TOTAL Solution Provider in THE Asia Pacific Mission Consistently adding value to customer by providing innovative timely and reliable Reverse Logistics Solutions Vision Global Leader in Reverse Logistics ID: 930892
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Slide1
Corporate Presentation
Slide2A leading Reverse Logistics &
TOTAL Solution Provider
in THE Asia Pacific
Slide3Mission
“Consistently adding value to customer byproviding innovative, timely and reliable Reverse Logistics Solutions.”Vision“Global Leader in Reverse Logistics”
Slide4Founded
Man
PowerCore BusinessRepair , Refurbishment and Assembly : ISO 9001:2015 , ISO 14001:2015
US$ 30 Million
Company Profile
Turn Over
Certificates
Slide5Manpower Break up R Logic India Backend Operations - Total700 +
Manpower
CountManagement8Managers15Engineers60Leaders & Technicians225
Support & Office Staff
80
Operators
320
Slide6R-Logic Group Service Offerings
Front End Customer
Services
Service Center
Onsite Repair
Back End Repair
Service
Return to Bench (L4 repairs)
RMA / Warranty Management Services
Failure Analysis
Parts, Buffer & Scrap
Management
Parts Sourcing
Inventory mgmt.
Parts Screening
Parts Fulfillment
Administrative & Logistics Support
Data reporting
Payment Administration & Collection
Out Of Warranty quotation
Logistics support
End-to-End Reverse Logistic Solutions
Slide7Hyderabad
Chennai
Sydney
Bangkok
KL
Singapore
JB
Shanghai
Repair Hub
Partners
First Level Centre
Indonesia
New Delhi
Mumbai
KL
JB
KPR
MSI
ASIA Pacific Coverage
Samsung Front
End, Cochin
Samsung
Front end,
Hyderabad
Front End Service Center
Bangalore
Slide8Consumer
Brands
IT
Customers
ODM
R-Logic OEM/ODM Partners
Firewall Repairs for Flex
Israle
will be shortly supported.
Slide91999 R-Logic Singapore founded
2003
R-Logic ShanghaiIncorporated ISO Certified 2004R-Logic IndiaIncorporated
2006
coverage to
Australia and
Thailand
2007 coverage to
Japan
2008
R-Logic Malaysia Incorporated
Power
Supply
Tape Back Up
Hub and
Switches
LCD Display
Notebook
Printer
Memory
1999 2003
2004
2006 2007 2008
Rlogic Group Milestones
Slide10Rlogic India Milestones
2009 HP (ODM) authorized
R-Logic (I) as LCD/Hinged up repair partner2009R-Logic (I) Dell RMSD, Mem & MB audit approved 2009Printonix and Samsung (SDC) authorized LCD repair partner2010 Sony authorized R-Logic (I
) as LCD repair partner
2011 LNT authorized
R-Logic (
I
) as LCD repair partner
2012 Breview authorized
R-Logic (
I
) as LCD repair partner
2013 BOE , Toshiba &
Samsung (SIEL) authorized LCD repair partner
Formed
global alliance
RMSD & MB
2009 2010
2011
2012 2013
Slide11Rlogic India Milestones
2014
DELTA authorized R-Logic (I) as PSU repair partner, 2015 CISCO , K Tronics, LGE,authorized R-Logic (I) as LCD repair partner 2016 Rlogic India- Delhi operations Established, Dell E & T
2017
Benq
,
Ltech
, ECS,INTEL,VU Technologies
2014 2015
2016
2017 2018
2014
Sony authorized
R-Logic (
I
) as ASC for Walk in & onsite service centre
2014
Samsung authorized
R-Logic (
I
) as Flag Ship centre
2018 Delta Solar inverter, EMQOS Sensor ,Future Business Group, TSC
Slide12Power
Supplies
Tablets &
Tough books
LCD / LED Panels for Note Book, TV’s . Computer Monitors, Smart phones.
