The Challenges of Electronic Enclosures for US Navy Ships PowerPoint Presentation

The Challenges of Electronic Enclosures for US Navy Ships PowerPoint Presentation

2018-10-20 2K 2 0 0

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Frank Duvergne. 901D, LLC. Rel. 01. What makes US Navy Shipboard Enclosures so special?. Stringent Environmental requirements. Shock/Vibration. Temperature. Water Drip. EMI. Mission-specific requirements. ID: 690256

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Slide1

The Challenges of Electronic Enclosures for US Navy Ships

Frank Duvergne901D, LLC

Rel

01

Slide2

What makes US Navy Shipboard Enclosures so special?

Stringent Environmental requirements

Shock/Vibration

Temperature

Water Drip

EMI

Mission-specific requirements

Equipment

I/O (Input/Output)

HMI (Human Machine Interface)

Slide3

Why not the same rack everywhere?

Ship-related requirements

Ship type

Available space

Cable entry

Foundation locations

Hatchability

Mission-related requirements

Equipment type, size and weight

Number/types of I/O

HMI requirements (display, keyboard)

Maintenance requirements

TEMPEST requirements

Slide4

minimize Cost/schedule impact of custom solution

Reliance on proven structural frame

Modular design

Same isolation system for different deck frequencies

Modular isolation system to accommodate wide range of payloads

Same basic mount dimensions and interface, different characteristics

Provisions for growth in number of isolators

Slide5

Examples of Modular Designs

Slide6

Different type of Electronics enclosures

Hard Mounted

Externally isolated, base mounted

Externally isolated, bulkhead mounted

Internally isolated

Consoles

Slide7

Methods of Construction

WeldedBolted

Formed metal

Machined/extrusion

Combination

Slide8

Rack structure is only part of the solution

Proper internal Equipment mounting is key to Shock/vibration mitigationEverything is in the brackets!

Slide9

MIL-DTL-901E

Replaces MIL-S-901D as of June 2017

Evolutionary rather than revolutionary

Introduces DSSM (Deck Simulating Shock Machine) as alternate shock vehicle for heavyweight shock test

Applies to new programs (e.g. FFG(X))

Slide10

The key challenge: Thermal Management

The challenges

Increase of electronics density

High max ambient temperature

COTS usually not rated for high temperature

Cannot cool to lower than max ambient temperature with forced-air cooling!

Airborne noise due to fans

How to address them

Thermal simulation

Ducting

Control fan speed vs temp

Choice of equipment

Alternates to forced-air cooling: cold plate, air/water heat exchangers, Thermo-Electric Cooler (TEC).

Slide11

The “Hosting Solution” approach

Provide an integrated solution, based on functional requirements from customer

Hosting solution includes

Shock isolated enclosure

Power supply and distribution: UPS, PDU, Wiring Harness

Cooling subsystem

HMI

I/O

Generic computing power

Mechanical and electrical interface for mission-specific equipment ( can be installed by customer or by supplier)

Advantage: single point of responsibility from design to delivery.


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