/
CLIC AS internal metrology CLIC AS internal metrology

CLIC AS internal metrology - PowerPoint Presentation

accouther
accouther . @accouther
Follow
344 views
Uploaded On 2020-08-28

CLIC AS internal metrology - PPT Presentation

Risto Montonen Ivan Kassamakov Edward H ӕ ggström and Kenneth Österberg This document describes an optics based technique to measure the internal shape of CLIC AS and to align the disk stack ID: 806765

µm internal shape optical internal µm optical shape clic system external disk resolution measurements scanning probe reference axial micron

Share:

Link:

Embed:

Download Presentation from below link

Download The PPT/PDF document "CLIC AS internal metrology" is the property of its rightful owner. Permission is granted to download and print the materials on this web site for personal, non-commercial use only, and to display it on your personal computer provided you do not modify the materials and that you retain all copyright notices contained in the materials. By downloading content from our website, you accept the terms of this agreement.


Presentation Transcript

Slide1

CLIC AS internal metrology

Risto Montonen, Ivan Kassamakov, Edward Hӕggström, and Kenneth ÖsterbergThis document describes an optics based technique to measure the internal shape of CLIC AS and to align the disk stack.

20.6.2013

1

Slide2

Introduction

Accelerating Structures (AS) comprising OFE Cu disks undergo permanent thermo-mechanical deformations during assembly and operation:assembly: AS disks suffer creep deformations [1] due to diffusion bonding [2],operation: pulsed RF waves [3] induce intense local pulsed thermal stresses into the RF cavity walls [4].These deformations result in micron-level misalignments in AS reducing CLIC luminosity.

Sub-micron accuracy topographic contact-scanners to measure shape of single disks exist [6]. However, these techniques are unfeasible for disk stack internal shape quantifying purposes.

Alignment method based on

intracavitary

technique has to be developed.

Shape error

Tolerance

1

µm [2,5]

5

µm [3]

140 µrad [2,5]

Slide3

Aim of the study

The presentation focuses on the design of:Sub-micron accuracy and non-destructive optical device to measure the internal shape of CLIC AS disk stacks.Scanning system for “internal” measurements with on-line correlation to “external”

measurements.

Slide4

General view of the device

1. Interferometer 2. Optical probe

3. Scanning system

Slide5

Optical device. Interferometer

F

-1

Frequency-domain short-coherence interferometry

Broadband light:

= 2.0 µm, -3 dB system bandwidth =

= 0.1 µm

Spectral

interferogram

constructed from reference and sample

reflection

Axial pixel size

= point-to-point separation in A-scan < 1 µm

Axial resolution

20 µm [7]

10 mm

axial depth range

requires 0.1 nm spectral resolution

[7]

 

 

 

Slide6

Optical device. Optical probe

Tungsten carbide housing

IR single mode optical fiber: NA = 0.11

GRIN collimation: pitch = 0.25, f = 0.45 mm

,

lateral

resolution = spot size < 100 µmIR mirror provides 90° side

view

Slide7

Scanning system

AS disk stack rotated and optical probe

pulled out

Cylindrical coordinate system

Reference configuration defined by the first

disk

Slide8

Scanning system

Internal and external measurements should be comparable.Internal and external measurements introduce their own metrological reference configurations.To obtain comparable data we should:fix the internal and external measurement devices on each other,m

easure the internal and external shape in parallel.

Internal and external measurement data in the same

global metrological reference configuration

[8]

Slide9

Conclusion

Sub-micron accuracy and non-destructive AS internal shape measuring technique is needed.Frequency-domain short-coherence interferometry with fiber coupled optical probe provides AS internal topographic scanning with 20 µm axial resolution, < 100 µm lateral resolution, and 10 mm depth

range.To obtain comparable

data the internal

and

external measurements should be done in parallel (devices fixed to each other).Work for the first practical setup is currently ongoing

Slide10

References

[1]

D.M. Owen, T.G. Langdon, Materials Science and Engineering A

216

(1996) 20-29

.

[2] A Multi-

TeV

linear collider based on CLIC technology: CLIC Conceptual Design Report, edited by M. Aicheler, P. Burrows, M. Draper, T. Garvey, P. Lebrun, K. Peach, N.

Phinney, H. Schmickler

, D. Schulte, and N. Toge.[3] H. Braun et al.,

CERN-OPEN-2008-021; CLIC-Note-764.[4] M. Aicheler, S. Sgobba, G.

Arnau-Izquierdo, M. Taborelli, S. Calatroni, H.

Neupert, W. Wuensch, International Journal of Fatigue 33 (2011) 396-402.

[5] R. Zennaro, EUROTeV-Report-2008-081.[6]

S. Atieh, M. Aicheler, G. Arnau-Izquierdo, A. Cherif, L. Deparis

, D. Glaude, L. Remandet, G. Riddone

, M. Scheubel, D. Gudkov, A.

Samoshkin

, A.

Solodko, IPAC’11

, San

Sebastián

,

Spain.

[7] R.A.

Leitgeb

, W. Drexler, A.

Unterhuber

, B. Hermann, T.

Bajraszewski

, T. Le, A. Stingl, and A.F. Fercher, Optics Express 12 (2004) 2156-2165.[8] http://www.solveit.hu/termekek/mycrona/Mycrona%20Altera%20Nano.pdf

Slide11

Thank you for your interest