Mother Boards ( Desk Top and Note Book)
Storage Units ( TBU’s, HD & ODD)
Routers & Switches
Memory
Line printers
Products
Slide13Clean Room - Class 100 & 1000
Slide14MSI Location
Shop Floor Bangalore
Slide15NPI /
ECN
SAP B1 covers :ProcurementInventoryRcube
Centralized
OEM System
Updation
System Driven
Test Sequence
Live Broadcast
of Customer &
Technician KPI’s
Set & Monitor (Reports)
Customer KPI
Analyze
Inflow, Consumption,
Yield & Forecast
Configurable Repair Routing,
RLI Fault code mapping
with customer Fault code
Integrated System to
Capture NPI Information
& ECN Implementation
Employee
Management
Component Part
s
linking to Model
Invoice Generation
as per Customer
Business Logic
Automated Daily Shipment
alert to Customers &
Internal tracking Reports
Learning & Certification
management
Buffer stock & Issue management
IT system
R
-Logic
R
epair e
R
p System
Slide16R-Logic Technology Services ( India) Pvt Ltd,
(EMS Division)……..A Start Up
Survey No 213, Gabbadi village,Kanakapura Road,Harohalli Hobbali,Ramanagara Dist, Karnataka -562112
Slide17New Business Vertical – Forward Integration
Key Points and objectives on Forward Integration
EMS Low Volume and High Mix Manufacturing Dedicated EMS Proto Line Extended arm of the Hardware Design HousesQuick Turn around of proto and facilitate to meet on time to market beat the time pressure
Exclusivity for Proto / NPI Line and will run several iteration of the proto based on the need
Focus on OEM/ ODM requirement and flexibility in manufacturing exist.
Pilot Initial run and Low volume also catered based on the need.
Space available for the expansion.
After sales service support is core competence of R logic for a decade.
New Factory – Foot Print
Slide19New Factory – Foot Print
Slide20Master List of Equipment’s- EMS Factory
Production Equipment Master List
Sl.no
Equipment Name
Make
Mode
Spec
1
Automatic PCB Loader
Suntek
MML-330
Pitch 10mm to 40mm
Adjustable Magazine
Adjustable pressure
2
Solder Paste Printing Machine
HIT
520LS
Auto laser tooling
Auto screen Adjustment
2D Solder paste inspection
3D solder paste check
Edge & Top clamping
3
Pick & Place
Mycronics
My300LX
192# 8mm feeder capacity
Intelligent feeder concept
Auto Conveyor adjustment
On the fly mount order optimization
Intelligent feeder concept
Tool collision Avoidance
Automatic feeder and component recognition
4
Reflow Oven
Heller
1826MK5
8+2 Zones
Inbuilt KIC Profiler
Board Drop sensor
Center
board support
Intelligent Exhaust system, Temp Gradient of 0.1 Degree C
5
AOI
TRITR7700QIntelligent programming interface3D solder joint inspectionMulti Phase lightingIntelligent auto conveyor system warp compensation
Slide21Master List of Equipment’s- EMS Factory
6
X-Ray Inspection
Seamark
X-7600
Stage 360 °rotation, axis 7 linkage
Software setting voltage and current
Automatic detecting BGA soldering
Visual image navigation
7
Solder paste inspection
Genitec
GAM-70
All operation are easy and using windows interface.
Survey thickness solder by automatically.
All surveyed values can be recoded.
Calculate manufacture ability degree automatically(
Cp,Cpk,Cpm
)
8
Component counting machine
Japanies
YS-802
Full automatic counter, high accuracy, no error.
Optical fiber sensor for detecting empty components.
Optional bar scanner and code printer, convenient for component management.
Use patent reflector, humanized operation platform.
9
Solder paste mixer
Nstar
Nstar600
Running speed First times:1400RPM:the second times:400RPM
Time setting 0.1-9.9 second ,adjust 0.1S per times.
10-30 second, adjust 1.0S per times
Production Equipment Master List
Sl.no
Equipment Name
Make
Mode
Spec
Slide22Master List of Equipment’s- EMS Factory
Production Equipment Master List
Sl.no
Equipment Name
Make
Mode
Spec
10
Dry Cabinet
Bously
AV320
Digital display for temperature and humidity.
