Dmitriy Shapiro Mechanical Engineer David Sun Power Engineer ORv3 High Power Rack (HPR) Ecosystem Solution March 13, 2024 ORv3 was originally designed to support 18-36kW of power. With AI driving increasing power requirements, a new
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Presentation Transcript
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Dmitriy Shapiro
Mechanical Engineer David Sun
Power Engineer ORv3 High Power Rack (HPR) Ecosystem Solution March 13, 2024<br>
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ORv3 was originally designed to support ~18-36kW of power. With AI driving increasing power requirements, a new iteration called HPR (High Power Rack) is being designed at Meta in conjunction with rack, power, and cable partners Overview<br>
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ORV3 HPR Rack Leverages existing ORv3 rack with additional extension frame and deeper busbar
Extension frame allows mounting of all ORv3 accessory kits (doors, seismic kits, etc)
Up to 6x AC WHIPs can be routed through side of extension frame
Modular cross braces to ensure busbar & frame rigidity *Colors shown for differentiation.
Actual components are powder coated black Extension Frame* *Busbar Modular Braces* Mounting Locations<br>
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ORV3 HPR Rack New ORv3 HPR-specific TORC/BORC (Top/Bottom of Rack Containment) kits to seal off airflow between hot and cold aisle in data center.
Same blind mate manifold mounting locations as ORv3, but extension frame now provides protection for potential deeper manifolds BORC TORC Manifold Mounting Manifold Mounting<br>
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ORV3 HPR Rack Frame ballasts to offset increased busbar & extension frame. These are designed to increase the angle needed to potentially tip over the rack.
Angled extension frame bottom to overcome ramp angle requirements *Colors shown for differentiation.
Actual components are powder coated black Rack Bottom View<br>
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ORV3 HPR Busbar 35mm width remains to minimize impacts to system designs
Depth increased by 125mm, weight increased by 65kg
Increased busbar to rack mounting robustness
Improved grounding (see ORV3 HPR Grounding Scheme) Busbar Top View Top of Rack Mounting Bottom of Rack Mounting<br>
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ORV3 HPR Busbar Simulations were conducted to validate the following potential configurations ORV3 HR<br>
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ORV3 HPR Grounding Scheme Alternative ground current paths could potentially cause overrating of the IT gear connector ground contacts and power return pins, leading to overheating.Grounding scheme changes will mitigate the risk
Current ORV3 ground scheme: ORV3 HR<br>
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ORV3 HPR Grounding Scheme Changes Connect 50V_RTN busbar (copper) to busbar cage (steel) through metal ground blocks on top and bottom of the rack ORV3 HR<br>
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ORV3 HPR Grounding Scheme Changes Change the aluminum ground bar material to low conductivity metal such as steel. ORV3 HR<br>
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ORV3 HPR Grounding Scheme Changes Create a new SKU of IT gear input busbar clip without ground bracket.
Busbar clip WITHOUT the ground bracket shall be used for IT gears with non-isolated 50V input, i.e., where 50VRTN is connected to the chassis in the IT gear.
Busbar clip WITH the ground bracket shall be used for IT gears with isolated 50V input, i.e., where 50VRTN is floating from the IT gear chassis. ORV3 HR<br>
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ORV3 HPR Grounding Scheme Changes The ground bonding of the PDB/MB board in non-isolated input IT gear shall be designed to carry the full fault current when there is a 50V short to the chassis. ORV3 HR<br>
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ORV3 HPR AC WHIP Tapbox plug: NA L22-20P -> L22-30P, EU Remains IEC309
AC Input connector keying feature flipping 180° for 30A shelf & WHIP
NA power cord changing from 12AWG (18mmOD) to 8AWG (27mmOD) to comply with UL817. EU power cord remains the same
90° overmolded bend to overcome bend radius challenges
To be routed along the extension frame ORV3 HR Keying Feature Flipping 90° Bend<br>
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ORV3 HPR PSU + Shelf AC Loss & Pulse Management signal cable connections
Eliminated 3V gap between PSU and BBU output voltages
Power Monitoring Module (PMM) to monitor system status, connected to upstream rack management device<br>
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ORV3 HPR BBU + Shelf AC Loss & Pulse Management signal cable connections
Eliminated 3V gap between PSU and BBU output voltages
Power Monitoring Module (PMM), same as on PSU<br>
