PPT-Dynamic Frequency Scaling using on-chip Thermal Sensors in ASAP7 7nm Predictive PDK

Author : billiontins | Published Date : 2020-06-16

Vaibhav Verma Mandi Das Wole Jaiyeoba Motivation We wanted to build an onchip thermal sensing unit And we wanted to scale voltage and frequency of the processor

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Dynamic Frequency Scaling using on-chip Thermal Sensors in ASAP7 7nm Predictive PDK: Transcript

Vaibhav Verma Mandi Das Wole Jaiyeoba Motivation We wanted to build an onchip thermal sensing unit And we wanted to scale voltage and frequency of the processor based on thermal sensor data We will build a beautiful DVFS unit. J. . Leverett. A. Pratt. R. . Hochman. May 2013 – EE241 Final Project. Introduction to ‘Spikes’. Frequency Range. 10-500Hz. Duration. 3-5ms. Resolution. 8-bit. ‘Spikes,’. a. lso called ‘action potentials,’ are when the electrical potential of a neuron rises shortly. It is part of the communication protocol of the brain. . Madou. , UCI, Winter 2012. Class VI . Potentiometric. and . Amperometric. Sensors (II). Electrochemistry MAE-295. Table of content. Why miniaturization?. Scaling Laws:. Definitions. Micro-intuition. Process-Aware Voltage Scaling. Tuck-Boon Chan. ‡. and Andrew B. . Kahng. †. ‡. CSE. †. and ECE. ‡. Departments, UCSD. tbchan@ucsd.edu. , . abk@. cs.ucsd.edu. http://. vlsicad.ucsd.edu. 1. Megan Fuller and . Ezzeldin. . Hamed. 1. Transforms of Images. Original Image. Image Reconstructed from 25% of DFT coefficients. Magnitude of DFT of Image-128 (otherwise DC component = ~8e6). 2. The 2D Discrete Fourier Transform. Kibble-. Zurek. Michael Kolodrubetz. Boston University. In collaboration with: . B.K. Clark, D. . Huse. (Princeton). A. . Polkovnikov. , A. Katz (BU). Kibble-. Zurek. Scaling. Disordered. Ordered. Kibble-. for the MPP, HLL, LAL, LPNHE, Glasgow, Liverpool consortium . I. nterconnection . of FE-I4 modules with . SLID . technology and . Inter Chip . Vias. developed . at . Fraunhofer. EMFT . AIDA 3. Lachlan Andrew. Joint work with. Minghong. Lin,. . Caltech. Adam . Wierman. , . Caltech. Supported by ARC, NSF. speed. power. greener. faster. Systems must balance delay and energy use .  . Speed scaling. for the MPP, HLL, LAL, LPNHE, Glasgow, Liverpool consortium . I. nterconnection . of FE-I4 modules with . SLID . technology and . Inter Chip . Vias. developed . at . Fraunhofer. EMFT . AIDA 3. Madou. , UCI, . Winter . 2017. Class VI . Potentiometric. and . Amperometric. Sensors (II). Electrochemistry MAE-212. Table of content. Why miniaturization?. Scaling Laws:. Definitions. Micro-intuition. Zurek. . Scaling of . the Quantum . Ising. . Chain. Michael Kolodrubetz. Boston University. In collaboration with: . B.K. Clark, D. . Huse. (Princeton). A. . Polkovnikov. , A. Katz (BU). Outline. Part . Low-Power High-Performance Computing. Jie. Meng, Daniel . Rossell. , and . Ayse. K. . Coskun. Performance and Energy Aware Computing Lab (PEAC-Lab). Electrical and Computer Engineering Department. Boston University. Control in Buildings. Tony . Kelman. MPC Lab, Berkeley Mechanical Engineering. Email. : . kelman@berkeley.edu. TexPoint fonts used in EMF. . Read the TexPoint manual before you delete this box.: . A. 2 IntroductionBackground CESLESR Frequency for LICA 1.E+051.E+061.E+071.E+081.E+091.E+10Frequency (Hz)Phase (Degrees)High-Frequency Substrate 4 Low Inductance Chip Arrays X X X ViasVias In the standar 2IntroductionBackgroundCESLESRFrequencyfor LICA1E051E061E071E081E091E10Frequency HzPhase DegreesHigh-Frequency Substrate4Low Inductance Chip ArraysXXXViasViasIn the standard Multilayer capacitor the c

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