PPT-Learning-Based Approximation of Interconnect Delay and Slew

Author : briana-ranney | Published Date : 2016-07-14

Andrew B Kahng Seokhyeong Kang Hyein Lee Siddhartha Nath and Jyoti Wadhwani VLSI CAD LABORATORY UC San Diego 15 th ACMIEEE SystemLevel Interconnect Prediction

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Learning-Based Approximation of Interconnect Delay and Slew: Transcript

Andrew B Kahng Seokhyeong Kang Hyein Lee Siddhartha Nath and Jyoti Wadhwani VLSI CAD LABORATORY UC San Diego 15 th ACMIEEE SystemLevel Interconnect Prediction Workshop June 2 nd 2013. Prasad . Raghavendra. . Ning. Chen C. . . Thach. . Nguyen . . . Atri. . Rudra. . . Gyanit. Singh. University of Washington. Roee . Engelberg. Technion. University. . of Edit Distance. Robert Krauthgamer, . Weizmann Institute of Science. SPIRE 2013. TexPoint. fonts used in EMF. . Read the . TexPoint. manual before you delete this box. .: . A. A. A. A. A. A. A. 1. Tsvi. . Kopelowitz. Knapsack. Given: a set S of n objects with weights and values, and a weight bound:. w. 1. , w. 2. , …, w. n. , B (weights, weight bound).. v. 1. , v. 2. , …, v. n. (values - profit).. Sometimes we can handle NP problems with polynomial time algorithms which are guaranteed to return a solution within some specific bound of the optimal solution. within a constant . c. . of the optimal. Algorithms. and Networks 2015/2016. Hans L. . Bodlaender. Johan M. M. van Rooij. TexPoint fonts used in EMF. . Read the TexPoint manual before you delete this box.: . A. A. A. A. A. A. A. A. A. A. What to do if a problem is. DESIGN. - PROF. RAKESH K. JHA. . CORPORATE . INSTITUTE OF SCIENCE & TECHNOLOGY , BHOPAL. DEPARTMENT OF ELECTRONICS & COMMUNICATIONS . Chips are mostly made of wires called . interconnect.. Wires are as important as transistors. Peter Andras. School of Computing and Mathematics. Keele University. p.andras@keele.ac.uk. Overview. High-dimensional functions and low-dimensional manifolds. Manifold mapping. Function approximation over low-dimensional projections. . Requirements. Chen Zhao, Frank Yang. NetApp, Inc.. Storage Interconnect Requirements. Multi-destination RMA operation with reliable unconnected transport. 2. www.openfabrics.org. Storage Interconnect Requirements. Through Communication-Based Design. Veronica . Eyo. Sharvari. Joshi. System on chip. Overview . Transition from Ad hoc System On Chip design to Platform based design. Partitioning the communication design into layers using the “network on chip” approach. Problem. Yan Lu. 2011-04-26. Klaus Jansen SODA 2009. CPSC669 Term Project—Paper Reading. 1. Problem Definition. 2. Approximation Scheme. 2.1 Instances with similar capacities. 2.2 General cases . Outline. Seyi. . Ayorinde. Pooja. Paul . Chaudhury. FPGA. 2. Field Programmable Gate Array. Reconfigurable Circuit. Configurable Logic Blocks (CLBs). Calhoun et al.: Flexible Circuits and Architectures for Ultralow Power. Moonsu. Kim, . Eun. . yeung. Yu, . Eunbyeol. Kim . Samsung Electronics Co., Ltd. . System LSI Division. . Ayhan. . Mutlu. . Synopsys Co., Ltd. . . Motivation. Process & Design trends. Random variation is increasing in advanced process nodes . Grigory. . Yaroslavtsev. . Penn State + AT&T Labs - Research (intern). Joint work with . Berman (PSU). , . Bhattacharyya (MIT). , . Makarychev. (IBM). , . Raskhodnikova. (PSU). Directed. Spanner Problem. Exploring Complex Interconnect Topologies . for the Global Metal Layer. Oleg . Petelin. and Vaughn Betz. FPL 2016. Motivation – The Metal Stack. Poor wire RC scaling .  more complex metal stack.

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