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Dishing and Erosion Cause Yield Loss and Affect Device Dishing and Erosion Cause Yield Loss and Affect Device

Dishing and Erosion Cause Yield Loss and Affect Device - PDF document

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Uploaded On 2015-06-02

Dishing and Erosion Cause Yield Loss and Affect Device - PPT Presentation

Many factors including pattern geometry eg line density affect the removal rates and add to these surface anomalies The CMP process strives to achieve flat topography to improve yield Dishing and erosion are the two most costly surface anomalies tha ID: 78394

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