PPT-Innovative Control Systems for MEMS Inertial Sensors

Michael Kraft Reuben Wilcock Bader Almutairi Fang Chen Pejwaak Salimi Overview Background and Context Accelerometer Control Systems High Order Single Loop SDM MASH SDM Control System Genetic Algorithm Design. Always relative to inertial space Most common inertial sensors Accelerometers G yros brPage 4br Accelerometers By attaching a mass to a spring measuring its deflection we get a simple accelerometer Figure Gade 2004 brPage 5br Accelerometers conti By Dave Brennan. Advisors: Dr. Shannon . Timpe. , Dr. Prasad . Shastry. Introduction . Part 1) Quick MEMS introduction. Part 2) Capacitive Sensing. Part 3) Goal. MEMS background. Microelectrical mechanical systems (USA), Microsystems Technology (Europe), Micromachines, Japan…etc. Abstract:. MEMS . technology consists of microelectronic elements, actuators, sensors, and mechanical structures built onto a substrate, which is usually silicon. They are developed using microfabrication techniques: deposition, patterning, and etching. The most common forms of production for MEMS are bulk micromachining, surface micromachining, and HAR fabrication. By Dave Brennan. Advisors: Dr. Shannon . Timpe. , Dr. Prasad . Shastry. Introduction . Part 1) Quick MEMS introduction. Part 2) Capacitive Sensing. Part 3) Goal. MEMS background. Microelectrical mechanical systems (USA), Microsystems Technology (Europe), Micromachines, Japan…etc. by. Tim Stucchi . Sensera. Operations Manager. 2. MEMS?. . M. icro-. E. lectro-. M. echanical-. S. ystems. A technique of fabricating Electrical and Mechanical elements on a. chip with miniature dimensions. Power Packs. Introduction to Sensors. An occupancy sensor is a control device that detects occupancy and turns lighting (or other equipment) on or off automatically. . Occupancy . sensors continue to rank among the most popular component for lighting control solutions on the market today. . Nov 11, 2009. Seismic Instrumentation Technology Symposium. B. John Merchant. Technical Staff. Sandia National Laboratories. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company,. 2014 & 2015 Chair. IEEE . SF Bay Area MEMS and Sensors . Chapter. Ramesh . Ramadoss. , PhD. 2. 1/23/2016. Outline. Background. Running a chapter. 3. 1/23/2016. 1/23/2016. 4. IEEE SF Bay Area . MEMS & Sensors Chapter . MEMs Sensors. Hand-held Devices. Automotive Industry. Aerospace Industry. Medical Applications. Types Of Sensors. Inertial Sensors. Gyroscopes. Accelerometers. Compass Sensor. Pressure Sensor. Microphone. M. Weinberg, J. Bernstein, S. Cho, A. T. King, A. . Kourepenis. , P. . Ward, and J. . Sohn. , “A . micromachined. comb-drive . tuning fork . gyroscope for commercial applications,” in . Proc. . Sensor Expo. M. Weinberg, J. Bernstein, S. Cho, A. T. King, A. . Kourepenis. , P. . Ward, and J. . Sohn. , “A . micromachined. comb-drive . tuning fork . gyroscope for commercial applications,” in . Proc. . Sensor Expo. Brought to you by: Jack Link & Aaron Schiller. Date delivered on: Friday the third of May, 2013. ABSTRACT:. Taking a brief look at MicroElectroMechanical Systems (MEMS), we will guide you through the fabrication stages and show you some applications that they are used for. MEMS can be very simple and not move at all to being immensely complex systems with lots of moving elements being controlled by the system. Starting off with some simple facts we will then show the stages of their fabrication. The basic process of manufacturing MEMS starts with deposition of thin films onto their respective material layers. Then the material is patterned by one of many forms of lithography. The final step in creating MEMS is etching the pattern so that the final product will be the desired shape. MEMS can be created at a relatively low cost because they can be produced in high volumes because of bulk fabrication. MEMS are used for microvalves for controlling gas and liquid, switches, sensors, actuators, and much more!. 22 April 2015. Abstract. . Microelectromechanical Systems (MEMS) are devices that integrate mechanical systems with electronic circuits. Fabrication of MEMS involves the use of specialized micromachining technologies. Device packaging aims to protect from outside damage and varies drastically depending upon application. Different materials used, fabrication techniques, and packaging types will be examined.. 2 min Madness. L. Bouchra. . 1. , C. . Szopa. . 1. , A. . Buch. . 2. , P. . Cardinael. . 3. , V. . Pelon-Agasse. . 3. , D. . Coscia. . 1. , . J.-P. . Pineau. . 1. , V. . Guerini. . 1. , . T. .