PPT-Latency and Communication Challenges

in Automated Manufacturing Kira Barton Department of Mechanical Engineering University of Michigan November 3 rd 2016 Data flow in automated manufacturing Current Manufacturing Automation. at Continuous 1 ms Resolution. Weixin Wu, Yujie Dong, Adam Hoover. Dept. Electrical and Computer Engineering,. Clemson University. What is system latency. Delay from when an event is sensed to when the computer “does something” (actuates). Kulkarni. . Ameya.s. . JongHwa. Song. Ashvin. Goal (University of Toronto). Charles . Krasic. (University of British Columbia). Jonathan Walpole (Portland State University) . Presence of Reordering. Myungjin. Lee. , Sharon Goldberg,. Ramana. . Rao. . Kompella. , . George Varghese. Trend toward low-latency networks. Low latency: one of important . metrics in . designing a network. Eric Verdin, MD. Associate Director and Senior Investigator. HIV Latency: Establishment vs. Maintenance. HIV Latency at the Molecular Level. HIV Latency at the Molecular Level. HIV Latency at the Molecular Level. an update. November 2013. Norman Gee. Caveat. The spreadsheet calculation has never agreed with the measured numbers. Of course . Thilo’s. measurements are right and the spreadsheet is wrong. Need to understand the . Jayesh Krishna,. 1. Pavan Balaji,. 1. Ewing Lusk,. 1. . Rajeev Thakur,. 1. Fabian Tillier. 2. 1. Argonne National Laboratory, Argonne, IL, USA. 2. Microsoft Corporation, Redmond, WA, USA. 2. Windows and HPC. Shreya. The Problem. Machine learning requires real time, accurate, and robust predictions under heavy query load.. Most machine learning frameworks care about optimizing model training not deployment. at Continuous 1 ms Resolution. Weixin Wu, Yujie Dong, Adam Hoover. Dept. Electrical and Computer Engineering,. Clemson University. What is system latency. Delay from when an event is sensed to when the computer “does something” (actuates). Andrew Newall, Gabriel . Kliot. , . Ishai. . Menache. Aditya . Gopalan. , . Soramichi. Akiyama, Mark Silberstein. Presented by Yihan Li. 1. Outline. Introduction and background. Openstack. *. Yunhong Jiang . Yunhong.Jiang@intel.com. *Other names and brands may be claimed as the property of others.. Agenda. NFV and network . l. atency. Why network latency on NFV. How to achieve . 1. . Present by: Ying Zhang. 1. Meng, Na, et al. "Secure coding practices in java: Challenges and vulnerabilities." . 2018 IEEE/ACM 40th International Conference on Software Engineering (ICSE). . IEEE, 2018.. 2. Multi-Chip-Module (MCM). A single package that includes multiple dies (chips or . . chiplets. ) – 36 . chiplets. in this case – reduces design cost. The package substrate has inter-chip links that are better. 1. Tae Jun Ham (Princeton Univ.). Juan Luis Aragón (Univ. of Murcia). Margaret . Martonosi. (Princeton Univ.). Limited scratchpad memory . size. Accelerator Communication Challenge. 2. Best if data arrives at accelerator before computation needs it. Date:. 2024-. 10. -. 10. October 2024. Akira Kishida, NTT. Slide . 1. Authors:. Name. Affiliations. Address. Phone. e-mail. Akira Kishida. NTT. 1-1, Hikarinooka Yokosuka-Shi, Kanagawa 239-0847, Japan.