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Power and Temperature Smruti Power and Temperature Smruti

Power and Temperature Smruti - PowerPoint Presentation

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Uploaded On 2023-09-06

Power and Temperature Smruti - PPT Presentation

R Sarangi IIT Delhi Why is powe r consumption important Scientific Reasons High Power High Temperature Low Reliability Sources of Power Consumption Types of Power Dissipation Dynamic power ID: 1015726

leakage power current gate power leakage gate current circuit drain temperature voltage energy dissipated vth dynamic charge powerpower oxide

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1. Power and TemperatureSmruti R. SarangiIIT Delhi

2. Why is power consumption important?

3. Scientific ReasonsHigh PowerHigh TemperatureLow Reliability

4. Sources of Power Consumption

5. Types of Power DissipationDynamic powerPower lost due to current flowing across resistors in the chip’s circuitLeakage powerPower that is lost in transistors when they are in the off stateShort circuit powerPower lost when both the PMOS and NMOS transistors are on (during a logic transition)

6. Dynamic Power

7. Dynamic PowerAny electronic circuit can be decomposed (at any point in time), to an equivalent circuit with resistances, capacitances, current and voltage sourcesEquivalent Circuit of an NMOS transistorgatesourcebodydrain        +-+-  

8. Consider a simple caseWhile chargingEnergy dissipated in the resistance: Energy stored in the capacitor: While dischargingEnergy dissipated by the resistance:  VRCRCChargingDischargingTotal energy dissipated in one charge-discharge cycle:  

9. Dynamic Power AnalysisWhat do we know up till now:For a simple circuit with a R and a C, the dynamic energy dissipation for a single charge-discharge cycle is: CV2What about for a larger circuit: Let us assume that in a given charge-discharge cycle: units 1 ... n are activeEnergy dissipated: = In general for a unit, if a fraction α (in terms of energy) is active at a given point of time, we can say that the energy dissipated is: α 

10. Energy vs PowerPower = Energy per unit timeFor a given clock cycle Let C refer to a lumped capacitance is the activity factor (varies from 0 to 1)V is the supply voltagef is the frequency 

11. Are V and f related? Let us look at some textbook results. Alpha Power Law For older processes (late nineties) (V >> Vth) and (α = 2)Thus, we could say: , this will make  Olden DaysNowadaysV is 2-3 times Vth , and α is between 1.1 and 1.3Thus, this statement would be more correct:  

12. Voltage-Frequency ScalingWhat happens if we increase the voltageWe can also increase the frequencyThe power will also increase significantlyWe already know the relation between V and fQuad-core AMD Opteron scaling levels: VoltageFrequency1.25 V2.6 GHz1.15 V1.9 GHz 1.05 V1.4 GHz0.9 V0.8 GHz

13. Leakage Power

14. Leakage Power: Sources of Leakage Currentnngatedrainsourcebulk1. subthreshold current2. Drain induced barrier lowering3. Gate oxide tunneling4. GIDL

15. Leakage Power: Sources of Leakage Currentnngatedrainsourcebulk5. p-n junction current6. hot carrier injection

16. Description of the MechanismsSub-threshold leakageWhen a transistor is turned off, there should be no current flowing between the source and drain This is the ideal case, and life is never idealLittle bit of leakage is there even in the off stateinputoutputsmall amount of current flow even if the transistor is off

17. DIBL and Gate TunnelingDIBL (drain induced barrier lower)As the drain voltage increases, the threshold voltage decreases (Vth)Lower the Vth, more is the leakageThe current flows between the drain-to-source terminalsThin-oxide Gate TunelingThe gate oxide is very thin (<2 nm)Since the oxide layer is so thin, current tunnels from the gate to the body of the transistorNMOS leakage is much more than PMOS leakage (3-10X more)

18. Other Mechanisms Gate-Induced Drain Leakage (GIDL)Current flows from the drain terminal into the body of the transistorCan happen when the gate voltage is high (in NMOS)A high gate voltage increases the charge concentration in the areas near the gate.P-N Junction LeakageCurrent flowing between the source-and-body and drain-and-bodyHot Carrier InjectionHot carriers are fast electrons that get trapped in the gate oxideThis causes a shift in the threshold voltage, VthAffects leakage current

19. Some EquationsMost commonly used equation for leakage current (mainly sub-threshold leakage)vT  kT/q (k  Boltzmann’s constant, q  Coulomb’s constant, T  Temperature)Vth has a temperature dependenceTypically reduces by 2.5 mV for every degree C rise in temperatureConclusion: Leakage power is superlinearly dependent on temperature

20. Short Circuit Power

21. Consider a CMOS InverterWhen the input is 0: T1 is off, and T1 is onWhen the input is 1: T1 is on, and T2 is offDuring the transition: For a brief period, both are onT2T1

22. Ballpark FiguresDynamic Power40-60%Short Circuit Power5-10 %Leakage Power20-40 %

23. Temperature

24. Power and TemperatureMethods of heat transferConductionHeat transferred between two objects when they are in contactConvectionHeat transferred between an object and a flowing fluidRadiation (Not relevant)Rate of change of temperature (u) is proportional to the second derivative of temperature over space

25. Chip’s PackageThe spreader helps to avoid temperature hot spotsThe fan blows air over the heat sinkPCBSilicon dieHeat sinkHeat spreaderThermal interface materialFan

26. source: www.alamy.com

27.

28. Some MathsT= APLet us divide the surface of the die into a M * M gridLet N = M2 Let the vector P be a N*1 vector.P[i] is the power dissipated at the ith grid pointSimilarly, let T be a N*1 vector for temperatureLet A be a N*N matrix that linearly relates power and temperatureAs simple as that ....

29. Leakage Temperature Feedback LoopNeeds several iterations to convergeDynamic + Short Circuit PowerLeakage PowerTotal PowerTemperature

30.