be forwarded to GCS and A&R for subsequent approval. However, Safety Check and IP Check were not done at this TC Chapter meeting on this approval procedure, so these checks to be done at the next PIC Japan TC Chapter meeting on April 19, 2017. Slide12
12Other topic
Proposal of New Standards, Specification for Lamella Carriers Used in Transmission Electron Microscopes
According to the decision at the EU TC Chapter meeting in October during SEMICON Europa 2016, the meeting to introduce proposal was held on December 13 at SEMI Japan Office in conjunction with SEMICON Japan 2016
Back ground of this standardization
Presentation on “Enabling HVM TEM metrology support - standards for TEM lamella carriers”
Proposed drafts of SNARF and TFOF
The
Japan TC Chapter agreed to support for conducting a survey regarding standardization of TEM and potential further standardization of TEM grid carrier.
SEMI
HQ will conduct this survey. Currently contents of survey form is under drafting.Slide13
Thank You!
For more information or participate in any Japan PI&C activities,
please
contact Chie Yanagisawa at SEMI Japan
(cyanagisawa@semi.org)Slide14
Backup14Slide15
155 Year Review
SEMI E84-1109
The
Global PIC Standards Maintenance TF
will
discuss what to do for SEMI E84-1109 and then propose any action at the next Japan TC Chapter meeting in conjunction with SEMICON Japan 2016.
SEMI E23-1104 (Reapproved 0710)
The TC Chapter did not decide any further support action to
this standard and
let it go inactive. Slide16
16Task Force Updates [4/4]
International Process Module Physical Interface (IPPI) TF
The document worked by this task force was published.
The disbandment of IPPI TF was approved, with pending the EU TC Chapter’s agreement, at the Japan TC Chapter meeting on April 15, 2015.
NA TC Chapter approved the disbandment of IPPI TF at the NA PIC TC Chapter meeting in conjunction with NA Standards Spring 2016 Meetings, so that the disbandment of this TF was completed.