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Electroplated Ni/Au: Limiting Ni Diffusion Electroplated Ni/Au: Limiting Ni Diffusion

Electroplated Ni/Au: Limiting Ni Diffusion - PowerPoint Presentation

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Uploaded On 2016-06-18

Electroplated Ni/Au: Limiting Ni Diffusion - PPT Presentation

Jonathan Harris CMC Laboratories Inc Tempe Arizona Plating Sequence Etch Activation Ni Strike 5 µinch Ni Plate 100200 µinch Au Strike 5 µinch Au Plate 20100 µinch NiCl ID: 367366

plating diffusion grain surface diffusion plating surface grain grains cathode layer pulse rate limit nucleation plated small diffuse film boundary bath level

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