Digital control of humidity.
Humidity Range: Available as per customer request between 1% ~ 60%RH.
The error of humidity value is 3% RH Available in Cold Rolled Steel.
ESD sage and anti corrosion coating.
Shelves adjustable on slotted columns.
11
Ultrasonic stencil cleaning
SAWA
SC5000GBS
Ultrasonic Cleaning
12
BGA Rework Machine
SEAMARK
Bottom and Top Heater
13
Baking Oven
PSM Scientific
PSM/HAO-04
Temperature range ambient to 200
˚
C
2# Heater
2# Blower
Slide23Master List of Equipment’s- EMS Factory
Quality Equipment Master List
Sl.No
Equipment Name
Make
Mode
Spec
1
Digital Venire Caliper 1
Mitutoyo
CD-P12"S
0~300mm
Measurement Accuracy +/-.0015"
Range 0-12 , 0-300
Display Type LCD
Resolution .0005”/0.01mm
2
Digital
Vernier
Caliper 1
Mitutoyo
CD-P12"S
0~300mm
Measurement Accuracy +/-.0015"
Range 0-12 , 0-300
Display Type LCD
Resolution .0005”/0.01mm
3
Surface Resistance Meter
Sharing Corporation
Z2032
1. Measurement Range : 10^3 to 10^11 ohms/sq, 0 – 50C
2. Measurement accuracy : Resistance 10%, Temp +2C
3. Indication : LCD backlit display
4
Digital Micrometer
INSIZE CO LTD
IP65
0-25mm
Resolution: .00005"/0.001mm. IP65 dust/waterproof. Button function: on/off, set, inch/mm, ABS/INC, data output. Data output. SR44 or LR44 battery, automatic power off.
5
Digital LCR-Q-METER-SORTER
Aplab
4912
Measurement Ranges
Test
Freqency
: 100Hz & 1KHzInductance : 0.1μH to 9999H.Capacitance : 0.3pF to 9999μF.Resistance : 0.001 ohm to 100M ohm.
Slide24Master List of Equipment’s- EMS Factory
Quality Equipment Master List
Sl.No
Equipment Name
Make
Mode
Spec
6
Pin Gauge
Walton Trading Company
Standard Pin Gauge
0.20mm to 5.00mm
7
Digital LCR-Reader
SIBORG SYSTEMS INC.
LCRR1-SB
Test Frequency: 100Hz, 1kHz, 10kHz Test Signal Level: 0.45 +/- 5%
Vrms
Sine Wave
Basic Accuracy: 0.5% Basic accuracy
Resistance
1% R<1Ohm 0.5%
1Ohm<R <100KOhm
1% R>100KOhm
Inductance
2% L<10UH
1%10UH<L<1mH
2% L>1mH
Capacitance
2% C<100pF
1% 100pF<C400pF
2% C>100pF
8Digital Trinocular Microscop
ALMICRO
DSZ-88
10X Eye pieces
5X-45X Zoom objectives
5MP camera with PC/Laptop Interface and image capture
Slide25Master List of Equipment’s- EMS Factory
Quality Equipment Master List
Sl.No
Equipment Name
Make
Mode
Spec
9
Surface Plate
KENCY
NA
Stone Surface Finishes
Length and Width : 630mm*630mm
Height : 80mm
10
ESD Combo Tester
STACLEAN TECHNOLOGY INDIA PVT.LTD
CT-01
Wrist Strap Range : 0.75-10Meg Ohms
Left Food wear Range : 0.75-10Meg Ohms
Right Food wear Range : 0.75-10Meg Ohms
Accuracy : +/-10%
Slide26EMS Line Configuration
DIP/Wave soldering Line
Wave soldering JT 450W – Q4’2020
Manual Hand Soldering or Robot Selective Soldering until Q4’2020
Offline Inspection
Equipments
3D- X ray- Seamark X7600
BGA rework Machine
3D SPI – GAM70 Table Top
Ultrasonic Stencil Cleaning
Automated PCB Loader
Solder Paste Printer
Pick and Place
Reflow
AOI
HIT 520LS
MYCRONIC LX300-15
CPH 20K, Two Head
Heller MK528-
10 Zone Reflow
TRI 7700Q- 3D AOI
MML-330
Slide27SMT
Minimum chip comp size
01 005” Maximum component size 64 x 64 mm
Maximum board handling size
457 x 450 x 6 mm
Minimum board handling size
65 x 65 x 0.3mm
Placement accuracy
0.02 mm ( Chip), 0.04 mm (QFP)
Cpk
2.0>
Rated Speed
20000 CPH
PTH
Soldering (THC and SMD)
RoHS compliant (lead free)
Manual line.
