PPT-Post-Silicon Fault

Localisation using MAXSAT amp Backbones Georg Weissenbacher Charlie Shucheng Zhu Sharad Malik Princeton University Photo Intel Press Kit Where did things go wrong Intel Pentium FDIV Bug 1994. Towards a standardised Taxonomy. Dr Samir Khan . Dr Paul Philips. Mr Chris Hockley. Prof Ian Jennions. 5. th. November 2012. Overview of the NFF problem. Cause and impact of NFF. Fig. 2 POST FRECKLE ETCH SEM Photograph X15K Etched layer - Al/Si/CuMicroelectronic Chemicals Technical Other Related Products Available ECE . 7502 Class Discussion . B. en Calhoun. Thursday January 22, 2015. Requirements. Specification. Architecture. Logic / Circuits. Physical Design. Fabrication. Manufacturing Test. Packaging Test. PCB Test. Localisation. using. MAX-SAT & Backbones. Georg Weissenbacher. Charlie . Shucheng. Zhu, . Sharad. . Malik. Princeton University. (Photo: Intel Press Kit). Where did things go wrong?. Intel Pentium FDIV Bug 1994. 1 Netlist Fault Collapsing Reduced Fault List Test Generation Fault Simulation abeeh 2 two faults h-sa0 and j-sa1 are structurally equivalent.This is because if we apply each of these faultsseparatel Daher . Kaiss, Jonathan Kalechstain. Formal Engines and . Technologies Team. Core CAD . Technologies. Intel Corp. . - Haifa. Agenda. Motivation. Speed path debug at Intel. Introducing our tool: NGSPA. Reviewer: . Shuo-Ren. , Lin. 2012/5/11. ALCom. 1. Abstract. Post-silicon functional validation challenges. Light overhead associated with the testing procedures. High-quality validation. Post-silicon functional exerciser. - Raise and Manage a Customer Fault. 28 . September 2016. Version . 1.1. This best practice guide provides key information that will assist you when raising and managing fault reports and enable Openreach to effectively resolve your customers issue.. Doowon Lee. *, Tom Kolan. †. , Arkadiy Morgenshtein. †. ,. Vitali Sokhin. †. , Ronny Morad. †. , Avi Ziv. †. , Valeria Bertacco*. * University of Michigan, . †. IBM Research − Haifa. example of processor die. Silicon wafer. www.guardian.co.uk. http://. mrsec.wisc.edu. en.wikipedia.org. Wafers are cut from . boules. , . which are large . logs . of uniform . silicon.. Looking at this picture, . where. do you think silicon . Silicon wafer. www.guardian.co.uk. http://. mrsec.wisc.edu. en.wikipedia.org. Wafers are cut from . boules. , . which are large . logs . of uniform . silicon.. Looking at this picture, . where. do you think silicon . 28 . September 2016. Version . 1.1. This best practice guide provides key information that will assist you when raising and managing fault reports and enable Openreach to effectively resolve your customers issue.. NXP Semiconductors. Presenter: Don O’Riordan, Cadence. Analog Fault Sensitivity Analysis (FSA) in SPECTRE. Agenda. Background. Approach. Results. Conclusion. Acknowledgements & References. 2. Background. Justius von Liebig. (1803-1873). Agronomist, chemist from Germany. He first suggested use silicon fertilizer (sodium silicate) in 1840. First greenhouse experiment was conducted on sugar beet.. . Prof. J. B. Lawes .