PPT-ROBTIC : On chip I-cache design for low power embedded syst

Varun Mathur Mingwei Liu 1 Icache and address tag Instruction cache has Large chip area High access frequencygtswitching power Example Direct mapped Icache 1024 entries gt1024 one way sets. Jamie Unger-Fink. John David Eriksen. Outline. Intro to LCDs. Power Issues. Energy Model. New Reduction Techniques. Results. Conclusion. LCD Intro. STN . vs. TFT. Large power consumer even in high-performance embedded systems. History and Trends In Embedded System Memory. Ideal Memory: Yesterday, Today And Tomorrow. 1980 – 1990: The Stand-Alone Chip. Three Main Types:. SRAM. DRAM. Flash EEPROMs. 1980-1990: The Stand-Alone Chip. Problems and Solutions.  . Frank Sill Torres. OptMA. lab. / ART. Universidade. Federal de Minas Gerais (UFMG), Brazil. I’m German . (from the . NorthEast. ). Master / PhD. in Electrical . Engenering. Multicores. Minshu. Zhao. Outline. Introduction. Review of Power management technique. Power management in . Multicore. Identify . Multicores. Characteristics. Apply power management technique. Future of . Mark Gebhart. 1,2 . Stephen W. Keckler. 1,2. Brucek Khailany. 2. Ronny Krashinsky. 2. . William J. Dally. 2,3. 1. The University of Texas at Austin . 2. NVIDIA . 3. Stanford University. Methodology. Week 1- Fall 2009. Dr. Kimberly E. Newman. University of Colorado. General Introduction. The scope of embedded system design platform has expanded from the traditional system of a programmed microprocessor or microcontroller to the use of “embedded cores and processors”, and reconfigurable devices as components of a digital system.  This growth in technology provides greater design flexibility, in that the system architect/designer can choose the mix of hardware and software components of a system, and have more control over the computing architecture and organization of the system. Low-Power High-Performance Computing. Jie. Meng, Daniel . Rossell. , and . Ayse. K. . Coskun. Performance and Energy Aware Computing Lab (PEAC-Lab). Electrical and Computer Engineering Department. Boston University. Memory Wall . The . growing disparity of speed between CPU and memory outside the CPU . chip. Bandwidth wall: limited . communication bandwidth beyond chip . boundaries. Solution . Memory hierarchy . Network Performance Measurement. Srinivas Narayana. MIT CSAIL. An example: High tail latencies. Delay completion of flows. (and applications). An example: High tail latencies. Where is the queue buildup?. Jaewoong Sim. . Jaekyu Lee . Moinuddin K. Qureshi Hyesoon Kim. Outline. Motivation. FLEXclusion. Design. Monitoring & Operation. Extension. Evaluations. Conclusion. Introduction. Today’s processors have multi-level cache hierarchies. Language-Directed Hardware Design for Network Performance Monitoring Srinivas Narayana, Anirudh Sivaraman , Vikram Nathan, Prateesh Goyal, Venkat Arun , Mohammad Alizadeh , Vimal Jeyakumar

One approach add sockets to your MOBOminimal changes to existing CPUspower delivery heat removal and I/O not too bad since each chip has own set of pins and coolingCPUCPUCPUCPUPictures found from goog Thesis Advisor . Dr. . Vishwani. D. . Agrawal. Committee Members . Dr. . Adit. D. Singh, Dr. Victor P. Nelson. June 28, 2013. Master’s Thesis Defense. Mustafa M. . Shihab. Motivation. On-Chip Power Distribution Network.