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On Effective TSV Repair for 3D-Stacked ICs On Effective TSV Repair for 3D-Stacked ICs

On Effective TSV Repair for 3D-Stacked ICs - PowerPoint Presentation

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Uploaded On 2017-06-08

On Effective TSV Repair for 3D-Stacked ICs - PPT Presentation

Li Jiang Qiang Xu and Bill Eklow CU hk RE liable C omputing Laboratory Department of Computer Science amp Engineering The Chinese University of Hong Kong ID: 557414

repair tsv redundancy signal tsv repair signal redundancy tsvs yield flow amp spare faults clustered constraint grid distribution poisson

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Presentation Transcript

Slide1

On Effective TSV Repair for 3D-Stacked ICs

Li Jiang

,

Qiang

Xu

and Bill

Eklow

§

CU

hk

RE

liable

C

omputing Laboratory

Department of Computer Science & Engineering

The Chinese University of Hong Kong

§

Cisco, CA,USSlide2

OutlineIntroduction

Motivation

TSV Redundancy Architecture

Routing Heuristic for Timing Consideration

Discussion & ConclusionSlide3

3D Product and To appear

3D stacked DRAM Package

PCB

TSV

DRAM

I/O Buffer

RD/

WR

CMOS Image Sensor

Interposer based 2.5D FPGA

Memory on Processor

More TSV

More Complicated

Requires manufacturing yield to be commercially viableSlide4

The Impact of 3D Stacking on Yield

Stack Yield

Loss

Misalignment

Impurity

Open

Short

Leak &

Delaminating

Void &

Break

Assembly Yield

Loss

Leveraged by

KGD

test and D2W stackingSlide5

Clustered TSV Defects

Assembly Yield

is dramatically affected by TSV clustered faults

Source: IMEC

Bond pad short

Unsuccessful fillSlide6

TSV Repair Schemes:

Neighboring Repair

1 Spare TSV

N TSV Chain

2 Spare TSVs

4 Signal TSVs

Redundancy

Ratio

Signal-Switching

Signal-Shifting

Source:

Kang

, SAMSUNG

Source: H.H-

S.Lee

,

GATech

M

Spare TSV rows

N

x

N TSV grid

Crossbar

Source:

Loi

,

U. BolognaSlide7

Motivation

Signal-Shifting

Signal-Switching

Random faults

Clustered

TSV faults

Due to

Surface Roughness,

Wafer bow, alignment error

Redundancy

Ratio: 1/2

Crossbar

To overcome: Repair faulty TSV from redundancy far apartSlide8

Motivation

Repair with TSV far-apart by topology mapping

High repairing flexibility

Router based TSV grid

Reduce the

cost of

spare

TSVs

Reduce the router complexity

Problem: TSV redundancy architecture and repair algorithmsSlide9

Router Based TSV Redundancy

Successively Signal Rerouting

TSV Grid and Signal Routing Infrastructure

Repair faulty TSV with nearest good TSV, and continue until a redundant TSV is used

M+N Spare TSVs

M X N TSV Grid

M+N

MxNSlide10

Switch Design

Direction of Rerouting

North to south, West to east (2 direction)

Bypassing signal

Allow multi-hop signal rerouting

More Complex Design for more

routabilitySlide11

Rerouting Scheme

Edge Disjoint Paths Problem

 Maximum Flow Method

Repair Channel

Repair PathSlide12

Problem Formulation

Maximum Flow Method with 1 edge capability

Find Repair Path in Flow Graph (edge disjoint)

Timing Constraint

 Length Constraint

Decision making in flow graph, affecting following solution

Transfer the problem by finding Repair Channel

Length Bonded Maximum Flow (NP-Hard) Slide13

HeuristicDiagonal Direction Grouping

Bounded

BFS

Search (Length Bound & Maximal Hops)

Maximal Hops

= 2Slide14

Experiment Setup

Shifting: 2:1

Switching: 4:2

Crossbar: 8:2

router: 4x4:8,8x8:16

Vary TSV Number

:

1000 ~ 10000 ~ 100000

Fault Injection:

Poisson Distribution

varying failure rate

Compound Poisson Distribution

varying cluster effect

Timing Constraint:

Assuming equal distances between neighboring TSVs

Length constraint: 3 – 1 times of the distance

ComparisonSlide15

Experimental Results

Compound Poisson Distribution with Fixed TSV Failure Rate as 0.5%

Alpha: Clustering Effect 0.4~3

1000 TSV

10000 TSVSlide16

Experimental Results

Compound Poisson Distribution with Fixed TSV Failure Rate as 0.5%

Alpha: Clustering Effect 0.4~3

100000 TSVSlide17

100000 TSV

Experimental Results

1000 TSVSlide18

Conclusion

Cost Effective and scalable Solution to effectively repair clustered TSV faults.

From the cost perspective:

Limited extra

Muxes

and wires

To achieve the same TSV yield, the required redundant TSVs with the proposed repair scheme is much less than existing solutionsSlide19

Thank you for your attention !