.
INSPECTION
3D Automatic
Visual Inspection (AOI)
Maximum 510x510 mm and
Minimum 50x50 mm
TESTING
Equipments and machines
Reliability Test Outsource
In Circuit Tester ( Need Basis )
Various type of Testing and debug Instrument including
LCR, CRO’s, available.
Special Process
Conformal Coating.
Manual In house and Automatic ( Outsource )
Line Technical Capability
Slide28PCB Size
Min:50 X 50
Max: 445 X 330Magazine size460 X 400 X 563
Transfer Direction
Left to right , Right to Left
PCB Loading time
6 Seconds (Adjustable)
No of Magazine Loading
2
Selectable Pitch
10,20,30,40 mm Pitch (Adjustable)
Power Supply
AC 220V , 50HZ
Typical Features
PLC Program Control
Tower light Display for Machine Status
Selectable Pitch Setting
High Precise for Magazine Stop Position
Flexible platform to Suit Standard magazines
Pusher position Adjustable to Centre of the magazine
Soft Touch LED Membrane Control Panel
Automatic diagnosing And fault code display
AUTOMATIC PCB LOADER-SUNTEK
Machine Spec and Salient Features
Slide29Mesh
Min Size (mm)
550*550Max Size (mm)736 * 736
PCB
Max Size (L*W mm)
50*50
Min Size (L*W mm)
610 * 450
Thickness (mm)
0.4 to 6
Max Weight
4Kg
PCB Under Clearance
14mm
Printing
Speed
1 to 300mm/sec
Pressure
4Kg to 20 Kg
Cycle Time
8 Sec
Accuracy
Alignment Repeated
±12.5µm @6
σ
Printing Repeatability
±25µm @6
σ,
Cpk≥2
SOLDER PASTE PRINTING-HIT 520LS
Ultrasonic Generator
W 255 D 360 H 161㎜ AC Cord 1.8m
Cleaning Head
W 117 D 117 H 100㎜ Cord 2.5m
Tray
W 600 D 700 H 20 ㎜
Ultrasonic
40kHz 130W
Power
AC100, 110, 120, 220., 240V ; 50/60Hz; 180VA
Weight(Generator)
9.8kg
Weight(Head)
1.3kg
Power
AC100, 110, 120, 220., 240V ; 50/60Hz; 180VA
ULTRASONIC STENCIL CLEANING-SAWA S5200GBS
Slide30PICK AND PLACE- MY300LX-HYDRA
Machine Make And Model
Mycronic, MY300 LXPLACEMENT SPEED AND ACCURACY – MY300LX-11/15
Rated speed (1) 16 000 CPH
(1) 16 000 CPH
IPC 9850 chip net throughput
(2, 3) 13 800 CPH
IPC 9850 chip tact time
(3) 0.250 s
IPC 9850 chip repeatability 3 (X, Y, Theta) (3, 6)
45 μ
m, 1.8°
IPC 9850 chip accuracy @ Cpk = 1.33 (X, Y, Theta) (5, 7)
75 μ
m, 2.6°
IPC 9850 fine pitch repeatability 3 (X, Y, Theta) (4)
21 μ
m, 0.05°
IPC 9850 fine pitch accuracy @ Cpk = 1.33 (X, Y, Theta) (4, 5)
35 μ
m, 0.09
FEEDER CAPACITY
FEEDER CAPACITY 8 MM TAPE
192
BOARD HANDLING
Maximum board size
460 x 510 mm
Maximum board size with ML adaptor (1)
419 x 443 mm
Minimum board size
70 x 50 mm
Board thickness range
0.4–6.0 mm
Board edge clearance top and bottom 3.2 mm (0.13”)
3.2 mm (0.13”)
Top side clearance
15 mm (0.59”)
Bottom side clearance
32 mm (1.25”)
Maximum board weight
4 kg (8.8 lbs)
Board transfer height
Conforms to SMEMA standard for board transfer height.Height adjustable from 880 to 975 mm
Operation mode
Inline, manual, inline odd-board,
left-to-right¦/¦right-to-left.
