2Connect w5Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainIndustry Leaders belong to NEMI Industry Leaders belong to NEMI OEMEMS6Connect w7Connect with and ID: 866552
Download Pdf The PPT/PDF document "3Connect with and Strengthen Your Supply..." is the property of its rightful owner. Permission is granted to download and print the materials on this web site for personal, non-commercial use only, and to display it on your personal computer provided you do not modify the materials and that you retain all copyright notices contained in the materials. By downloading content from our website, you accept the terms of this agreement.
1 2Connect w 3Connect with and Strengthen
2Connect w 3Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainNEMI Mission Statement 5Connect wit
2 h and Strengthen Your Supply ChainConnec
h and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainIndustry Leaders belong to NEMI Industry Leaders belong to
3 NEMI ÃÃ OEM/EMS 6Connect w 7Connect w
NEMI ÃÃ OEM/EMS 6Connect w 7Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainIndustry Leaders
4 Industry Leaders 8Connect w NEMI Plann
Industry Leaders 8Connect w NEMI Planning MethodologyNEMI Manufacturing System PlanProduct Sector RequirementsGlobal Electronics Manufa
5 cturingRoadmapNEMI Gap Analysis 9Connect
cturingRoadmapNEMI Gap Analysis 9Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainNEMI Roadmap E
6 mulator ChaptersNEMI Roadmap Emulator Ch
mulator ChaptersNEMI Roadmap Emulator Chapters¥2004 Roadmap cycle will include 7 Product EmulatorChapters¥A product emulator is defined
7 as an abstractrepresentation of a produ
as an abstractrepresentation of a product to allow companies toshare needs without sharing proprietary productinformation¥Each chapter
8 sets OEM requirements over the next 10ye
sets OEM requirements over the next 10years¥Requirements are presented as key product attributesin spreadsheet format and supporting tex
9 t discussingbusiness and state of the ar
t discussingbusiness and state of the art issu 10Connect w 11Connect with and Strengthen Your Supply ChainConnect with and Strengthen You
10 r Supply ChainNEMI 2004 RoadmapsNEMI 200
r Supply ChainNEMI 2004 RoadmapsNEMI 2004 Roadmaps19 Individual Roadmap Chapters19 Individual Roadmap Chapters¥SemiconductorTechnology¥
11 Packaging¥Mass data storage¥Board As 1
Packaging¥Mass data storage¥Board As 12Connect w 13Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply
12 ChainRoadmap DevelopmentRoadm 14Connect
ChainRoadmap DevelopmentRoadm 14Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain2004 TWG Leade
13 rship2004 TWG LeadershipEric Simmon, NIS
rship2004 TWG LeadershipEric Simmon, NISTProduct Lifecycle InformationManagementJoe Johnson,MicrosoftMark Newton, DellEnvironmentally con
14 sciouselectronicsTom Roth and Dr. Cam La
sciouselectronicsTom Roth and Dr. Cam Labs¥Energy Storage &Conversion SystemsJohn MacWilliams, Consultant¥ConnectorsRoger F. Hoyt, Hita
15 chi GlobalTom Coughlin, Consultant¥Mass
chi GlobalTom Coughlin, Consultant¥Mass data storageDr. Norman Bardsley, USDCM. Robert Pinnel, USDC¥DisplaysDr. Laura Turbini, CMAPJohn
16 Stafford, Consultant¥OptoelectronicsJ.
Stafford, Consultant¥OptoelectronicsJ. Stevenson Kenney, GIT;John Barr, AgilentDr. V.J. Nair, Intel¥RF components &subsystemsDr. Josep
17 h Dougherty, PSUPhilip Lessner, KEMET El
h Dougherty, PSUPhilip Lessner, KEMET ElectronicsÂ¥Passive componentsTon Schless, MIDAS VisionHoward Imhoff, MetalorÂ¥Interconnect subs Ã
18 ceramicDieter Bergman, IPCJohn T. Fish
ceramicDieter Bergman, IPCJohn T. Fisher, NEMI¥Interconnect subs à organicBill Bottoms, 3MT Solutions Joe Adam, Skywo 16Connect with
19 and Strengthen Your Supply ChainConnect
and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainCellular Handset: Key Attribute NeedsCellular Handset: Key A
20 ttribute Needs Parameter Metric
ttribute Needs Parameter Metric 2003 2005 2007 2013 RF section cost (for a given function) Relative to cost
21 s in 2000 0.7 0.35 0.17
s in 2000 0.7 0.35 0.17 0.05 Number of freq bands 2 4 6 6 Number o f Antennas (Diversity)
22 1 2 2 3 Numbe
1 2 2 3 Number of Modulation formats 2 4 5 5 Data transmission rate (peak)? kb/s
23 14 160 1500 11,000
14 160 1500 11,000 Transmit Peak - to - Average Ratio (worst) dB 4 dB 5 dB 5 dB 4 dB Talk ti
24 me minutes 90 120 160
me minutes 90 120 160 200 Battery Voltage 17Connect with and Strengthen Your Supply ChainConnect with and Strengt
25 hen Your Supply ChainMember Collaboratio
hen Your Supply ChainMember Collaboration EffortsSoftwareSolutions Life Cycle SolutionsMaterialsComponentsCollaborativeDesignMaterials
26 TransformationSubstrates TIGProjects:Â¥H
TransformationSubstrates TIGProjects:¥High Frequency Materials Effects for HDI¥Integral Passives Testing¥Optical PWB Cost ModelingBoar
27 d Assembly TIGProjects:Â¥DPMOÂ¥Materials
