PPT-Topic 9 Chemical Bonding and

Lewis Structures The OctetDuet Rule The chemical properties of atoms primarily depend on their valence configuration They seem to have a tendency to be noblegaslike meaning losing gaining or sharing electrons so that they end up being surrounded by the same number of valence electrons as noble gas atoms 8 except He which has 2. Chemical Butyl Acetate Chemical Butylated Hydroxytoluene Chemical Coal ar Chemical Cocamide DEALauramide DEA Chemical Diazolidinyl Urea Chemical Ethyl Acetate Chemical Formaldehyde Chemical P and . Electronegativity. Presented by . Leticia Bonita Prince. Newcastle University 4. th. Year . MChem. Student. Aims of Today. Increase your understanding of bonding and electronegativity. Increase your spatial skills and awareness using software designed by the CCDC. Introduction to Chemical Bonding. Introduction to Chemical Bonding. Objectives:. Define . chemical bond.. Explain why most atoms form chemical bonds.. Describe ionic and covalent bonding.. Explain why most chemical bonding is neither purely covalent nor purely ionic.. . Ionic (Atomic) Radii & Coordination Number (CN). Ionic radius: . Hypothetical radius (size) of an ion (. cation. or anion). Calculated values from the bonding distances. CN. Number of one kind of the bond forming ions (atoms) surrounding the other, which are forming the first direct bonding. Sami Vaehaenen. – CERN PH-ESE . LCD-WG4 Vertex detector technology meeting. 3-September-2010. 1. Outline. Introduction. Solder bump evolution. Elements & trends. Flip chip bonding. Introduction. Molecular Shapes. VSEPR Theory. From a correct Lewis structure, we can get to the 3-D shape using this theory.. VSEPR stands for . v. alence . s. hell . e. lectron . p. air . r. epulsion.. The theory is based on the idea that e- pairs want to get as far away from each other as possible!. Chemical bonding. Chemical Bonding. Diamond. Silicon dioxide. Graphite. Ionic Bond / metallic bond / covalent bond. Nature of the bond. Physical properties . Melting point / boiling point. Electrical conductivity. IB Topics 4 & 14. Text:. Ch 8 (all except sections 4,5 & 8). Ch 9.1 & 9.5. Ch 10.1-10.7. My Name is Bond. Chemical Bond. PART 5: Giant Covalent Structures, Metallic Bonding & Physical Properties. Electrons are transferred from an atom of low electronegativity to one of high electronegativity. Anion (-) and cation ( ) formed. Opposite charges attract – called an . electrostatic force. Formula Unit. A Unique Job Placement Tool. A business insurance policy that protects the employer in case of any loss of money or property due to employee dishonesty. What is the Federal Bonding Program?. What makes this program great?. Sami Vaehaenen. – CERN PH-ESE . LCD-WG4 Vertex detector technology meeting. 3-September-2010. 1. Outline. Introduction. Solder bump evolution. Elements & trends. Flip chip bonding. Introduction. SNC2D – Academic Science. Learning Goals. Use . Lewis dot diagrams to illustrate how a compound forms between a metal and a . non-metal.. Ions are formed when electrons are gained or lost. Where do electrons that are lost go?. Do . Now: Identify . Bond Type from Formula. Au. Ag. CO. 2. Li. 3. N. Na. 2. S. Mg. CsF. H. 2. O. NaCl. SO. 2. Cu. CH. 4. Covalent. Covalent. Covalent. Covalent. Ionic. Ionic. Ionic. Ionic. Metallic. Nature of coordinative bond. Back-bonding. Bonding of metals to . p. -systems. Valence bond and hybridization. Each bond treated independently from the environment. Resonance concept. Impossibility to explain molecular geometries.