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Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performanc Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performanc

Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performanc - PDF document

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Uploaded On 2015-08-25

Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performanc - PPT Presentation

2 Experimental Measurements This study reports measurements made with FCmBGA and FCLBGA packages as a function of heat sink size Both styles of packages have a 45mm body size with an 18mm die Ex ID: 115248

Experimental Measurements This study

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