Frank Duvergne. 901D, LLC. Rel. 01. What makes US Navy Shipboard Enclosures so special?. Stringent Environmental requirements. Shock/Vibration. Temperature. Water Drip. EMI. Mission-specific requirements. ID: 690256
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Presentations text content in The Challenges of Electronic Enclosures for US Navy Ships
Slide1
The Challenges of Electronic Enclosures for US Navy Ships
Frank Duvergne901D, LLC
Rel
01
Slide2
What makes US Navy Shipboard Enclosures so special?
Stringent Environmental requirements
Shock/Vibration
Temperature
Water Drip
EMI
Mission-specific requirements
Equipment
I/O (Input/Output)
HMI (Human Machine Interface)
Slide3
Why not the same rack everywhere?
Ship-related requirements
Ship type
Available space
Cable entry
Foundation locations
Hatchability
Mission-related requirements
Equipment type, size and weight
Number/types of I/O
HMI requirements (display, keyboard)
Maintenance requirements
TEMPEST requirements
Slide4
minimize Cost/schedule impact of custom solution
Reliance on proven structural frame
Modular design
Same isolation system for different deck frequencies
Modular isolation system to accommodate wide range of payloads
Same basic mount dimensions and interface, different characteristics
Provisions for growth in number of isolators
Slide5
Examples of Modular Designs
Slide6
Different type of Electronics enclosures
Hard Mounted
Externally isolated, base mounted
Externally isolated, bulkhead mounted
Internally isolated
Consoles
Slide7
Methods of Construction
WeldedBolted
Formed metal
Machined/extrusion
Combination
Slide8
Rack structure is only part of the solution
Proper internal Equipment mounting is key to Shock/vibration mitigationEverything is in the brackets!
Slide9
MIL-DTL-901E
Replaces MIL-S-901D as of June 2017
Evolutionary rather than revolutionary
Introduces DSSM (Deck Simulating Shock Machine) as alternate shock vehicle for heavyweight shock test
Applies to new programs (e.g. FFG(X))
Slide10
The key challenge: Thermal Management
The challenges
Increase of electronics density
High max ambient temperature
COTS usually not rated for high temperature
Cannot cool to lower than max ambient temperature with forced-air cooling!
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DownloadNote - The PPT/PDF document "The Challenges of Electronic Enclosures ..." is the property of its rightful owner. Permission is granted to download and print the materials on this web site for personal, non-commercial use only, and to display it on your personal computer provided you do not modify the materials and that you retain all copyright notices contained in the materials. By downloading content from our website, you accept the terms of this agreement.
Presentations text content in The Challenges of Electronic Enclosures for US Navy Ships
The Challenges of Electronic Enclosures for US Navy Ships
Frank Duvergne901D, LLC
Rel
01
Slide2What makes US Navy Shipboard Enclosures so special?
Stringent Environmental requirements
Shock/Vibration
Temperature
Water Drip
EMI
Mission-specific requirements
Equipment
I/O (Input/Output)
HMI (Human Machine Interface)
Slide3Why not the same rack everywhere?
Ship-related requirements
Ship type
Available space
Cable entry
Foundation locations
Hatchability
Mission-related requirements
Equipment type, size and weight
Number/types of I/O
HMI requirements (display, keyboard)
Maintenance requirements
TEMPEST requirements
Slide4minimize Cost/schedule impact of custom solution
Reliance on proven structural frame
Modular design
Same isolation system for different deck frequencies
Modular isolation system to accommodate wide range of payloads
Same basic mount dimensions and interface, different characteristics
Provisions for growth in number of isolators
Slide5Examples of Modular Designs
Slide6Different type of Electronics enclosures
Hard Mounted
Externally isolated, base mounted
Externally isolated, bulkhead mounted
Internally isolated
Consoles
Slide7Methods of Construction
WeldedBolted
Formed metal
Machined/extrusion
Combination
Slide8Rack structure is only part of the solution
Proper internal Equipment mounting is key to Shock/vibration mitigationEverything is in the brackets!
Slide9MIL-DTL-901E
Replaces MIL-S-901D as of June 2017
Evolutionary rather than revolutionary
Introduces DSSM (Deck Simulating Shock Machine) as alternate shock vehicle for heavyweight shock test
Applies to new programs (e.g. FFG(X))
Slide10The key challenge: Thermal Management
The challenges
Increase of electronics density
High max ambient temperature
COTS usually not rated for high temperature
Cannot cool to lower than max ambient temperature with forced-air cooling!
Airborne noise due to fans
How to address them
Thermal simulation
Ducting
Control fan speed vs temp
Choice of equipment
Alternates to forced-air cooling: cold plate, air/water heat exchangers, Thermo-Electric Cooler (TEC).
Slide11The “Hosting Solution” approach
Provide an integrated solution, based on functional requirements from customer
Hosting solution includes
Shock isolated enclosure
Power supply and distribution: UPS, PDU, Wiring Harness
Cooling subsystem
HMI
I/O
Generic computing power
Mechanical and electrical interface for mission-specific equipment ( can be installed by customer or by supplier)
Advantage: single point of responsibility from design to delivery.