VISION CAPABILITY
FIELD OF VIEW
MIN PITCHMIN LEAD WIDTHLeaded components80 mm (3.1”) 0.10 mm (4 mil) 0.05 mm (2 mil)Bumped components
80 mm (3.1”) 0.15 mm (6 mil) 0.08 mm (3 mil)COMPONENT RANGEHIGH PRECISION MOUNTHEAD – MIDASComponent rangeChip (from 01005), SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd shape, surface-mount connectors, through-hole components, CCGA, DPAK, Alcap, Tantalum
Component specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005) Max: 140 x 73 x 15 mm (5.51” x 2.87” x 0.59”) (1) Max: component weight: 140 g (2)HIGH SPEED MOUNTHEAD – HYDRA Z8LComponent rangeChip (from 0201), SO28, SOT223, SOJ20, PLCC32, MELF,SOD, TSOPComponent specification Min: 0.6 x 0.3 mm (0.02” x 0.01”) (0201)
Max: 8.70 x 8.70 x 5.60 mm (0.34” x 0.34” x 0.22”)ELECTRICAL VERIFIER Resistor, capacitor, unipolar capacitor, diode (forward voltage, reverse current), Zener diode (voltage drop), transistor (current gain)
Slide31Edge Hold Conveyor System
Maximum PCB Width
22" (56 cm) Space Required Between PCB's 0.0" (0.0 cm)
Conveyor Length On-Load
18" (46 cm)
Conveyor Length Off-Load
18" (46 cm)
Heated Tunnel Length
105" (254 cm)
Process Clearance Above Mesh Belt
2.3" (5.8 cm)
Mesh Belt Pitch
0.5" (1.27 cm)
Maximum Conveyor Speed
74"/Min (188 cm/min.)
Forced Convection Zones
Top & Bottom
Top 8, Bottom 8
Heater Type
Instant response open coil
Heater Material
Nichrome
Profile Change Time
5 – 15 minutes
Temperature Control
Accuracy of Temperature Controller
±1˚C
Cross-Belt Temperature Tolerance
±2˚C
Heater Wattage Per Zone
6000 w**
Temperature Range Standard
60-350˚C
Cooling Systems
Number of Cooling Zones Standard
2
REFLOW OVEN-HELLER 1826MK5
Slide32Items
Contents
ModelX-7600 X-RAY launching tube
Tube Type
Sealed type X-ray tube
Maximum tube voltage
130kV
Maximum tube current
0.15mA
Focal size
3 um
Magnification
Geometric magnification:150X
System magnification:1500
Detector
Image speed
35 fps
Resolution
1500*1500
Tilt angle
Stage360°rotation,Detector°Tilting,
Easily to detect the BGA soldering
Cabinet Specifications
Stage size
590mm*450mm
Dimension
L:1630mm, W :1850mm, H:1650mm
Net Weight
1400kg
Input voltage
AC 110-220V (+10%)(international general power supply)
X-ray leakage amount
≤1 u Sv/h
operating system
Windows 7
Total power
1.5Kw
X-RAY INSPECTION-SEAMARK X-7600
Slide33AUTOMATIC OPTICAL INSPECTION TRI - TR 7700 Q
PCB & Conveyor System
Min. PCB Size50 x 50 mm Max PCB Size510 x 460 mm
PCB Thickness
0.6 - 5 mm
PCB Transport Height
880 - 920 mm
Max. PCB Weight
3 kg
Top Clearance
25 mm
BOT Clearance
40 mm
EDGE Clearance
3 mm
Pre-/Post-Reflow Inspection Functions
Component
Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift,Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component
Solder Joint
Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient
Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger
