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ECAL plan for construction ECAL plan for construction

ECAL plan for construction - PowerPoint Presentation

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Uploaded On 2020-08-06

ECAL plan for construction - PPT Presentation

PEBS meeting on 10 th of January 2011 EPFL Lausanne Tatsuya NAKADA Boundary conditions Funding from the ESA PRODEX programme through Swiss space office partnership with industry already during the RampD phase ID: 800554

scintillator thickness layers superlayer thickness scintillator superlayer layers bar converter channels industry unit 873 area active separation design chip

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Slide1

ECAL plan for constructionPEBS meeting on 10th of January 2011EPFL, Lausanne

Tatsuya NAKADA

Slide2

Boundary conditionsFunding from the ESA PRODEX programme through Swiss space officepartnership with industry, already during the R&D phase

50% or more funding has to go directly to industry

Following steps needed

Specification usConceptual design mainly by usEngineering design by industry with our inputCall for tender by PRODEXConstruction mainly by industryAssembly us or industryTesting us

Proposal

submission

to

PRODEX

Slide3

For RPODEX submissionContact with three companiesAPCO can do only mechanicsRUAG can do both mechanics and electronicsALMATEC more like an engineering office

Plan to discuss with RUAG and ALMATEC to converge to a technical design, starting with mechanics first

Specification needs to be finalised soon

PRODEX submission in Spring 2011

Slide4

SpecificationCurrent specification:Active area = 873 × 873 mm2Converter 3mm thick Ti

Scintillator bar = 7.75 × 873 × 3 mm

3

108 bars/layer3 layers/superlayer and 7 (x-y-…) superlayersTotal thickness = (3+3) × 21 =126 mm and 17.3 X0Weight = 120 kg/superlayer, total of 840 kgReadout unit = 12 bars × 3 layers = 36 channelsTotal number of channel = 2268

Slide5

SpecificationSpecification is driven by Active area ← acceptance match to the restTotal thickness ← required energy reach

i.e. energy measurement up to multi TeV needed

+ payload limitation

Converter thickness, scintillator bar width ← e-p separation i.e. ~104 + total number of channels limited by the powerReadout unit depends on the FE-chip, i.e. 32 or 36 channels Superlayer configuration ← readout unit configuration + weight portable by two people

Slide6

SpecificationSpecification is driven by Active area basically fixed: ~90×90 cm2Total thickness basically fixed

to >~15

X

0?Converter thickness: could still be optimized?Scintillator bar width: could still be optimized?FE-chip: if VATA Chip, 32 channels → Superlayer = 2 or 4 layers unless lose some channels, if the converter thickness >~ 3 mm, 4 layers too heavy unless splitSome

more simulation studies planned: e-p separation vs converter thickness by the end of Januarye-p separation vs scintillator bar width by the middle of February