PPT-1 Aérgia: Exploiting Packet Latency Slack in On-Chip Networks

Reetuparna Das Onur Mutlu Thomas Moscibroda Chita Das Intel Labs PennState CMU Microsoft Research NetworkonChip NetworkonChip. Veronica . Eyo. Sharvari. Joshi. On-chip interconnect network/ . NoC. The layered-stack approach to the design of the on-chip . intercore. communications is called the Network-on-Chip (NOC) methodology. Natalie . Enright. . Jerger. Introduction. How to connect individual devices into a group of communicating devices?. A device can be:. Component within a chip. Component within a computer. Computer. End-to-end performance analysis of large-scale Internet services. Michael Chow. David . Meisner. , Jason . Flinn. , Daniel Peek, Thomas F. . Wenisch. Internet services are complex. Michael Chow. 2. Tasks. Kulkarni. . Ameya.s. . JongHwa. Song. Ashvin. Goal (University of Toronto). Charles . Krasic. (University of British Columbia). Jonathan Walpole (Portland State University) . Presence of Reordering. Myungjin. Lee. , Sharon Goldberg,. Ramana. . Rao. . Kompella. , . George Varghese. Trend toward low-latency networks. Low latency: one of important . metrics in . designing a network. Network Performance Measurement. Srinivas Narayana. MIT CSAIL. An example: High tail latencies. Delay completion of flows. (and applications). An example: High tail latencies. Where is the queue buildup?. George . Michelogiannakis. , Nan Jiang,. Daniel Becker, William J. Dally. Stanford University. MICRO 44, 3-7 December 2011, Porto . Allegre. , Brazil. Introduction. Performance sensitive to allocator performance. Reetuparna. Das. €. §. . Onur. Mutlu. †. . Thomas Moscibroda. ‡. . Chita Das. §. € . Intel Labs . §. PennState. . †. CMU . ‡. Microsoft Research. Network-on-Chip. Network-on-Chip. Reetuparna. Das. €. §. . Onur. Mutlu. †. . Thomas Moscibroda. ‡. . Chita Das. §. € . Intel Labs . §. PennState. . †. CMU . ‡. Microsoft Research. Network-on-Chip. Network-on-Chip. Ram Srivatsa Kannan. , Lavanya Subramanian, Ashwin Raju,. Jeongseob Ahn, Jason Mars, . Lingjia. Tang. Transformation of Cloud Services. Microservices. Hardware. Virtualization. OS. App. OS. App. Monolithic. 2. Multi-Chip-Module (MCM). A single package that includes multiple dies (chips or . . chiplets. ) – 36 . chiplets. in this case – reduces design cost. The package substrate has inter-chip links that are better. Reetuparna Das. §. . Onur Mutlu. †. Thomas Moscibroda. ‡. Chita Das. §. §. Pennsylvania State University . †. Carnegie Mellon University . ‡. Microsoft Research. The Problem: Packet Scheduling. Lecture . 33: . Interconnection Networks. Prof. Onur Mutlu. Carnegie Mellon University. Spring . 2015, . 4/. 27/2015. Logistics. Lab . 7 and Lab 8. Final Exam. Midterm II scores. Course grades so far. 1. An Introduction to Computer Networks, Peter L . Dordal. , Release 1.9.21. Chapter 1. An Overview of Networks. Local Area . Networks . (LANs), . are the “physical” networks that provide the connection between .