Scratch/ Contamination
Optical & Imaging System
Top View Camera
4 Mpix camera
Lighting
Multi-phase RGB+W LED, 3D Quad Fringe Pattern Projection
Optical Resolution
4 Mpix
3D Height Range
0 - 20 mm
Imaging Method
Stop-and-Go
Inspection Speed
Imaging Speed (cm2/sec)*
21.7(Depends on Size it varies)
Options
Barcode Scanner, Repair Station, Offline Editor, OCR, Yield Management System (YMS 4.0),YMS Lite, Support Pin
Slide34SOLDER PASTE INSPECTION
Visual Range
2.5mm X 2mmFocusing powerx90Measurement Table
350 (W) X 265 (L) mm
Repeat Accuracy
± 0.0035 mm
Resolution
0.007mm
Inspection Method
Laser Vision
Computer Specification
IBM Compatiable Interface
Screen
15" LCD
Lens
Color CCD Camera
Light
LED Ring Light
Focus
Focusing Control System
Power Consumption
400VA
Power
110V,60HZ/220V,50HZ
Features
All operations are easy and using Windows interface in Chinese/English version
Survey the thickness of tin solder by Automatically
Survey the length and width manually, and the gap of tin soled
Calculate the measure of area, the measure of cross-section and the measure of volume Automatically
All surveyed values can be recorded to a file and be printed to a report
Provide the diagrams of thickness distribution and control diagrams of X_BAR_R
Calculate manufacture ability degree automatically(Cp,Cpk,Cpm)
It Can have separate record according to every ifferent production line
It can adjust focal distance in different thickness of PC boards
It can be called to sample periodically
Slide35TECHINICALPARAMETER
Voltage
AC110V/220V, 50/60Hz(convertible)Capability5000 pcs /30s
Power
consumption
30W(2 Motors)
Counting
volume
99999 ~ 99999pcs
Size
L470*W300*H180mm
Net
Weight
10kg
Reel
Diameter
Suitable for SMD Reel with any diameter
Reel
Interval
Distance
2,4,8,10,12,16,24,32,44,56mm
Reel
Width
8,12,16,24,32,44,56mm
FEATURES
Full automatic counter, high accuracy, no error.No risk of damaging the tapes, special design to prevent SMD reel from dropping.Count forward and backward, double-checking ensures accuracy, built-in memory allows you to preset count quantity.
The counter use drafting LCD screen, easy operation, full English display.
Use patent reflector, humanized operation platform.
Optional bar scanner and code printer, convenient for component management.
English panel and user manual, easy operation and use-friendly interface.
Optical fiber sensor for detecting empty components.
COMPONENT COUNTING MACHINE
Slide36Working voltage
AC220V(60HZ)40W
Running speedFirst times:1400RPM:the second times:400RPMSize
410*410*490MM(W.D.H)
Net weight/gross weight
40KG/45KG
setting time
0.1-9.9 second ,adjust 0.1S per times.
10-30 second, adjust 1.0S per times
SOLDER PASTE THAWING MACHINE
45X Microscope
Features
10X Eye pieces facility
5X ~ 45X Zoom objective
6V and 21 Watts incident spot light illuminator.
PC/Laptop USB Interface with Image capture facility.