d Assembly TIGProjects:¥DPMO¥Materials & Processes for High-Performance Products¥Substrate Surface Finishes for Lead-FreeProduct Life
28 Cycle 18Connect with and Strengthen You
Cycle 18Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainClosing Identified Technology Gaps: NE
29 MIClosing Identified Technology Gaps: NE
MIClosing Identified Technology Gaps: NEMIProjects To Eliminate Projects To Eliminate Pb Pb SolderSolderÂ¥Phase 1 Projects:Ã1998 Roadmap
30 identified need for lead free processes
identified need for lead free processesÃ1999 NEMI organized the Lead Free Assembly ProjectÃOver a three year span; recommended Sn3.9Ag
31 0.6Cu standardalloy for reflow and / or
0.6Cu standardalloy for reflow and / or Sn0.7Cu for wave solderà Followed with extensive testing to characterize the new materialsand de
32 monstrate reliabilityÃSince then severa
monstrate reliabilityÃSince then several other alloys have been proposed by others butmost commercialized alloys vary slightly from the
33 NEMI proposedrange.ÃTin-silver-copper f
NEMI proposedrange.ÃTin-silver-copper formulations with silver content between 3.5%and 4.1% and copper between 0.5% and 1.0% are virtual
34 lyindistinguishable in terms of melting
lyindistinguishable in terms of melting point (217C) and processfeatures.ÃThe NEMI alloy provides a model system for industry that is we
35 llcharacterized and in use by NEMI m 19C
llcharacterized and in use by NEMI m 19Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainClosing
36 Identified Technology Gaps: NEMIClosing
Identified Technology Gaps: NEMIClosing Identified Technology Gaps: NEMIProjects To Eliminate Projects To Eliminate Pb Pb SolderSolder¥H
37 istory of Pb-Free Projects Worldwide and
istory of Pb-Free Projects Worldwide and NEMIProject Structure¥Analysis of Sn-Ag-Cu Alloy Results 20Connect w 21Connect with and Strengt
38 hen Your Supply ChainConnect with and St
hen Your Supply ChainConnect with and Strengthen Your Supply Chain!! AT&T/ Lucent Technologies AT&T/ Lucent Technologies!! Ford Motor Com
39 pany (Ford) Ford Motor Company (Ford)!!
pany (Ford) Ford Motor Company (Ford)!! General Motors (GM) General Motors (GM) ÃÃHughes AircraftHughes Aircraft!! General Motors Gene
40 ral MotorsÃÃDelco ElectronicsDelco Ele
ral MotorsÃÃDelco ElectronicsDelco Electronics!! Hamilton Standard, Division of United Technologies Hamilton Standard, Division of Unit
41 ed Technologies!! National Institute of
ed Technologies!! National Institute of Standards and Technology (NIST) National Institute of Standards and Technology (NIST)!! Electroni
42 cs Manufacturing (EMPF)!! Rensselaer Po
cs Manufacturing (EMPF)!! Rensselaer Polytechnic Institute (RPI) 22Connect with and Strengthen Your Supply ChainConnect with and Streng
43 then Your Supply ChainNEMI Task Group St
then Your Supply ChainNEMI Task Group Structure: 1999-2002NEMI Task Group Structure: 1999-2002N 23Connect w ¥ChipPac¥Intel¥Motorola¥T
44 exas Instruments¥FCI 24Connect with an
exas Instruments¥FCI 24Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainDebate on Alloy Compos
45 itionDebate on Alloy Comp 25Connect w 26
itionDebate on Alloy Comp 25Connect w 26Connect w 27Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply
46 ChainMelting Behavior of Sn-Ag-Cu solder
ChainMelting Behavior of Sn-Ag-Cu soldersMelting Behavior of Sn-Ag-Cu soldersInside green lines - solidInside red line Ã% solid 28Connec
47 t with and Strengthen Your Supply ChainC
t with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainLead-free surface finishesüOrganic surface finishes
48 already a problem for Sn/PbsolderüHighe
already a problem for Sn/PbsolderüHigher reflow tem challenge; second side reflowSn-Ag-Cu solders with Sn/Pb balls 29Connect with and St
49 rengthen Your Supply ChainConnect with a
rengthen Your Supply ChainConnect with and Strengthen Your Supply ChainThrough-Hole LeadSolder FilletSeparation duringCoolingThrough-Hole
50 on BoardMorpholology Morpholology of Fi
on BoardMorpholology Morpholology of Fille 30Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainU
51 niversal Build Visual Inspection Results
niversal Build Visual Inspection Results:Universal Build Visual Inspection Results:CBGACBGAVisual Inspection Criteria must be changedVisu
52 al Inspection Criteria must be changedTi
al Inspection Criteria must be changedTin-lead paste/tin-lead CBGA(Shiny joint)Lead-free paste/ Tin-lead CBGA(Dull joint)Lead-free paste/
53 lead-free CBGA 31Connect with and Streng
lead-free CBGA 31Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain03242a15a5648 100 240
54 352PBGA 32Connect w 33Connect with and S
352PBGA 32Connect w 33Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainReliability flow chartR 3
55 4Connect with and Strengthen Your Supply
4Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain169CSP Lifetime Analyses: What are169CSP Lifet