PPT-The Development of Tin Whiskers in Lead-free Solder

Joseph Garvey and Rachel Lindbergh CoPrincipal Investigators Gabriel Voigt Co Investigator Palmetto Scholars Academy North Charleston SC Tin Whiskers S mall crystalline structures. This is not ob vious at al l but will learn later that sin cos lim and lim So oth of these functions ha remo able discon tin uities at despite the fact that the fractions de64257ning them ha denominator of when 0 brPage 2br IT OpenCourseWare httpocw pp pt f ti y i t innin f t p m mnm tit it t t witin ti y i i y tin t y t tn f t It i t y t n n Bt t p tt n t Intntin p ttin it in t mi tpp pt f ti y A t A Bi ntn it in ti y i i t t y mpt w 90 C 130 At t i i tin it i ti tik n t n p mt t f t Accelerator Pedal Position Sensor . Caused by a Tin Whisker . and Discussion of Investigative Techniques Used for Whisker Detection. Henning Leidecker. NASA Goddard . henning.w.leidecker@nasa.gov. Lyudmyla Panashchenko. The Affect of tin whisker growth on a lead-free solder test bed. Experiment rationale. Tin . whiskers are a modern problem that can destroy any device with lead-free solder. . . They have destroyed planes and satellites, costing millions of lost dollars.. GRADE 9 PBL. WHAT IS IT??. A . tinsmith. is . a person who makes and repairs things made of . light-coloured. metal, particularly tinware. . - - Wiki. Tin punching – an art that uses scraps of tin to create decorations.. Chris Brightwell. Tin Whiskers. Background. Spontaneous growths of single crystal filaments from tin . platings. Whiskers on . SOIC . component. Lead Free. RoHS. – moving towards Lead Free. Pure tin has tendency to ‘whisker’. - UNIVERSITY OF PORTSMOUTH - . 17th February 2010. METALLURGY AND PCB SOLDERING TECHNOLOGY. By Luca MOLITERNI & Gianluca PARODI. Istituto Italiano Della Saldatura. GENOVA. Difference between . tin/lead. Accelerator Pedal Position Sensor . Caused by a Tin Whisker . and Discussion of Investigative Techniques Used for Whisker Detection. Henning Leidecker. NASA Goddard . henning.w.leidecker@nasa.gov. Lyudmyla Panashchenko. P. recision . s. oldering of 0603-sizes components w/lead-free solder. Lab 1. Lab 2. Labs 3 & 4 . 2. When you go into the Electronics lab and start to solder components onto a printed circuit board, you’ve really entered into a world of Chemisty. Solder is amazing. Billions of dollars and man-hours have gone into the engineering that has created the solder eco-system. If you have friends in the Materials Science department or the MechE department, you can tell them that you just went to lab and did Metallurgy and Heat Transfer. . Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a lower melting point than the workpiece. . soldering iron solder parts to solder soldered parts. P. recision . s. oldering of 0603-sizes components w/lead-free solder. Lab 1. Lab 2. Labs 3 & 4 . 2. When you go into the Electronics lab and start to solder components onto a printed circuit board, you’ve really entered into a world of Chemisty. Solder is amazing. Billions of dollars and man-hours have gone into the engineering that has created the solder eco-system. If you have friends in the Materials Science department or the MechE department, you can tell them that you just went to lab and did Metallurgy and Heat Transfer. . © 2014 Project Lead The Way, Inc.. Digital Electronics. Soldering & De-soldering. 2. This presentation will…. Review the tools needed to solder and de-solder electronic components.. Demonstrate how to . SERDP Tin Whisker Testing and Modeling: Whisker Geometric Risk Model Development Stephen McKeown *, Stephan Meschter*, Polina Snugovsky#, and Jeffery Kennedy# *BAE Systems Endicott, NY; # Celestica, Toronto, Ontario Canada Stephen . McKeown. *, Stephan Meschter*, Polina Snugovsky#, and Jeffery Kennedy#. *BAE Systems Endicott, NY; # Celestica, Toronto, Ontario Canada. stephen.a.mckeown@baesystems.com. Whisker group discussion Dec. 3, 2014.