5MP Camera
Slide37Advantages
The dehumidification unit is durable
Capable of low humidity adjustment using the humidity control with alarm monitoring system.Low power consummation with inbuilt stabilizer specification.Maintain the low humidity and normal temperature.High space storage capacity.No vibration and dust free cabinet.Features
Digital display for temperature and humidity.
Digital control of humidity.
Input supply:220V ~ 240V, 50Hz.
Humidity Range: Available as per customer request between 1% ~ 60%RH.
The error of humidity value is 3% RH (assuring set of humidity of 10%RH, then actual will be with in 7%RH ~13% RH) Available in Cold Rolled Steel.
ESD sage and anti corrosion coating.
Shelves adjustable on slotted columns.
DRY CABINET
Specification
Power Supply
220V , 50HZ Single phase
Heating Load
3 KW
Max Temp
200 Deg
Min Temp
Ambient
No of Heaters
2
No of Blowers
2
BAKING OVEN
Slide38Rlogic
for Electronic Manufacturing Services
Slide39EMS Services provided & typical advantage in R-Logic
Turn Key / Job work
Competitive component Sourcing ERP-SAP in Business with SFCS ( Shop floor Control System) Product Traceability 3D X RAY For Manufacturing and also stand alone service Bonded Manufacturing facility . Import and Export is Free of Duty For Domestic , Deferral Duty at the time of removal of Goods. Import is Free of Duty PCB Assemblies Through Hole.( Operational Q4 2020) Sub-Assemblies. Complete Box Build and Testing. Environment Friendly Lead free Process. Conformal Coating ( Outsource )Services Being Extended
Slide40Customer Care
CFT team
Centralized Documentation CenterCustomer Complaints ManagementWeekly/Monthly Quality Reporting
RMA process
Process sequence control & data integrity
MQA
(Manufacturing Quality Assurance )
Quality Plan
Process Validation
Line Qualification
First Article Inspection
Test Validation & Verification
Calibration Management
SPC , ESD & MSD Control
SQM
( Supplier Quality Management )
Supplier Selection &
Qualification
Part Development & Qualification
Supplier Training & Development
Supplier Rating
IQC
( Incoming Quality Control )
Sampling Inspection
SCAR ( Supplier Corrective Actin Request )process
Monthly Incoming Material Quality Reporting
Quality Management Systems
ISO 9001-2015 Certified
ISO14001-2004 Certified
Need to extend to EMS as New Vertical.
Key Process Quality at
RLogic
Slide41Process
Feedback
Process FeedbackRework and InspectionRework and InspectionProcess FeedbackProcess Feedback
START
Receiving material
Incoming inspection
Material Kitting
PCB & MSD component baking if required
PCB serail# label prinitng & registration
Bare PCB Loading
Solder Paste printing TOP & Stencil cleaning
PCB Inspection
Solder paste
Inspection
F
F
P
P
Component Mounting -Pick & Place
R
Manual placement (If required) / pre reflow inspection
Reflow
P
F
AOI
F
Post Reflow Inspection
P
Process
Feedback
QA
P
F
QA Stage 1
(Sampling )
X Ray Inspec
Board / 2 Hrs
Component preparation
F
P
Manual Insertion Stage 1 ~ 7
Pre Wave Inspection
Wave Soldering
P
Pre Wave Inspection
Rework and Inspection
F
QA
F
P
F
Power On Testing main Board
DebugBOX Build Assy/ Series of Assly Ops QA Stage 2(Sampling)PFP FCT Testing Product
DebugFRework the whole lot (Z)
P PRework / Touch up
F FQC Test(Sampling)Packing-1 Gift BoxPacking-2 Master PalletisationShrink wrappingShipment EndP
Process FeedbackNote:"P" is Pass, "F" is Failed, "R" is Rework," D" is Debug and "Z" is rescreening / analysing in the above SFCA flow chart.
SOP EMS Manufacturing Process Plan with Shop Floor Controlled System(SFCS)
Implementation in Phase 2 End of 2020
Slide42Security Systems at Rlogic
Slide4343Please visit us on https://www.youtube.com/watch?v=hYRlrWKo4yQ